IWCM'08

The 5th International Workshop on Compact Modeling (IWCM 2008) will be held in the Seoul (Korea) on January 21 2008. The venue will be the Korean Convention & Exhibition Centre (COEX) in Seoul

IWCM is an interesting forum to present and discuss the recent advances in compact modeling and simulation of semiconductor devices and integrated circuits. Actually IWCM is one of the few existing Workshops devoted mostly to compact modeling, and the only one who takes place in Asia.

IWCM is collocated with the 13th Asian and South Pacific Design Automation Conference (ASP-DAC'08).

The topics of IWCM are:
- Compact modeling for all kinds of devices
- Parameter extraction methodology and strategy
- Circuit simulation techniques

Abstracts should be submitted by November 2007.

The invited speakers will be: W. Fichtner (Synopsys, USA), M. Miura-Mattausch (Hiroshima University, Japan) and Y. J. Park (Seoul National University, Korea)

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Cadence Announces Academic Network To Promote Electronic Design Competency In Europe

San Jose, CA and Feldkirchen, Germany -- Cadence Design Systems, GmbH announced the formation of an academic network in Europe to promote the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence. This initiative will establish a knowledge network among selected European universities, research institutes, industry advisors and Cadence to facilitate the sharing of technology expertise in the areas of verification, design and implementation of microelectronic circuits. Universities were selected with particular strengths and competencies in mind-- such as analog mixed-signal, radio frequency (RF), and low power design, all of which have been identified as key challenges for the coming years by the electronics industry. Under the initiative, Cadence will provide software, training and design methodology instruction to each of the institutions. Trained on the latest techniques with leading-edge software, the universities will then share their knowledge with other academic and research institutions. Students from these universities will graduate with an in-depth knowledge of how to tackle the pressing design issues that the industry is facing, learned on the most advanced design automation products available today. So far three universities have joined the network in lead roles: The University of Heidelberg will lead high-level verification methodology; the Technical University of Ilmenau will concentrate on RF design methodology; and the Albert-Ludwigs-University of Freiburg will be the lead university for analog mixed-signal methodology. Planning to join the initiative shortly are the Polytechnic University of Bucharest, Romania, the University of Bristol, UK, and the University of Pavia in Italy. "Our high standards in teaching and research have led Cadence to select us to be the lead university for analog mixed-signal methodology," said Prof. Dr.-Ing. Yiannos Manoli, head of the Microelectronics Group at IMTEK, University of Freiburg and Director of HSG-IMIT. "The increasing demand for highly skilled graduates in microelectronic design requires a solid and broad theoretical knowledge combined with a practical skill set in state-of-the-art techniques. Being part of this network will enable us to instruct our students using leading-edge technology." Sean Redmond, vice president, EMEA for Cadence, said: "With the increase in development of complex industrial electronic systems, our customers are finding that they need engineers with broad technology competence. This network provides an exchange platform for the industry, academia and Cadence to stimulate the use of leading-edge technology at these universities. We are enthusiastic about this initiative and believe that the broad portfolio of Cadence solutions provides a perfect instrument to transfer up-to-date design methodology." SOURCE: RF Globalnet, Cadence Design Systems, Inc.

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Another job for a Compact Modeling Specialist

Compact Model Engineer - Device Physics, C, Matlab, Compact Modeling

Category : Software, Hardware/ EDP

Role : Hardware Design Engineer

Company : Alp Management Consultants Pvt. Ltd. | View all jobs for this company Location : Bangalore

Openings (15) Expires on : 30th Nov 2007

Note: denote mandatory requirements

Job Requirements

Experience : 3 - 6 Yrs Education : Ph. D Electrical, Electronics/ Telecommunications, Instrumentation, Physics

Job Description

Key Skills : Device Physics, C, Matlab, Compact Modeling Description : Job Description : Develop compact models for advanced CMOS, mixed signal, and Radio Frequency technologies. Work closely with device design engineers to define parameter targets that correctly represent the technology goals and device data. Define and debug test programs to device current, capacitance, and S parameters. Use software such as ICCAP to extract parameters for BSIM4, HiCUM, MEXTRAM, or PSP models that optimally describe the device behavior for a single device. Modify those parameters to represent targeted device performance. Release models to circuit design engineers. Work closely with circuit designer engineers debugging circuit performance issues. Desired Experience : 3+ Yrs Required Skills : Device Physics Compact Modeling C, SAS, and/or matlab Problem solving Communication, Teamwork, and Leadership Please forward your updated resume and also refer your friend or colleague who are interested to change. Email : vikas.s@alpconsultants.com Tel : 011 - 46022609(D)

Jobs in compact modelling

More job offers: RF Magic and Kilopass... They are not as known as HP, but perhaps it is worth a look...

Urgent!!!! Job in Compact Modelling

The IHP - Innovations for High Performance Microelectronics

invites applications for a position in

Engineer for CMOS Compact Modelling and Technology Support
AZ 3102/07

The IHP consists of approximately 200 research staff, primarily in the area of wireless communications, including SiGe-based technologies, diagnostics, and materials research. We are working in a multidisciplinary environment, spanning materials, process technology, circuits, and systems. The IHP is housed in a state-of-the-art building 55 minutes from Berlin, with ultra-modern facilities. Our innovations are in worldwide demand.

We are seeking a candidate with a Master degree in Electrical Engineering or Physics in the field of CMOS compact modelling. The main tasks will be the characterization of advanced CMOS devices and extraction of SPICE models for IHP 0.25µm and 0.13µm technologies. Further he has to support statistical analysis of electrical test data.

The successful candidate will be highly motivated with good experimental, computing, and theoretical skills. Experience in semiconductor device physics and in one or more of the following fields would be an advantage: Compact modelling, Silicon IC technology, electrical parameter analysis.

The position offers a unique opportunity to work at the forefront of semiconductor technology in an upcoming new field. We offer a challenging, multinational environment, with excellent career prospects for highly motivated individuals. You will have the opportunity to establish an international reputation at the forefront of high tech.

The position will be filled as quickly as possible. Salary will be on the TV-L scale.

Please send your application letter/e-mail by October 31, 2007 including CV, copies of (scanned) certificates, and addresses of at least one referee to:

Dr. Christel Quick

IHP GmbH

Im Technologiepark 25

15236 Frankfurt (Oder)

Germany

Phone: +49 335 5625 330

Fax: +49 335 5625 666

Email: quick@ihp-microelectronics.com

For further information please contact:

Dr. Rene Scholz

IHP GmbH

Im Technologiepark 25

15236 Frankfurt (Oder)

Germany

Phone: +49 335 5625 647

Fax: +49 335 5625 327

E-mail: scholz@ihp-microelectronics.com