#Bipolar #Transistor Water #Model - Blender Animation https://t.co/R04thFHvYJ https://t.co/2YAXRXnbXx

#Bipolar #Transistor Water #Model - Blender Animation https://t.co/R04thFHvYJ pic.twitter.com/2YAXRXnbXx

— Wladek Grabinski (@wladek60) December 16, 2018

from Twitter https://twitter.com/wladek60

December 16, 2018 at 11:26PM
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#FOSDEM 2019 - CAD and Open Hardware devroom with #GnuCap and #ngspice presentations https://t.co/SKNe2toLrP #opensource https://t.co/3jAKTwYk2S

#FOSDEM 2019 - CAD and Open Hardware devroom with #GnuCap and #ngspice presentations https://t.co/SKNe2toLrP #opensource pic.twitter.com/3jAKTwYk2S

— Wladek Grabinski (@wladek60) December 14, 2018

from Twitter https://twitter.com/wladek60

December 14, 2018 at 03:36PM
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IEEE Cledo Brunetti Award 2018 presented to Prof.Dr. Siegfried Selberherr

One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework. An IEEE Fellow, Selberherr is a professor with the Institute for Microelectronics at the Technische Universität Wien, Vienna, Austria.

Determination of full S-parameters of a low-loss two-port device from uncalibrated measurements https://t.co/NZngN2tURO #paper https://t.co/OmE9llCrNB

Determination of full S-parameters of a low-loss two-port device from uncalibrated measurements https://t.co/NZngN2tURO #paper pic.twitter.com/OmE9llCrNB

— Wladek Grabinski (@wladek60) December 12, 2018

from Twitter https://twitter.com/wladek60

December 12, 2018 at 06:20PM
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What is #OpenSource & Why Should You Care? https://t.co/DG2GstjAUe https://t.co/tFwoTXim3t

What is #OpenSource & Why Should You Care? https://t.co/DG2GstjAUe pic.twitter.com/tFwoTXim3t

— Wladek Grabinski (@wladek60) December 12, 2018

from Twitter https://twitter.com/wladek60

December 12, 2018 at 10:56AM
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[C4P] ESSDERC / ESSCIRC September 23-26, 2019 Kraków, POLAND

September 23-26, 2019 Kraków, POLAND

ESSDERC/ESSCIRC annual Conference is the most important European forum for the presentation and discussion of recent advances in solid-state devices and circuits.

CALL for PAPERS - click below!

CALL FOR PAPERS

ESSCIRC tracks: Analog  Data Converters RF and mm-Wave Frequency Generation Wireless and Wireline Systems Sensors, Imager and Biomedical Digital, Security and Memory Power Management ESSDERC tracks: CMOS Devices and Technology Opto-, Power and Microwave Devices Physical Modeling of Materials and Devices Compact Modeling of Devices and Circuits Memory Devices and Technology Emerging non-CMOS Devices and Technologies Sensor Devices and Technology

Technical Co-Sponsorship ESSDERC Financial Sponsor ESSCIRC Financial Sponsor

ORGANIZERS

DIAMOND SPONSOR

RIGAKU

CALL FOR PAPERS All submissions must be received by 8th April 2019 PAPER SUBMISSION Manuscript guidelines as well as instructions on how to submit electronically will be soon available on the Conference website. Papers must not exceed four A4 pages with all illustrations and references included.

Papers submitted for review must clearly state:     - the purpose of the work     - how and to what extent it advances the state-of-the art     - specific results and their impact

After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by  31th May 2019. At the same time, the complete program will be published on the Conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication. The submitted final PDF files should be IEEE Xplore compliant.

For each paper independently, at least one co-author is required to register for the Conference (one registration-one paper policy).

ESSDERC 49th European Solid-State Device Research Conference ESSCIRC 45th European Solid-State Circuits Conference September 23-26, 2019Kraków, POLAND

https://esscirc-essderc2019.org LOCAL SCIENTIFIC SECRETARIAT Krzysztof Kasinski (AGH UST, PL) krzysztof.kasinski@agh.edu.pl Robert Szczygiel (AGH UST, PL) robert.szczygiel@agh.edu.pl ESSDERC/ESSCIRC 2019 ORGANIZING SECRETARIAT Foundation for AGH University of Science and Technology www.fundacja.agh.edu.pl e-mail: kf@agh.edu.pl Anna Inglot – Conference Manager phone: +48 504 004 517

Copyright 2018 Foundation for AGH UST in Cracow. All rights reserved. "You are receiving this email because you expressed interest in news and events about ESSDERC/ESSCIRC 2019"

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New Czech law makes ICT #neutrality a #right https://t.co/wLElZIQj2Y #paper

New Czech law makes ICT #neutrality a #right https://t.co/wLElZIQj2Y #paper

— Wladek Grabinski (@wladek60) December 9, 2018

from Twitter https://twitter.com/wladek60

December 09, 2018 at 12:40PM
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