The 2009 IEEE International Symposium of Circuits and Systems (ISCAS 2009) will be held in Taipei (Taiwan), on 24-27 May 2009. It will be hosted by the hosted by the National Cheng Kung University.
ISCAS is the largest conference in the area of Circuits and Systems. It is sponsored by the IEEE Circuits and Systems Society. Prestigeous speakers in this field are always invited.
ISCAS 2009 will focus on circuits and systems for Human Centric Smart Living Technologies, including mobile communications, multimedia systems, sensor interface, and biosystems.
The deadline for regular paper submission is October 10 2008 As indicated in the Call for Papers, the scope of ISCAS 2009 includes all topics related to integrated circuits and systems. Papers on compact modeling for circuit design are considered to address some of the topic of the call. In fact, every year a number of interesting papers on compact modeling are presented at ISCAS.
It is important to mention that in ISCAS posters are very well considered, as important as oral presentations. Many authors choose poster as their presentation format.
On the other hand, a "a very entertaining social program is planned. Special tours to tourist attractions will be available to the Symposium attendees and their guests." It Sounds promising, anyway.
Sep 30, 2008
Sep 29, 2008
ITC'09
The 5th International TFT Conference (ITC'09) will take place in the École Polytechnique (near Paris, France) on March 5-6 2009.
ITC is an annual conference which addresses all topics related to Thin Film Transistors (TFTs), from process to circuits, also including simulation and compact modeling.
Abstracts should be submitted not later than November 30 for evaluation.
A number of talks will be given by prestigeous invited speakers.
Key Dates / Schedule
First Call-for-Papers.......................................................................Sep.15, 2008
Submission of Short Abstract........................................................Nov.30, 2008
Acceptance Notification...................................................................Jan.1, 2009
Submission of camera ready manuscript..........................................Feb.1, 2009
Advance Registration.......................................................................Feb.1, 2009
Separate Cover letter
Title of Paper Oral/Poster Preference
Full name, complete mailing address, email address, telephone and fax number of the principal author
Name, Affiliation, city, state, country of additional authors
Abstract
Objective and Background: Briefly describe the goals and intent of your project and give background
factors that led to the new results
Results: Describe, in detail, the specific results that will be presented at the ITC’09.
Impact: Discuss the significance of your work and compare your findings with previously published
work.
All interested authors are requested to submit abstracts for evaluation via the ITC ’09 web site.
No doubt ITC 2009 will be a very interesting conference. Besides, ITC '09 will be held jointly with the SID Mid-Europe Chapter Spring Meeting, an annual meeting attracting many European display professionals.
ITC is an annual conference which addresses all topics related to Thin Film Transistors (TFTs), from process to circuits, also including simulation and compact modeling.
Abstracts should be submitted not later than November 30 for evaluation.
A number of talks will be given by prestigeous invited speakers.
Key Dates / Schedule
First Call-for-Papers.......................................................................Sep.15, 2008
Submission of Short Abstract........................................................Nov.30, 2008
Acceptance Notification...................................................................Jan.1, 2009
Submission of camera ready manuscript..........................................Feb.1, 2009
Advance Registration.......................................................................Feb.1, 2009
Separate Cover letter
Title of Paper Oral/Poster Preference
Full name, complete mailing address, email address, telephone and fax number of the principal author
Name, Affiliation, city, state, country of additional authors
Abstract
Objective and Background: Briefly describe the goals and intent of your project and give background
factors that led to the new results
Results: Describe, in detail, the specific results that will be presented at the ITC’09.
Impact: Discuss the significance of your work and compare your findings with previously published
work.
All interested authors are requested to submit abstracts for evaluation via the ITC ’09 web site.
No doubt ITC 2009 will be a very interesting conference. Besides, ITC '09 will be held jointly with the SID Mid-Europe Chapter Spring Meeting, an annual meeting attracting many European display professionals.
Sep 27, 2008
IRPS 2009
The 2009 IEEE International Reliability Physics Symposium (IRPS) will be held in Montreal, Quebec, Canada, on April 26-30 2009. The venue will be The Fairmont Queen Elizabeth hotel.
For over 40 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronic device reliability. IRPS is now co-sponsored by the IEEE Reliability Society and the IEEE Electron Devices Society. This co-sponsored event has drawn participants from the United States, Europe, Asia and all other parts of the world. IRPS 2009 promotes the reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user’s environment, while demonstrating the latest state-of-the-art developments in electronic reliability.
The focus of the symposium is the 3-day plenary/parallel sessions featuring original work that identifies new microelectronic failure or degradation mechanisms, improves understanding of known failure mechanisms, demonstrates new or innovative analytical techniques, or demonstrates ways to build-in reliability. Specific areas to be addressed during the 2009 IRPS are reliability concerns associated with silicon (integrated circuits, discrete devices, MEMS), non-silicon (bipolar, BiCMOS, LEDs and diode lasers, optical fiber and flat panel displays), and emerging technologies including organic electronics and nanotechnology.
The deadline for abstract submission is October 3 2008.In the Call for Papers, it is said that IRPS can accept papers which "identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems".
Other opportunities at the symposium include:
- A 2-day Tutorial Program. Attendees have the opportunity to learn a new area in some technical depth from an industry expert or brush up on the fundamentals with introductory tutorials. There are typically about 20 tutorials that are offered on topics ranging from back-end reliability to gate dielectric and transistor reliability to circuit/product reliability to assembly/ packaging reliability.
- Reliability Year-In-Review Seminars. These seminars provide a summary of important work published from the previous year in key reliability areas. Industry experts serve as the “tour guide” and save you time by collecting and summarizing this information to bring you up to date in a particular area as efficiently as possible.
- Evening Session Workshops enhance the synergy of the symposium by affording the attendees an opportunity to meet in informal groups to discuss key reliability physics topics with the guidance of experienced moderators. Some of the workshop topics are directly coupled to the tutorial program to allow more discussion on a particular topic.
- Equipment Demonstrations held in parallel with tutorials and technical sessions are a unique aspect of this symposium. Manufacturers of state-of-the-art analytical and test and stress equipment are on hand to demonstrate their products and systems to individuals and small groups. Attendees are encouraged to bring samples or questions for onsite analysis and discussion.
- An Evening Poster Session has become an important part of the IRPS for authors and attendees to discuss recent research and results in a very interactive environment.
EDS Mini-Colloquium on New Frontiers on Compact Modeling
The IEEE Electron Device Society (EDS) organizes Mini-Colloquium (MQ) on New Frontiers on Compact Modeling on October 10 in Santa Clara University, Santa Clara CA, USA.
This MQ is focused on the emerging compact device and interconnect models. Six EDS distinguished lecturers have been invited:
J. J. Liou: "Compact modeling of silicon controlled rectifier for electrostatic discharge (ESD) computer aided design applications"
M. J. Deen: "Noise issues in advanced silicon devices and circuits"
N. Sadachika: "Modeling and characterization of RF/analog and noise using HiSIM2"
B. Yu, Y. Taur, J. Song: "Compact modeling of multiple-gate MOSFETs"
L.F. Register: "Nanoscale MOSFET physics: Observations from non-compact modeling studies"
P.K. Yu: "Wafer bonding for heterogeneous integration"
The Chair person will be Samar Saha, IEEE EDS Compact Modeling Technical Committee Chair, from Silterra USA Inc., San Jose, CA.
This MQ is focused on the emerging compact device and interconnect models. Six EDS distinguished lecturers have been invited:
J. J. Liou: "Compact modeling of silicon controlled rectifier for electrostatic discharge (ESD) computer aided design applications"
M. J. Deen: "Noise issues in advanced silicon devices and circuits"
N. Sadachika: "Modeling and characterization of RF/analog and noise using HiSIM2"
B. Yu, Y. Taur, J. Song: "Compact modeling of multiple-gate MOSFETs"
L.F. Register: "Nanoscale MOSFET physics: Observations from non-compact modeling studies"
P.K. Yu: "Wafer bonding for heterogeneous integration"
The Chair person will be Samar Saha, IEEE EDS Compact Modeling Technical Committee Chair, from Silterra USA Inc., San Jose, CA.
Sep 26, 2008
MOS-AK Meeting in San Francisco!
For the first time there will be a third MOS-AK meeting in one year, and for the first time, the MOS-AK Meeting will be held outside Europe!
In December 2008 a MOS-AK meeting will take place in San Francisco, California, co-located with two important events: the Compact Modeling Council (CMC) Meeting and IEDM'2008.
The call for abstracts is open. If you are interesting in making one presentation, please contact Wladek Grabinski: ")'>
The MOS-AK meeting is one of the main forums on compact modeling in Europe. So far, two editions of the meeting were held: one in spring and another one in September, co-located with the ESSDERC and ESSCIRC conferences. Of course, most of the participants use to be from Europe. It will be very interesting to have a MOS-AK meeting in the US, and have an active participation of compact model developers from America!
In December 2008 a MOS-AK meeting will take place in San Francisco, California, co-located with two important events: the Compact Modeling Council (CMC) Meeting and IEDM'2008.
The call for abstracts is open. If you are interesting in making one presentation, please contact Wladek Grabinski: ")'>
The MOS-AK meeting is one of the main forums on compact modeling in Europe. So far, two editions of the meeting were held: one in spring and another one in September, co-located with the ESSDERC and ESSCIRC conferences. Of course, most of the participants use to be from Europe. It will be very interesting to have a MOS-AK meeting in the US, and have an active participation of compact model developers from America!
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