Dec 22, 2020

[Highlights] 2020 IEEE IEDM


The IEEE International Electron Devices Meeting (IEDM), which this year was organized online (December 12-18, 2020), is a key forum for reporting developments in semiconductor and electronic device technology. 
Nature Electronics Research Highlights
 
Gate-all-around transistors stack up
by Stuart Thomas; Nature Electronics 

Gallium nitride gets wrapped up
by Stuart Thomas; Nature Electronics 

Vacuum transistors with high-power operation
Matthew Parker; Nature Electronics 

Beam scanning on a single chip
Matthew Parker; Nature Electronics 

FinFETs for cryptography
Christiana Varnava; Nature Electronics 

Electronics in an organic package
Christiana Varnava; Nature Electronics 

[mos-ak] [online publications] Virtual International MOS-AK Workshop, Silicon Valley, Dec. 10-11, 2020


Local organization THM Team together with the International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee have organized two days virtual/online event:
  • 13th International MOS-AK Workshop,  Silicon Valley, Dec. 10-11, 2020
    • virtual session 11:00 - 14:00 (PST) on Dec.10, 2020
    • virtual session 11:00 - 14:00 (PST) on Dec.11, 2020
Online Publications:
There are MOS-AK technical presentations covering selected aspects of the compact/SPICE modeling and its Verilog-A standardization (see all the slide presentations online at corresponding link).

Postworkshop Publications:
Selected, best MOS-AK technical presentation will be recommended for further publication in a special Solid State Electronics issue on compact modeling planned for the next 2021 year.

The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and courses around the globe thru the next 2021 year, including:
  • 1st MOS-AK Asia/South Pacific, (online) end Feb.2021
  • 3rd MOS-AK/India Conference, Hyderabad (IN) Rescheduled 2021
  • MOS-AK at LAEDC (MX), April 18-20 2021
  • FOSS TCAD/EDA at 5NANO2021, Kottayam (IN) April, 2021
  • 5th Sino MOS-AK Xi'an (CN),  Rescheduled 2021
  • WCM at the Nanotech, Washington DC (US), Rescheduled 2021
  • IRPhE, mmW and THz Conf. Aghveran (AM) Rescheduled 2021
  • 19th MOS-AK at ESSDERC/ESSCIRC, Grenoble (F) Sept. 2021
  • 14th US MOS-AK Workshop, Silicon Valley (US) Dec. 2021
    in timeframe of IEDM and Q4 CMC Meetings
W.Grabinski on the behalf of International MOS-AK Committee 
WG221220

[paper] Radiation testing of a 6-axis MEMS inertial navigation unit

Radiation testing of a commercial 6-axis MEMS inertial navigation unit at ENEA Frascati proton linear accelerator
G. Bazzanoa,b, A. Ampollinia, F. Cardellia, F. Fortinia, P. Nenzia, G.B. Palmerinib, L. Picardia
L. Piersantia, C. Ronsivallea, V. Surrentia, E. Trincaa, M. Vadruccia, M. Sabatinic
Advances in Space Research (2020)
DOI: 10.1016/j.asr.2020.11.031
aENEA, Via Enrico Fermi 45, Frascati, Italy
bScuola di Ingegneria Aerospaziale, La Sapienza Università di Roma, Italy
cDipartimento di Ingegneria Astronautica, Elettrica ed Energetica, La Sapienza Università di Roma, Italy 

Abstract: We present the first results of a novel collaboration activity between ENEA Frascati Particle Accelerator Laboratory and University La Sapienza Guidance and Navigation Laboratory in the field of Radiation Hardness Assurance (RHA) for space applications. The aim of this research is twofold: (a) demonstrating the possibility to use the TOP-IMPLART proton accelerator for radiation hardness assurance testing, developing ad hoc dosimetric and operational procedures for RHA irradiations; (b) investigating system level radiation testing strategies for Commercial Off The Shelf (COTS) components of interest for SmallSats space missions, with focus on devices and sensors of interest for guidance, navigation and control, through simultaneous exploration of Total Ionizing Dose (TID), Displacement Damage (DD) dose and Single-Event Effects (SEE) with proton beams. A commercial 6-axis integrated Micro Electro-Mechanical Systems (MEMS) inertial navigation system (accelerometer, gyroscope) was selected as first Device Under Test (DUT). The results of experimental tests aimed to define an operational procedure and the characterization of radiation effects on the component are reported, highlighting the consequence of the device performance degradation in terms of the overall navigation system accuracy. Doses up to 50 krad(Si) were probed and cross sections for Single-Event Functional Interrupt (SEFI) evaluated at a proton energy of 30 MeV. 
Fig: Polyedric support for MEMS accelerometer characterization






Dec 21, 2020

[paper] Cross Domain Modeling of a Meander Beam MEMS Accelerometer

Mahdieh Shojaei Baghini*

*Department of Mechanical, Maritime and Materials Engineering, Delft University of Technology, Delft, Netherlands

Abstract: This paper presents the design of a bulk Silicon MEMS single-axis 8-beam accelerometer utilizing meander beams in the Structural Mechanics and MEMS Module of COMSOL Multiphysics®. To obtain further insights into the design of the accelerometer, an electrical lumped element model of the structure is derived and represented in SPICE. Quantities such as eigenfrequencies and proofmass displacement have been extracted from COMSOL Multiphysics® as well as analytical studies. The effects of parasitic frequencies in the structure are observed by automatic tilting of the accelerometer at higher order eigenfrequencies due to finite off-axis stiffness coefficients. In order to mathematically quantify the response of the accelerometer arising due to parasitic frequencies, the transient damping response has been derived in COMSOL Multiphysics® as well as SPICE, and the differences are highlighted. Finally, the eigenfrequencies of the meanderbeam accelerometer have been compared with that of a simple-beam accelerometer and the validity of small deflection theory is tested for the lumped model approach. While the target damping factor of the accelerometer was 0.7, the obtained damping factor increased to 1.1 due to the aforementioned parasitic frequencies and reduction in the resonance frequency of the sensor. This effect was precisely captured during the COMSOL Multiphysics® simulation.
Fig: The designated sensor is damped using plates placed at a distance equal to h0; its a) electrical circuit equivalent of squeeze-film damped accelerometer; b) electrical circuit considering symmetric damping; c) simplified equivalent circuit for gap height derivation.


Dec 15, 2020

[VIRTUAL] EDS MQ on Compact Modeling

VIRTUAL MINI-COLLOQUIUM ON COMPACT MODELING


IEEE EDS Compact Modeling Technical Committee
EDS Spain Chapter
Department of Electronic, Electrical and Automatic Control Engineering, 
University Rovira I Virgili, Tarragona (Spain)

December 17, 2020
EDS MQ Program (times in CET)
10:20-10:30
Benjamin Iñiguez, IEEE EDS MQ Chair
Department of Electronic, Electrical and Automatic Control Engineering, University Rovira I Virgili, Tarragona (Spain)
Opening session
10:30-11:15
Yogesh. S Chauhan
Department of Electrical Engineering,
Indian Institute of Technology Kanpur (India)
BSIM-BULK and BSIM-HV: Industry Standard SPICE Models for Analog, RFand High Voltage Applications
11:15-12:00
Manoj Saxena
Department of Electronics, University of Delhi  (India)
“Modeling and Simulation of Robust Ultrasensitive Tunnel Field Effect Transistor Design for Biosensing Applications”
12·00-12:45
Wladek Grabinski
GMC, Commugny (Switzerland)
FOSS TCAD/EDA Tools for Semiconductor Device Modeling
12:45-13:30
Arokia Nathan
Darwin College, University of Cambridge (UK)
“Physics-Based Parameter Extraction for TFTs”
13:30-15:00 Break
15:00-15:45
Marcelo Pavanello
Department of Electrical Engineering,
Centro Universitario FEI, Sao Bernardo do Campo (Brazil)
"Quantum Effects on the Mobility of SOI Nanowire MOSFETs Induced by the Active Substrate Bias"
15:45-16:30
Michael S. Shur
Department of Electrical, Systems and Computer Engineering,
Rensselaer Polytechnic Institute, Troy NY (USA)
THz Compact SPICE/ADS model
16:30-17:15
Edmundo Gutiérrez
Department of Electronics, INAOE, Puebla (Mexico)
"RF MOSFET degradation modeling up to 67 GHz”
End of EDS MQ