Sep 27, 2008

IRPS 2009

The 2009 IEEE International Reliability Physics Symposium (IRPS) will be held in Montreal, Quebec, Canada, on April 26-30 2009. The venue will be The Fairmont Queen Elizabeth hotel.


For over 40 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronic device reliability. IRPS is now co-sponsored by the IEEE Reliability Society and the IEEE Electron Devices Society. This co-sponsored event has drawn participants from the United States, Europe, Asia and all other parts of the world. IRPS 2009 promotes the reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user’s environment, while demonstrating the latest state-of-the-art developments in electronic reliability.

The focus of the symposium is the 3-day plenary/parallel sessions featuring original work that identifies new microelectronic failure or degradation mechanisms, improves understanding of known failure mechanisms, demonstrates new or innovative analytical techniques, or demonstrates ways to build-in reliability. Specific areas to be addressed during the 2009 IRPS are reliability concerns associated with silicon (integrated circuits, discrete devices, MEMS), non-silicon (bipolar, BiCMOS, LEDs and diode lasers, optical fiber and flat panel displays), and emerging technologies including organic electronics and nanotechnology.

The deadline for abstract submission is October 3 2008.

In the Call for Papers, it is said that IRPS can accept papers which "identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems".

Therefore, IRPS is a very attractive conference to present results on modeling of failure mechanisms.




Other opportunities at the symposium include:

  • A 2-day Tutorial Program. Attendees have the opportunity to learn a new area in some technical depth from an industry expert or brush up on the fundamentals with introductory tutorials. There are typically about 20 tutorials that are offered on topics ranging from back-end reliability to gate dielectric and transistor reliability to circuit/product reliability to assembly/ packaging reliability.


  • Reliability Year-In-Review Seminars. These seminars provide a summary of important work published from the previous year in key reliability areas. Industry experts serve as the “tour guide” and save you time by collecting and summarizing this information to bring you up to date in a particular area as efficiently as possible.


  • Evening Session Workshops enhance the synergy of the symposium by affording the attendees an opportunity to meet in informal groups to discuss key reliability physics topics with the guidance of experienced moderators. Some of the workshop topics are directly coupled to the tutorial program to allow more discussion on a particular topic.


  • Equipment Demonstrations held in parallel with tutorials and technical sessions are a unique aspect of this symposium. Manufacturers of state-of-the-art analytical and test and stress equipment are on hand to demonstrate their products and systems to individuals and small groups. Attendees are encouraged to bring samples or questions for onsite analysis and discussion.


  • An Evening Poster Session has become an important part of the IRPS for authors and attendees to discuss recent research and results in a very interactive environment.

EDS Mini-Colloquium on New Frontiers on Compact Modeling

The IEEE Electron Device Society (EDS) organizes Mini-Colloquium (MQ) on New Frontiers on Compact Modeling on October 10 in Santa Clara University, Santa Clara CA, USA.

This MQ is focused on the emerging compact device and interconnect models. Six EDS distinguished lecturers have been invited:

J. J. Liou: "Compact modeling of silicon controlled rectifier for electrostatic discharge (ESD) computer aided design applications"

M. J. Deen: "Noise issues in advanced silicon devices and circuits"

N. Sadachika: "Modeling and characterization of RF/analog and noise using HiSIM2"

B. Yu, Y. Taur, J. Song: "Compact modeling of multiple-gate MOSFETs"

L.F. Register: "Nanoscale MOSFET physics: Observations from non-compact modeling studies"

P.K. Yu: "Wafer bonding for heterogeneous integration"

The Chair person will be Samar Saha, IEEE EDS Compact Modeling Technical Committee Chair, from Silterra USA Inc., San Jose, CA.

Sep 26, 2008

MOS-AK Meeting in San Francisco!

For the first time there will be a third MOS-AK meeting in one year, and for the first time, the MOS-AK Meeting will be held outside Europe!

In December 2008 a MOS-AK meeting will take place in San Francisco, California, co-located with two important events: the Compact Modeling Council (CMC) Meeting and IEDM'2008.

The call for abstracts is open. If you are interesting in making one presentation, please contact Wladek Grabinski: ")'>

The MOS-AK meeting is one of the main forums on compact modeling in Europe. So far, two editions of the meeting were held: one in spring and another one in September, co-located with the ESSDERC and ESSCIRC conferences. Of course, most of the participants use to be from Europe. It will be very interesting to have a MOS-AK meeting in the US, and have an active participation of compact model developers from America!

"Be Flexible" 2008

The 2008 "Be Flexible" Forum will be held in Munich (Germany) on December 2-3 2008 at the Hotel Le Meridien (Munich).

This Forum `be-flexible´ was created by Fraunhofer IZM-Munich to deal with the most recent research and innovations in the world of flexible electronics. It is an interesting event for exchanges of experiences of scientists, applied researchers, equipment suppliers and users in flexible electronics. It is also a good opportunity to meet people from the leading companies and suppliers.

The Forum will consist of two Workshops: Thin Semiconductor Devices (December 2) and Flexible Electronics Systems (December 3). Some interesting papers will be presented.

Besides, December 4 will be an Open Day to visit the Fraunhofer IZM facilities.

Global Plastic Electronics Conference

The 4th Global Plastic Electronics Conference and Showcase will be held in Berlin, Germany, on October 27-29 2008. The venue will be the Maritim Hotel Berlin.

The program consists of nine parallel symposia: Flexible Displays, Inorganic-Organic Hybrids, Lighting & Signage, Bateries & Printed Power, Organic Photovoltaics, Organic Based Sensors, Labels & Tags, and Smart Textiles.


The Global Plastic Electronics Conference and Showcase will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.

The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.

Besides, more than 30 companies will participate in the Showcase. As said in the brochure, Science and Industry will meet in this conference.

RFIC'09

The 2009 IEEE RFIC (Radio Frequency Integrated Circuits) Symposium will be held in Boston, Massachussets, on June 7-9 in conjunction with the IEEE MTT-S International Microwave Symposium (IMS), as part of the Microwave Week 2009.

The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.

The technical areas of RFIC 2009 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".

Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.

The deadline for paper submission is January 6 2009.

IMS'09

The IEEE MTT-S International Microwave Symposium 2009 (IMS 2009) will be held in Boston, Massachussets from June 7 to June 12 2009.

IMS is the largest conference in the field of RF and microwave theory and techniques.

IMS'08 will include workshops, short courses, panels and special sessions

In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).

IMS will be part of the Microwave Week 2009, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.

The deadline for paper submission is December 8 2009.

Last but not least, IMS'08 includes a very interesting social programme.
Certainly Boston is an exciting city that offers many places and activities to enjoy!