The 2007 "Be Flexible" Forum will be held in Munich (Germany) on December 5-6 2007 at the Hotel Le Meridien (Munich).
This Forum `be-flexible´ was created by Fraunhofer IZM-Munich to deal with the most recent research and innovations in the world of flexible electronics. It is an interesting event for exchanges of experiences of scientists, applied researchers, equipment suppliers and users in flexible electronics. It is also a good opportunity to meet people from the leading companies and suppliers.
The Forum will consist of two Workshops: Thin Semiconductor Devices (December 5) and Flexible Electronics Systems (December 6). Some interesting papers will be presented. In the area of device physics and modeling, I want to mention a paper entitled "Conduction mechanisms in conjugated polymers", by N. Sedghi, M. Raja, D. Donaghy, and W. Eccleston, from the University of Liverpool. Prof. Eccleston's team is a pioneer in the field of physics and compact modeling of organic devices.
Besides, December 7 will be an Open Day to visit the Fraunhofer IZM facilities.
Oct 8, 2007
Fourth Annual Printed Electronics USA
The fourth annual Printed Electronics USA symposium will be held in San Francisco, California (in the South San Francisco Conference Center), on November 12-15. This conference aims to be the largest in the World on the topic of Printed Electronics. It covers both organic and printed inorganic electronics.
The premium conference will include more than 60 presentations from users/potential users, and a very large printed electronics exhibition, with over 50 exhibitors.
This conference focuses more on the potential and applications of printed electronics rather than on the physics and modeling of the devices for printed electronics. However, no doubt it will be a very interesting conference to attend for device researchers, in order to learn more about the revolutionary applications printed electronics is going to have.
The program will also include tours to local companies as well as half day Printed Electronics Investment Summit.
Besides, the 2007 Printed Electronics Awards, for recognition of industry and technology development, will be given.
The premium conference will include more than 60 presentations from users/potential users, and a very large printed electronics exhibition, with over 50 exhibitors.
This conference focuses more on the potential and applications of printed electronics rather than on the physics and modeling of the devices for printed electronics. However, no doubt it will be a very interesting conference to attend for device researchers, in order to learn more about the revolutionary applications printed electronics is going to have.
The program will also include tours to local companies as well as half day Printed Electronics Investment Summit.
Besides, the 2007 Printed Electronics Awards, for recognition of industry and technology development, will be given.
Oct 7, 2007
Global Plastic Electronics Conference
The 3rd Global Plastic Electronics Conference and Showcase will be held in Frankfurt, Germany, on October 29-30 2007. The venue will be the Sheraton Frankfurt Hotels & Towers, Conference Centre.
The program consists of nine parallel symposia: Flexible Displays, Lighting & Signage, Photovoltaics, Organic Based Sensors, Organic labels & Tags, Smart Packaging, Smart Textiles, Fuel Cells & Batteries and Hybrid Opportunities.
The Global Plastic Electronics Conference and Showcase will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.
The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.
Besides, more than 30 companies will participate in the Showcase. As said in the brochure, Science and Industry will meet in this conference.
The program consists of nine parallel symposia: Flexible Displays, Lighting & Signage, Photovoltaics, Organic Based Sensors, Organic labels & Tags, Smart Packaging, Smart Textiles, Fuel Cells & Batteries and Hybrid Opportunities.
The Global Plastic Electronics Conference and Showcase will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.
The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.
Besides, more than 30 companies will participate in the Showcase. As said in the brochure, Science and Industry will meet in this conference.
ICCAD'07
The 2007 IEEE International Conference on Computer Aided Design (ICCAD) is coming...
It will take place in San Jose, California on November 5-8. The venue will be the Double Tree Hotel in San Jose..
ICCAD is one of the top conferences in electronic design conference. This year it will be its 25th anniversary.
The program of the 25th Edition of ICCAD is truly interesting. On Monday 5 there will be 4 half-day tutorials and 1 full-day tutorial, all of them conducted by very prestigeous researchers. The selected papers are all of high quality. ICCAD is a very competitive conference, which carries out a careful selection of the papers submitted. Less than one third of the submissions are accepted.
Besides, there are there are 4 embedded tutorials addressing topics from nano-photonic circuits over physical synthesis and formal verification to compact device modeling for 45 nm and below.
The program will also be complemented with with 2 top-notch plenary keynote speakers: Jeff Welser, Director of the SRC National Nanoelectronics Research Initiative, and John Kibarian, CEO of PDF Solutions.
Modeling is one of the topics of ICCAD. One of the embedded tutorials will address compact device modeling for 45 nm and below, and it will be presented by Kevin Cao and Colin McAndrew. But in ICCAD other modeling issues are emphasized: power modeling, reliability modeling, interconnect modeling , variability modeling, and timing modeling.
In fact, one of the tutorials is entitled Modeling Deterministic Timing and Reliability Effects in Sub-65 nm Flows, and will be conducted by S. Pullela, C. Kashyap and B. McGaughy.
Certainly ICCAD will be a very interesting place to learn and discover the latest new research developments in electronic design technology, and to exchange ideas about the challenges and solutions for the design nanoscale integrated circuits.
And Happy Birthday to ICCAD!
It will take place in San Jose, California on November 5-8. The venue will be the Double Tree Hotel in San Jose..
ICCAD is one of the top conferences in electronic design conference. This year it will be its 25th anniversary.
The program of the 25th Edition of ICCAD is truly interesting. On Monday 5 there will be 4 half-day tutorials and 1 full-day tutorial, all of them conducted by very prestigeous researchers. The selected papers are all of high quality. ICCAD is a very competitive conference, which carries out a careful selection of the papers submitted. Less than one third of the submissions are accepted.
Besides, there are there are 4 embedded tutorials addressing topics from nano-photonic circuits over physical synthesis and formal verification to compact device modeling for 45 nm and below.
The program will also be complemented with with 2 top-notch plenary keynote speakers: Jeff Welser, Director of the SRC National Nanoelectronics Research Initiative, and John Kibarian, CEO of PDF Solutions.
Modeling is one of the topics of ICCAD. One of the embedded tutorials will address compact device modeling for 45 nm and below, and it will be presented by Kevin Cao and Colin McAndrew. But in ICCAD other modeling issues are emphasized: power modeling, reliability modeling, interconnect modeling , variability modeling, and timing modeling.
In fact, one of the tutorials is entitled Modeling Deterministic Timing and Reliability Effects in Sub-65 nm Flows, and will be conducted by S. Pullela, C. Kashyap and B. McGaughy.
Certainly ICCAD will be a very interesting place to learn and discover the latest new research developments in electronic design technology, and to exchange ideas about the challenges and solutions for the design nanoscale integrated circuits.
And Happy Birthday to ICCAD!
2008 IEEE Symposium on VLSI Technology
The 2008 IEEE Symposium on VLSI Technology will take place in the Hilton Hawaiian Village, in Honolulu, Hawaii, on June 17-19.
The IEEE Symposium on VLSI Technology is one of the most prestigeous conferences on VLSI devices and processes. It is also a very competitive and tough conference. Papers should always be innovative enough regarding VLSI devices. Some of the topics explicitly mentioned in the Call for Papers are "process/device modeling" and "theories and fundamentals" related to VLSI devices. Therefore, researchers in device modeling (including compact modeling) can submit papers to the IEEE Symposium on VLSI Technology, but it should be remarked that these models or theories should be real breakthroughs.
The Chairman is Professor Jason Woo, from UCLA, an outstanding researcher in semiconductor devices, with a lot of experience in device modeling.
The deadline is January 7.
There will be a Best Student Paper Award. The Symposium will cover the travel mexpenses and registration fee for the award recipient to attend the 2009 Symposium.
The IEEE Symposium on VLSI Technology will be held in conjunction with the IEEE Symposium on VLSI Circuits, which is one of the top conferences in the field of integrated circuits. This Symopisum is also very demanding and competitive. Papers should be really breakthroughs to be accepted.
Well, despite the symposium is so demanding, it is worthy to work hard to make a suitable paper for this Symposium. And it is also a good opportunity to enjoy some days in Honolulu!
The IEEE Symposium on VLSI Technology is one of the most prestigeous conferences on VLSI devices and processes. It is also a very competitive and tough conference. Papers should always be innovative enough regarding VLSI devices. Some of the topics explicitly mentioned in the Call for Papers are "process/device modeling" and "theories and fundamentals" related to VLSI devices. Therefore, researchers in device modeling (including compact modeling) can submit papers to the IEEE Symposium on VLSI Technology, but it should be remarked that these models or theories should be real breakthroughs.
The Chairman is Professor Jason Woo, from UCLA, an outstanding researcher in semiconductor devices, with a lot of experience in device modeling.
The deadline is January 7.
There will be a Best Student Paper Award. The Symposium will cover the travel mexpenses and registration fee for the award recipient to attend the 2009 Symposium.
The IEEE Symposium on VLSI Technology will be held in conjunction with the IEEE Symposium on VLSI Circuits, which is one of the top conferences in the field of integrated circuits. This Symopisum is also very demanding and competitive. Papers should be really breakthroughs to be accepted.
Well, despite the symposium is so demanding, it is worthy to work hard to make a suitable paper for this Symposium. And it is also a good opportunity to enjoy some days in Honolulu!
RFIC'08
The 2008 IEEE RFIC (Radio Frequency Integrated Circuits) Symposium will be held in Atlanta, Georgia, on June 15-17 in conjunction with the IEEE MTT-S International Microwave Symposium (IMS), as part of the Microwave Week 2008.
The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.
The technical areas of RFIC 2008 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".
Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.
The deadline for paper submission is January 3 2008.
The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.
The technical areas of RFIC 2008 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".
Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.
The deadline for paper submission is January 3 2008.
IMS 2008
The IEEE MTT-S International Microwave Symposium 2008 (IMS 2008) will be held in Atlanta, Georgia from June 15 to June 20 2008.
IMS is the largest conference in the field of RF and microwave theory and techniques.
IMS'08 will include workshops, to be held on Sunday June 15, Monday June 16 and Friday June 20 2008. The IMS 2008 Technical Sessions will take place from Tuesday June 17 to Thursday June 18.
In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).
IMS will be part of the Microwave Week 2008, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.
The deadline for paper submission is December 7 2007.
Last but not least, IMS'08 includes a very interesting social programme, and a guest tour roster.
Certainly Atlanta is an exciting city that offers many places and activities to enjoy!
IMS is the largest conference in the field of RF and microwave theory and techniques.
IMS'08 will include workshops, to be held on Sunday June 15, Monday June 16 and Friday June 20 2008. The IMS 2008 Technical Sessions will take place from Tuesday June 17 to Thursday June 18.
In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).
IMS will be part of the Microwave Week 2008, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.
The deadline for paper submission is December 7 2007.
Last but not least, IMS'08 includes a very interesting social programme, and a guest tour roster.
Certainly Atlanta is an exciting city that offers many places and activities to enjoy!
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