Die shots of the Raspberry Pi #RP2040 #chip #Teardown #Dieshot #ReverseEngineering #PiDay #semi @johndmcmaster @Raspberry_Pi https://t.co/3B7OuJRpBH https://t.co/ghjLWICnno

Die shots of the Raspberry Pi #RP2040 #chip #Teardown #Dieshot #ReverseEngineering #PiDay #semi @johndmcmaster @Raspberry_Pi https://t.co/3B7OuJRpBH pic.twitter.com/ghjLWICnno

— Wladek Grabinski (@wladek60) January 29, 2021

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from Twitter https://twitter.com/wladek60

January 29, 2021 at 08:19PM
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[mos-ak] 1st Asia/South Pacific MOS-AK Workshop

Arbeitskreis Modellierung von Systemen und Parameterextraktion

Modeling of Systems and Parameter Extraction Working Group

1st Asia/South Pacific MOS-AK Workshop

(virtual/online) FEB. 25-26, 2021

Together with  local organization team, International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have the pleasure to invite to 1st Asia/South Pacific MOS-AK Workshop which will be organized as the virtual/online event on FEB. 25-26, 2021

Planned virtual 1st Asia/South Pacific MOS-AK Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors. 

Venue: Virtual/Online

Online Workshop Registration to be open FEB.15 2021 

(any related enquiries can be sent to register@mos-ak.org)

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:

• Compact Modeling (CM) of the electron devices
• Advances in semiconductor technologies and processing
• Verilog-A language for CM standardization
• New CM techniques and extraction software
• Open Source (FOSS) TCAD/EDA modeling and simulation
• CM of passive, active, sensors and actuators
• Emerging Devices, TFT, CMOS and SOI-based memory cells
• Microwave, RF device modeling, high voltage device modeling
• Nanoscale CMOS, BiCMOS, SiGe, GaN, InP devices and circuits
• Technology R&D, DFY, DFT and reliability/ageing IC designs
• Foundry/Fabless Interface Strategies

Important Dates: 

• 2nd Announcement: Jan. 2021
  
• Final Workshop Program: Feb. 2020
  
• Virtual MOS-AK Workshop:  FEB. 25-26, 2021
  

Online Abstract Submission to be open FEB.1 2021

(any related enquiries can be sent to abstracts@mos-ak.org)

Extended MOS-AK Committee

WG250121

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The big question: Will #Intel become Outtel? https://t.co/Nt0fkMv8K2 #semi https://t.co/hxtbZEyRai

The big question: Will #Intel become Outtel? https://t.co/Nt0fkMv8K2 #semi pic.twitter.com/hxtbZEyRai

— Wladek Grabinski (@wladek60) January 22, 2021

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from Twitter https://twitter.com/wladek60

January 22, 2021 at 03:06PM
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The Knowledge Transfer Network (#KTN) and UK Space Agency (#UKSA) have mapped out a Space Sector Landscape for the UK. https://t.co/hq1sLEd5e6 #semi https://t.co/xKBmW0cxBG

The Knowledge Transfer Network (#KTN) and UK Space Agency (#UKSA) have mapped out a Space Sector Landscape for the UK. https://t.co/hq1sLEd5e6 #semi pic.twitter.com/xKBmW0cxBG

— Wladek Grabinski (@wladek60) January 22, 2021

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from Twitter https://twitter.com/wladek60

January 22, 2021 at 10:21AM
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Joint Spring MOS-AK, SB-MOS and IEEE EDS MQ

Joint Spring MOS-AK Workshop and Symposium on Schottky Barrier MOS (SB-MOS) Devices

with IEEE EDS Mini-Colloquium on “Non-Conventional Devices and Technologies”

September 29 to October 1, 2020

THM Giessen (Germany)

—by Mike Schwarz— The Joint Spring MOS-AK Workshop and Symposium on Schottky Barrier MOS (SB-MOS) devices with IEEE EDS Mini-Colloquium on “Non-conventional Devices and Technologies” was held from September 29 to October 1, 2020. While it was initially planned for spring at THM—University of Applied Sciences in Giessen (Germany), it was shifted to the early autumn due to the COVID-19 pandemic. However, finally the local organizers of NanoP Competence Center for Nanotechnology and Photonics of THM decided to move it to Zoom and perform it virtually. It was sponsored by THM, the EDS Germany Chapter, the IEEE Young Professionals Germany Affinity Group, and the AdMOS company. The event was attended by 69 IEEE members and 115 non IEEE members (guests) from 25 countries during the three days [read more...]