[C4P] Special Issue on Machine Learning for CAD

ACM Digital Library CALL FOR PAPERS — DEADLINE EXTENDED ACM Transactions on Design Automation of Electronic Systems Special Issue on Machine Learning for CAD Guest Editors Yibo Lin, Peking University Siddharth Garg, New York University Hussam Amrouch, Technical University of Munich (TUM) Advances in machine learning (ML) over the past half-dozen years have revolutionized the effectiveness of ML for a variety of applications. However, design processes present challenges that require parallel advances in ML and CAD as compared to traditional ML applications such as image classification. This seeks original submission on ML applications to the entire design flow of integrated circuits, from system-level design to manufacturing, from functional verification to testing, from design time to runtime, etc. Click here for the full Call for Papers and submission instructions. Important Dates Submissions deadline: March 5, 2025 — DEADLINE EXTENDED First-round review decisions: April 15, 2025 Deadline for revision submissions: May 15, 2025 Notification of final decisions: June 15, 2025 Tentative publication: Summer 2025 For questions and further information, please contact guest editors at: Yibo Lin, Peking University Siddharth Garg, New York University Hussam Amrouch, Technical University of Munich (TUM) Sign up for TODAES TOC alerts. https://todaes.acm.org You are subscribed with: wladek@grabinski.ch Unsubscribe The call-for-papers@hq.acm.org email address is not monitored. Please do not reply to it directly. Association for Computing Machinery 1601 Broadway, 10th Floor, New York, NY 10019 Connect with us:

[C4P] Speak at Open Source Summit Europe 2025

Present your work + ideas in Amsterdam, 25–27 August!

View in browser The Call for Proposals is officially open for Open Source Summit Europe 2025, taking place 25–27 August in Amsterdam! This is your opportunity to present innovative ideas, spark meaningful discussions, and help shape the future of open source. We're looking for speakers across a variety of key topics, including: Cloud & Containers Digital Trust Diversity, Equity, Inclusion & Accessibility Digital Trust Embedded Linux Conference Linux Open Source 101  Operations Management OpenGovCon Open Source Leadership  OSPOCon  Safety-Critical Software Standards & Specifications Technical Documentation Zephyr Developer Summit Learn more about all tracks and suggested topics. Proposals are due by Monday, 14 April at 23:59 CEST.  SUBMIT TO SPEAK >> The Linux Foundation is committed to increasing diversity, equity, and inclusion in open source, starting on the conference stage. We encourage submissions from marginalized communities and first-time speakers—reach out if you need help with your proposal! 📣 More Opportunities to Speak in Amsterdam AI_dev: Open Source GenAI & ML Summit Europe (28-29 August) Calling all AI developers and researchers! Submit your proposal to speak on topics like MLOps, GenOps, Responsible AI, and more at this premier open source AI event. Join us in shaping the future of generative AI, machine learning, and open source innovation! Learn more + submit by Monday, 14 April. Linux Security Summit Europe (28-29 August) Present at the leading technical forum for Linux security. Share your insights on topics like cryptography, IoT security, OS hardening, and more with top community experts and maintainers driving innovation in Linux security. Learn more + submit by Tuesday, 6 May. 🎟️ Registration is OPEN!   Not planning to speak but still want to attend? Register by 9 June and save with early bird pricing! See what's included in your registration fee - including lunch! 🥪 Are you a small business owner, academic, government employee, or hobbyist? Check out our special rates with fees starting at USD$275. Need financial assistance? Explore our diversity and need-based scholarship program and apply by 21 July. REGISTER NOW + SAVE >> 🤝 Become a Sponsor   Sponsoring Open Source Summit Europe connects your organization with a diverse audience of open source practitioners, offering unparalleled opportunities to build brand recognition, showcase thought leadership, and forge valuable partnerships. This premier event enables you to engage with multiple open source communities, recruit top talent, and generate high-quality leads - all in one place. BECOME A SPONSOR >> Thank You to Our Sponsors! DIAMOND GOLD SILVER BRONZE This email was sent by: The Linux Foundation Events 548 Market St, PMB 57274, San Francisco, CA 94104-5401, United States Subscription Center

[paper] Benchmarks for SPICE AI/ML Modeling

Colin C. McAndrew, Andries J. Scholten, Kiran K. Gullapalli, Yogesh Chauhan, and Kejun Xia

Benchmarks for SPICE Modeling and Parameter Extraction Based on AI/ML

IEEE Transactions on Electron Devices (2025)

DOI: 10.1109/TED.2025.3537952

1 Computer Engineering, Iowa State University, (USA)
2 NXP Semiconductors N.V., Eindhoven (NL)
3 NXP Semiconductors N.V., Austin (USA)
4 IIT Kanpur, (IN)
5 TSMC, Hsinchu (TW)

Abstract: Over the past decades, the number of submitted articles that use numerical approaches for SPICE models or for characterization (extraction) of parameters of existing SPICE models has grown significantly. Many of those articles rely on synthetic data, generated either from technology computer-aided design (TCAD) or from physical SPICE model simulations; most do not model/fit measured data. Furthermore, those articles do not evaluate the physical correctness, smoothness/monotonicity, or asymptotic correctness of the approach they propose. That is sufficient for initial evaluation of proposed techniques. However, it does not prove that they are “industrial strength.” This article presents benchmarks/guidelines for the proposed artificial intelligence (AI)/machine learning (ML) SPICE modeling and characterization techniques to try to help them become practical and useful.

TAB: CHECKLIST FOR MODELS

Capability	Existing State-of-the-Art	Proposed AI/ML Approach	Best Prior AI/ML Approach
obeys the laws of thermodynamics	✓	?	?
accurate DC modeling for all terminal currents, on relevant log/linear scale	✓	?	?
accurate capacitance/charge modeling	✓	?	?
models DC and capacitance interaction where relevant	✓	?	?
accurate modeling of high-frequency/non-quasi-static effects where relevant	✓	?	?
works for large-signal transient simulation, including delay effects	✓	?	?
accurate noise modeling	✓	?	?
has full geometry dependence	✓	?	?
has complete temperature dependence	✓	?	?
models all necessary LDEs	✓	?	?
behaves “well” for unreasonable geometry or temperature or bias	✓	?	?
exhibits physical monotonicity over bias, geometry, and temperature	✓	?	?
is smooth (ideally C∞-continuous)	✓	?	?
exhibits relevant physical symmetries (currents, charges, their derivatives)	✓	?	?
exhibits asymptotic correctness over geometry, temperature, and bias	✓	?	?
includes modeling of electrothermal effects (with frequency dependence)	✓	?	?
includes, or enables, modeling of global and local statistical variation	✓	?	?
includes, or enables, modeling of aging	✓	?	?
enables modeling of parasitics for different layouts	✓	?	?
is verified to converge reliably in at least one circuit simulator	✓	?	?

[mos-ak] MIXDES 2025 deadline reminder

Dear Colleagues,

I would like to remind you about the upcoming MIXDES 2025 regular paper submission deadline, which passes within 2 weeks.  If you are going to contribute, I encourage you to register your paper as soon as possible. You will be able to update the paper details and the document file at any time till the final paper version deadline (May 15^th, 2025). The early paper registration will allow us to take care of your paper just now, especially start the reviewer assignments.

To submit the paper, you need to log on to the MIXDES Conference website and follow the link "Submit a paper". After successful paper registration, you should receive a confirmation email and the paper should appear in the "User home" page. From this page, you may later update already registered papers by just clicking on its title.

I would like to kindly ask you to forward the information to your colleagues who may be interested in the conference topics. The most important information about the event can be found in Call for Papers

Important dates:

• Conference place and days: Szczecin, Poland, 26-28 June 2025
• Paper submission deadline: 1 March 2025
• Notification of acceptance: 30 April 2025
• Final paper versions: 15 May 2025

If you have any questions, please do not hesitate to contact me.

With best regards,

Mariusz Orlikowski

MIXDES 2025 Conference Secretary

[paper] Cryo HiSIM Compact Model

Dondee Navarro, Chika Tanaka, Kyoto Institute, Shin Taniguchi, Kazutoshi Kobayashi, Michihiro Shintani and Takashi Sato

Physics-based Modeling to Extend MOSFET Compact Model for Cryogenic Operation

(Invited Paper) ASPDAC ’25, January 20–23, 2025, Tokyo, Japan

DOI: 10.1145/3658617.3703137

1 KIOXIA Corporation Yokohama (J)

2 Kyoto Institute of Technology Kyoto (J)

3 Kyoto University Kyoto (J)

Abstract: This paper extends the low-temperature modeling capabilities of an industry-standard compact metal-oxide-semiconductor field-effect transistor (MOSFET) model by incorporating physics-based representations of cryogenic effects in semiconductors. Specifically, the incomplete dopant ionization effect is integrated into the bulk Fermi potential calculation of the compact model and applied as a threshold voltage shift in the formulation of Poisson’s equation. Temperature-related models for bandgap energy, saturation velocity, and contact resistance at the source/drain regions are also enhanced. Using transistors fabricated with 22nm process technology, we demonstrate that this consistent modeling approach accurately reproduces current-voltage and threshold voltage-temperature characteristics across a temperature range from 300K to 4K.

FIG: Extracted Vth-T and SS-T characteristics from measurements

and extended HiSIM model simulations.

Acknowledgments: This work was also supported through the activities of d-lab VDEC, the University of Tokyo, in collaboration with NIHON SYNOPSYS G.K., Cadence Design Systems, and Siemens Electronic Design Automation Japan K.K.