Sep 22, 2009

Technology Roadmap for 22nm and Beyond



Reference:
[1] Iwai, H.; Technology roadmap for 22nm and beyond; IEDST '09; 1-2 June 2009

CMC Timeline for Multigate Compact Model Standardization

The CMC Subcommittee on Multigate Models has published timeline for multigate compact model standardization assuming resolution by 2Q11. Proposal: model freeze date would be after model evaluation
  • Would be justified by concurrent model and technology development
  • Model developers would have the ability to model changes during mod elevaluation
  • Must be done with subcommittee agreement (reasonableness check)
  • No additional time allowed in model evaluation
  • Code frozen at end of model evaluation
Read more...

Sep 14, 2009

7th IWCM Taipei, Taiwan

Call for Papers:
7th International Workshop on Compact Modeling January 18 (Mon), 2010 Taipei International Convention Center, Taipei, Taiwan

Scope:
The workshop provides an opportunity for the discussion and the presentation of advances in modeling and simulation of integrated circuits.

Topics:
  • Compact modeling for all kinds of devices
  • Parameter extraction methodology and strategy
  • Circuit simulation techniques
Abstract Submission:
Authors should submit a camera-ready abstract with 2 to 10 pages including figures for inclusion in the Workshop Proceedings, and send the electronic file in PDF or MS-Word format to yuzhip@tsinghua.edu.cn. Paper templates in Tex and Word formats are downloadable from the ASP-DAC 2010 site. Deadline for the submission is November 30th, 2009.

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TAL 2009

XII Scientific Conference and II School: "Optical Fibres and Their Applications" TAL 2009 October 14 - 17, Lublin and Krasnobród. The aim of the conference is enabling a direct contact and discussion between the teams dealing with:
  • Development of technology and fabrication of optical fibres, cables, planar waveguides and elements of integrated optics and micro-optics
  • Elements of optical fibres technique like couplers, connectors, optical fibres amplifiers, optical and optoelectronic devices for connecting optical fibres with light sources and detectors, multiplexers
  • Optical fibres applications especially those requiring a close cooperation with the optical fibres and optical cables, elements of optical fibres technique and optoelectronics manufactures
  • Education in the photonics in the universities and high schools
Read more...

MOS-AK/GSA Workshop in Athens with special guest Larry Nagel

--- MOS-AK/GSA Workshop in Athens with special guest Larry Nagel
--- Friday, Sept. 18 2009 at Divani Caravel Hotel
--- (at the ESSDERC/ESSCIR Conference)

--- The Final MOS-AK/GSA Workshop program is available on-line:
http://www.mos-ak.org/athens

--- Meeting location:
DIVANI CARAVEL HOTEL, 2 Meg. Alexandrou Aven. 161 21, Athens, Greece
For driving directions please visit: www.ametro.gr and www.oasa.gr

--- No registration fee thanks to our sponsors Accelicon, Helic, Tanner and Toshiba.
We would suggest to register on-line https://www.triaenatours.gr/essderc.php
to help our local organizers with local logistic and other arrangements.

Sep 8, 2009

Lectures on Numerical Linear Algebra in Computational Science and Engineering

September 12, 2009; ETH Zurich, Switzerland

Aims and scope: The lectures will discuss the importance and impact of Numerical Linear Algebra in CSE. Its usage in various areas of CSE will be exemplified. The event will also celebrate the retirement of Martin Gutknecht from ETH Zurich.

Read more...

Related meetings

Sep 2, 2009

Spice Modeling Engineer

And another job offer....


GF-- SMTS Spice Modeling Engineer - Semiconductor Jobs
Posted Aug 07
Confidential, Sunnyvale, CA
Job Description:
As a member of SPICE modeling team, this position will drive active/passive model development and QA, assuring high quality SPICE model delivery to external design customers. The responsibilities include (but not restricted to) development of SPICE modeling infrastructure and methodologies; device characterization (DC/AC/Transient/RF); and test structure development.

Required Skills/Experience:
Must have MS/PhD in EE, Solid State Physics, or equivalent with 0-10 yrs experience.

Must also have in-depth device physics, RF knowledge, and good programming skills. Prior hands-on experiences on SPICE model extraction (Scalable Inductor, Varactor, Resistor, Capacitor, BJT, Diodes), RF measurement, modeling, and HFSS simulation are a big plus.



MS/PhD in EE, Solid State Physics, or equivalent with 0-10 yrs experience.