2009 IEEE International SOI Conference

Oct. 5 - 8 October, 2009, Foster City, California

Ever increasing demand and advances in SOI and related technologies make it essential to meet to discuss new gains and accomplishments, as well as to consider new developments introduced in original papers presented at the conference.

AREAS of FOCUS

• SOI device physics and modeling
• Manufacturability and process integration of soi devices
• Low-power SOI technology and circuit design infrastructure
• SOI circuit applications (high-performance mpu, sram, asic, high-voltage, rf, analog, mixed mode, etc.)
• SOI double & multiple gate/vertical channel structures; other novel SOI structures
• New SOI structures, circuits, and applications (3d integration, displays, microactuators, novel memories, optics, etc.)
• SOI reliability issues (hot-carrier effects, radiation effects, high-temperature effects, etc.)
• SOI material science/modification, material characterization, manufacture, and substrate engineering.
• SOI sensors, MEMS and RFIDs technology and applications

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ICMNE-2009

The International Conference Micro- and Nano-Electronics – 2009 (ICMNE-2009) including extended Session “Quantum Informatics” (QI-2009) will be held in October 5-9, 2009 at the holiday hotel “Lipki”, Zvenigorod, Moscow region, Russia. It will continue the series of All-Russian Conferences MNE-1999, MNE-2001, QI-2002, and International Conferences ICMNE-2003, QI-2004, ICMNE-2005, QI-2005. ICMNE-2007, QI-2007. Conference ICMNE is biannual event covering majority of area of micro- and nano-electronic technologies, physics and devices. ICMNE-2009 is focused on recent progress in that area. The Conference will include the exhibition on equipment for micro- and nano-electronics. Conference's scope:

• Micro-, nano-electronic materials and films
• Micro- and nano-electronic technologies and equipment
• Metrology
• Physics and technologies of micro- and nano-devices
• Simulation and modeling
• Quantum informatics

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IRPS 2010

The 2010 IEEE International Reliability Physics Symposium (IRPS) will be held in Anaheim, California, Canada, on May 2-6 2010. The venue will be Hyatt Regency Orange County.
For over 40 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronic device reliability. IRPS is now co-sponsored by the IEEE Reliability Society and the IEEE Electron Devices Society. This co-sponsored event has drawn participants from the United States, Europe, Asia and all other parts of the world. IRPS'10 promotes the reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user’s environment, while demonstrating the latest state-of-the-art developments in electronic reliability.
The focus of the symposium is the 3-day plenary/parallel sessions featuring original work that identifies new microelectronic failure or degradation mechanisms, improves understanding of known failure mechanisms, demonstrates new or innovative analytical techniques, or demonstrates ways to build-in reliability. Specific areas to be addressed during the 2010 IRPS are reliability concerns associated with silicon (integrated circuits, discrete devices, MEMS, TFTs), Compound Semiconductor & Optoelectronics (GaAs, GaN, LEDs, displays, photovoltaics), and emerging technologies including organic electronics and nanotechnology.The deadline for abstract submission is October 2 2009.
In the Call for Papers, it is said that IRPS can accept papers which "identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems".Therefore, IRPS is a very attractive conference to present results on modeling of failure mechanisms.

Global Plastics Electronics Conference 2009

The 5th Global Plastic Electronics Conference and Exhibition will be held in Dresden, Germany, on October 27-29 2009. The venue will be the Maritim Hotel and Hotel Centre, Dresden.

This year's event will run for three days. The agenda is the following:
Day 1 will see forums run in paralell covering Integrated Smart Systems and Smart Fabrics and Intelligent Textiles. Days 2 and 3 both start with the Plenary session in the morning, followed by 5 paralell symposia in the afternoon.

The Global Plastic Electronics Conference and Exhibition will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.

The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.Besides, more than 30 companies will participate in the Exhibition. As said in the brochure, Science and Industry will meet in this conference.

RFIC'10

The 2010 IEEE RFIC (Radio Frequency Integrated Circuits) Symposium will be held in Anaheim, California, on May23-25-9 in conjunction with the IEEE MTT-S International Microwave Symposium (IMS), as part of the Microwave Week 2010.The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.The technical areas of RFIC 2010 include RFIC design, RFIC circuits, wide-band system IC's, RFIC device technologies, RF testing... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".Certainly, RFIC'10, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.The deadline for paper submission is January 5 2009.