Sep 27, 2008

EDS Mini-Colloquium on New Frontiers on Compact Modeling

The IEEE Electron Device Society (EDS) organizes Mini-Colloquium (MQ) on New Frontiers on Compact Modeling on October 10 in Santa Clara University, Santa Clara CA, USA.

This MQ is focused on the emerging compact device and interconnect models. Six EDS distinguished lecturers have been invited:

J. J. Liou: "Compact modeling of silicon controlled rectifier for electrostatic discharge (ESD) computer aided design applications"

M. J. Deen: "Noise issues in advanced silicon devices and circuits"

N. Sadachika: "Modeling and characterization of RF/analog and noise using HiSIM2"

B. Yu, Y. Taur, J. Song: "Compact modeling of multiple-gate MOSFETs"

L.F. Register: "Nanoscale MOSFET physics: Observations from non-compact modeling studies"

P.K. Yu: "Wafer bonding for heterogeneous integration"

The Chair person will be Samar Saha, IEEE EDS Compact Modeling Technical Committee Chair, from Silterra USA Inc., San Jose, CA.

Sep 26, 2008

MOS-AK Meeting in San Francisco!

For the first time there will be a third MOS-AK meeting in one year, and for the first time, the MOS-AK Meeting will be held outside Europe!

In December 2008 a MOS-AK meeting will take place in San Francisco, California, co-located with two important events: the Compact Modeling Council (CMC) Meeting and IEDM'2008.

The call for abstracts is open. If you are interesting in making one presentation, please contact Wladek Grabinski: ")'>

The MOS-AK meeting is one of the main forums on compact modeling in Europe. So far, two editions of the meeting were held: one in spring and another one in September, co-located with the ESSDERC and ESSCIRC conferences. Of course, most of the participants use to be from Europe. It will be very interesting to have a MOS-AK meeting in the US, and have an active participation of compact model developers from America!

"Be Flexible" 2008

The 2008 "Be Flexible" Forum will be held in Munich (Germany) on December 2-3 2008 at the Hotel Le Meridien (Munich).

This Forum `be-flexible´ was created by Fraunhofer IZM-Munich to deal with the most recent research and innovations in the world of flexible electronics. It is an interesting event for exchanges of experiences of scientists, applied researchers, equipment suppliers and users in flexible electronics. It is also a good opportunity to meet people from the leading companies and suppliers.

The Forum will consist of two Workshops: Thin Semiconductor Devices (December 2) and Flexible Electronics Systems (December 3). Some interesting papers will be presented.

Besides, December 4 will be an Open Day to visit the Fraunhofer IZM facilities.

Global Plastic Electronics Conference

The 4th Global Plastic Electronics Conference and Showcase will be held in Berlin, Germany, on October 27-29 2008. The venue will be the Maritim Hotel Berlin.

The program consists of nine parallel symposia: Flexible Displays, Inorganic-Organic Hybrids, Lighting & Signage, Bateries & Printed Power, Organic Photovoltaics, Organic Based Sensors, Labels & Tags, and Smart Textiles.


The Global Plastic Electronics Conference and Showcase will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.

The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.

Besides, more than 30 companies will participate in the Showcase. As said in the brochure, Science and Industry will meet in this conference.

RFIC'09

The 2009 IEEE RFIC (Radio Frequency Integrated Circuits) Symposium will be held in Boston, Massachussets, on June 7-9 in conjunction with the IEEE MTT-S International Microwave Symposium (IMS), as part of the Microwave Week 2009.

The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.

The technical areas of RFIC 2009 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".

Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.

The deadline for paper submission is January 6 2009.

IMS'09

The IEEE MTT-S International Microwave Symposium 2009 (IMS 2009) will be held in Boston, Massachussets from June 7 to June 12 2009.

IMS is the largest conference in the field of RF and microwave theory and techniques.

IMS'08 will include workshops, short courses, panels and special sessions

In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).

IMS will be part of the Microwave Week 2009, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.

The deadline for paper submission is December 8 2009.

Last but not least, IMS'08 includes a very interesting social programme.
Certainly Boston is an exciting city that offers many places and activities to enjoy!

EUROSOI 2009

The 2009 EUROSOI Workshop will be held at Chalmers University, Göteborg (Sweden) on January 19-21 2009.

The EUROSOI Workshop started as an event related to a former Coordination Action (called EUROSOI) funded by the European Commission. This Thematic Network, which includes most of the European teams working on SOI technology, will continue to exist at least until 2011, under the name of EUROSOI+, receiving more funding from the European Commission.

The EUROSOI Workshop has become an international forum to discuss the recent advances on all aspects of SOI technology: materials, devices, modeling, simulation and circuits.

EUROSOI 2008 will be organized by the Chalmers University. The Chairman is Prof Olof Engström, a recognized researcher in nanoscale semiconductor devices, including SOI technology.

The deadline for abstract submission is November 15 2008

Topics include all areas related to SOI technology, devices and circuits. The "SOI MOSFET modeling" topic is explicitly mentioned.

Göteborg is a leading conferences and event city in Europe. There is a strong joint commitment between the business community and the city council to support major events and conferences offering professionalism and excellent organizational skills.

Do not expect a very nice weather in Göteborg in January, but there are many things to see and enjoy in Göteborg.