[paper] Optomechanical Sensor in Verilog-A

Houssein Elmi Dawale, Loïc Sibeud, Sébastien Regord, Guillaume Jourdan, Member, IEEE, Sébastien Hentz, Member, IEEE, and Franck Badets, Senior Member, IEEE

Compact Modeling and Behavioral Simulation of an Optomechanical Sensor in Verilog-A

IEEE Transactions on Electron Devices, vol. 67, no. 11, pp. 4677-4681, Nov. 2020

DOI: 10.1109/TED.2020.3024477

Abstract: Previous work has shown that optomechanical resonators are particularly well suited to the design of ultrasensitive mass sensors. They present an extremely low noise level, very high optical quality factor (Q>105), excellent integration density and can resonate both in a gaseous and liquid environment. In order to reduce the long measurement time due to their small particle capture area, several such resonators must be integrated onto the same chip. However, bulky laboratory equipment currently used to read a single optomechanical resonator cannot be practically scaled up to a large array of transducers. It is then required to design and eventually integrate a read-out interface that can process tens to thousands of resonators. To ease the design of such a circuit, this article presents a compact analytical model of an electrostatically actuated optomechanical resonator implemented in Verilog-A. The proposed model includes both the optical and mechanical behaviors, as well as optomechanical coupling and thermo-optical effect. It was simulated in commercial simulator and is consistent with the measured results. 

FIG: a) General view of the optomechanical device with electrostatic actuation. 

b) Functional diagram of the device in Verilog-A.

[book] Ultra-Low Power FM-UWB Transceivers for IoT

Ultra-Low Power FM-UWB Transceivers for IoT

Vladimir Kopta and Christian Enz

River Publishers, 2020, pp.i-xxiv

Over the past two decades we have witnessed the increasing popularity of the internet of things. The vision of billions of connected objects, able to interact with their environment, is the key driver directing the development of future communication devices. Today, power consumption as well as the cost and size of radios remain some of the key obstacles towards fulfilling this vision. Ultra-Low Power FM-UWB Transceivers for IoT presents the latest developments in the field of low power wireless communication. It promotes the FM-UWB modulation scheme as a candidate for short range communication in different IoT scenarios. The FM-UWB has the potential to provide exactly what is missing today. This spread spectrum technique enables significant reduction in transceiver complexity, making it smaller, cheaper and more energy efficient than most alternative options. The book provides an overview of both circuit-level and architectural techniques used in low power radio design, with a comprehensive study of state-of-the-art examples. It summarizes key theoretical aspects of FM-UWB with a glimpse at potential future research directions. Finally, it gives an insight into a full FM-UWB transceiver design, from system level specifications down to transistor level design, demonstrating the modern power reduction circuit techniques. Ultra-Low Power FM-UWB Transceivers for IoT is a perfect text and reference for engineers working in RF IC design and wireless communication, as well as academic staff and graduate students engaged in low power communication systems research.

[paper] Wearable Circuits for Health Monitoring

Ling Zhang, †,‡,§ Hongjun Ji, †,‡,# Houbing Huang, ^ Ning Yi, ǂ,& Xiaoming Shi, ^ Senpei Xie, ‡,# Yaoyin Li, ‡,# Ziheng Ye, # Pengdong Feng, ‡,# Tiesong Lin, † Xiangli Liu, # Xuesong Leng, † Mingyu Li, †,‡,# Jiaheng Zhang, †,‡,# Xing Ma, †,‡,# Peng He, † Weiwei Zhao, †,‡,#

and Huanyu Cheng, §,ǂ

Wearable Circuits Sintered at Room Temperature Directly on The Skin Surface for Health Monitoring

ACS Appl. Mater. Interfaces 2020, 12, 40, 45504–45515

Publication Date:September 11, 2020

DOI: 10.1021/acsami.0c11479

†State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen, 518055, People’s Republic of China
‡Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen, 518055, People’s Republic of China
§Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.
#The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen, 518055, People’s Republic of China
^Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China
ǂDepartment of Materials Science and Engineering, The Pennsylvania State University, University Park, PA 16802, USA.

Abstract: A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) for signal conditioning/readout and wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing on a carrier substrate before attaching to the body. Here we report a universal fabrication scheme to enable printing and room-temperature sintering of metal nanoparticle on paper/fabric for FPCBs and directly on the human skin for on-body sensors with a novel sintering aid layer. Consisting of polyvinyl alcohol (PVA) paste and nanoadditives in the water, the sintering aid layer reduces the sintering temperature. Together with the significantly decreased surface roughness, it allows for the integration of a submicron-thick conductive pattern with enhanced electromechanical performance. Various on-body sensors integrated with an FPCB to detect health conditions illustrate a system-level example.

Fig: Print These Electronic Circuits Directly Onto Skin by spectrum.ieee.org

Acknowledgment: This work was supported by several grants provided by The Pennsylvania State University and National Science Foundation (NSF) (Grant No. ECCS-1933072) to H.C., as well as Shenzhen Science and Technology Program (Grant No. KQTD 20170809110344233, JCYJ 20170811160129498) and Bureau of Industry and Information Technology of Shenzhen through the Graphene Manufacturing Innovation Center (201901161514). X.L. acknowledges the support from the Natural Science Foundation of China (11672090)

[Open PhD] IMEC: Modeling of hybrid nanofluidic-nanoelectronic devices for single-molecule biosensing

[Open PhD] IMEC:

Modeling of hybrid nanofluidic-nanoelectronic devices for single-molecule biosensing https://t.co/14Nu8hsWJi #semi pic.twitter.com/bFRejEUYfy

— Wladek Grabinski (@wladek60) October 27, 2020

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from Twitter https://twitter.com/wladek60

October 27, 2020 at 09:15AM
via IFTTT

Fwd: IEEE-EDS Santa Clara Valley/San Francisco Chapter October Seminar (Webex only)

Please note that this seminar is now WEBEX participation only. 

Coupled Oscillator based Computing: Using Nature to Solve Difficult Problems

Prof. Chris H. Kim, University of Minnesota

Friday, October 30, 2020 at 11AM – noon PDT

Register Here

Abstract:
In this talk, I will introduce a first-of-its kind quantum-inspired coupled oscillator based compute engine implemented in a standard 65nm technology targeted for NP-hard or NP-complete problems such as max-cut, graph coloring, traveling salesman, and pattern recognition. The NP-hard problem is first mapped to the coupling weights while the solution is represented by the phases of the individual oscillators, which are read out using on-chip phase sampling circuits. Our hardware exploits the natural tendency of a network of coupled oscillator to settle to the ground state, which offers significant performance and power advantages compared to traditional digital approaches.

Speaker Bio:
Chris H. Kim received his B.S. and M.S. degrees from Seoul National University and a Ph.D. degree from Purdue University. He is currently a professor at the University of Minnesota. Prof. Kim is the recipient of the University of Minnesota Taylor Award for Distinguished Research, SRC Technical Excellence Award, Council of Graduate Students Outstanding Faculty Award, NSF CAREER Award, Mcknight Foundation Land-Grant Professorship, 3M Non-Tenured Faculty Award, DAC/ISSCC Student Design Contest Award, IBM Faculty Partnership Award, IEEE Circuits and Systems Society Outstanding Young Author Award, the ICCAD Ten Year Retrospective Most Influential Paper Award, ISLPED Low Power Design Contest Award (4 times), and ISLPED Best Paper Award (2 times). His group has expertise in digital, mixed-signal, and memory IC design, with special emphasis on circuit reliability, hardware security, memory circuits, radiation effects, time-based circuits, beyond-CMOS technologies, and machine learning hardware design. He is an IEEE fellow.

 

More information at the IEEE EDS Santa Clara Valley-San Francisco Chapter Home Page

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