Thursday, May 28, 2009

Job offer in Compact Modelling - 28 May 2009

I post here a job offer from LinkedIn, I think it may be of interest for many of you, dearest readers.... Please remember that we only copy here the offer, and that we are not related in any way to those offering the position!!
In case you are interested, kindly pass your CV immediately to /

Senior Manager/Manager -Analog-RF,AMS–Malaysia
Exp-PhD / Master with 10+ , candidate should be solid in Analog,RF characterization, SPICE & compact modeling for high voltage MOS, BJT, BCD devices

Placement location –Malaysia
Position -- very urgent and need to be filled ASAP.
Interview - 2weeks altogether.
Package – Will be the best in the semiconductor industry
Type -Full time and permanent with our client..

Malaysia Responsibilities:
• Lead a team of engineers to provide Integrated Circuit Design Technology solutions.
• Supervise test-chip design for "Client" technology characterization, SPICE model generation
for RF, Analog and mixed signal active and passive devices, and development of process design
kit (PDK) for "Client" technologies.
• Review, update, and manage electrical design rule (EDR) specifications for all "Client"
technologies – accuracy and availability of up-to-date revision.
• Interface with "Client" technology development (TD), customer engineering (CE), and Fab
engineering departments to support technology development, customer support, and
manufacturing, respectively.
• Interact with marketing group to provide modeling solutions to "Client" customers.
• Follow and comply with the procedures and by-laws of "Client" Environmental Management
System (EMS).
• Review all environmental objectives, targets, and plans and ensure their implementation in
accordance to the requirements set by "Client" EMS.
• 10+ years of experience in managing integrated circuit Design Technology including design rule
generation, device characterization and compact modeling and industry best practices.
• Extensive knowledge of compact modeling for Analog/RF and mixed-signal technologies
including high voltage MOS, BJT, BCD devices for circuit simulation.
• Extensive knowledge of integrated passive and active components characterization and modeling.
• Good verbal/written communication skills and proven ability to work in and lead cross functional
• Proven leadership and management skills in high technology industry.
• M.S. or PhD in Electrical Engineering, Physics, or related technical fields with > 10 years relevant
experience in logic, Analog/RF, and mixed-signal device & interconnect modeling as well as CAD
to support customer design.
• Working experience in TCAD device design is added advantage

1 comment:

Rodrigo Picos said...

By the way, you can also see "another" job offer in: