8th EuroSOI-ULIS 2022 at University of Udine (Italy)

Organized by: University of Udine (Italy) Conference chair: Pierpaolo Palestri Local organizing Committee: Francesco Driussi David Esseni Daniel Lizzit Conference Secretariat: Centro Congressi Internazionali  Steering Committee: Francis BALESTRA (IMEP Minatec, France) Maryline BAWEDIN (IMEP-LAHC, France) Cor CLAEYS (KU-Leuven, Belgium) Bogdan CRETU (ENSICAEN, France) Sorin CRISTOLOVEANU (IMEP-LAHC, France) Francisco GAMIZ (UnivGranada, Spain) Elena GNANI (Univ. of Bologna, Italy) Benjamin INIGUEZ  (URV, Spain) Joris LACORD (CEA-Leti, France) Enrico SANGIORGI (Univ.Bologna, Italy) Luca SELMI (Univ. of Modena, Italy) Viktor SVERDLOV (TU Wien, Austria) Andrei VLADIMIRESCU (ISEP, France) Sponsors:

8th Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS) 2022 May 18-20, 2022 – Udine, Italy https://eurosoiulis2022.com The Conference aims at gathering together scientists and engineers working in academia, research centers and industry in the field of SOI technology and nanoscale devices in More-Moore and More-Than-Moore scenarios. High quality contributions in the following areas are solicited: Advanced SOI materials and structures, innovative SOI-like devices. Alternative transistor architectures (FDSOI, Nanowire, FinFET, MuGFET, vertical MOSFET, FeFET and TFET, MEMS/NEMS, Beyond-CMOS). New channel materials for CMOS (strained Si/Ge, III-V, carbon nanotubes; graphene and other 2D materials). Properties of ultra-thin semiconductor films and buried oxides, defects, interface quality; thin gate dielectrics: high-κ and ferroelectric materials for switches and memory. New functionalities and innovative devices in the More than Moore domain: nanoelectronic sensors, biosensor devices, energy harvesting devices, RF devices, imagers, integrated photonics (on SOI), etc. Transport phenomena, compact modeling, device simulation, front- and back-end process simulation. CMOS scaling perspectives; device/circuit level performance evaluation; switches and memory scaling; three-dimensional integration of devices and circuits, heterogeneous integration. Advanced test structures and characterization techniques, parameter extraction, reliability and variability assessment techniques for new materials and novel devices. Original 2-page abstracts with illustrations will be reviewed by the Scientific Committee. The accepted contributions will be published as 4-page letters in a special issue of the Elsevier journal Solid-State Electronics. Extended versions of outstanding papers will be published in a further special issue of Solid-State Electronics. A best poster award will be attributed by ELSEVIER.  The “Androula Nassiopoulou Best Paper Award" will be attributed by the SINANO institute. Important dates: abstract submission deadline: March 1, 2022 notification of acceptance: March 15, 2022

[paper] WEAF Mnecosystem

J. Iannacci^1,2

The WEAF Mnecosystem: a perspective of MEMS/NEMS technologies

as pillars of future 6G, tactile internet and super-IoT

Microsystem Technologies, Oct. 5, 2021.

DOI:10.1007/s00542-021-05230-3

1 Center for Sensors and Devices (DS), FBK Trento, Italy
2 InnerBlender, Bologna, Italy

Abstract: The future 6G and tactile internet (TI) paradigms pose challenges and demand for requirements that are far beyond what the 5G—today at its dawn—will ever achieve. The classical approaches in designing devices, systems and infrastructures will not be suitable to build the AI-driven (Artificial Intelligence) 6G network. This work envisages a critical part for MEMS/NEMS technologies in making 6G turn into reality. Such a leading role sits on a reformulation of the common concept of Hardware (HW) triggered by Micro/Nanotechnologies and Materials. To this end, the WEAF Mnecosystem, i.e. the Water, Earth, Air and Fire Micro/Nanotechnologies Ecosystem, is conceived, leveraging the analogy with the four classical elements in nature, and is explained in details in the following pages, along with the discussion of some reference examples. In a nutshell, Earth and Air are the classical concepts of the Hardware (HW) and Software (SW), respectively. Water is the novel formulation of the concept of HW, which, like water, is liquid in terms of functional characteristics and gains, at the same time, some features typical of the SW (i.e. Air). Fire, eventually, is the HW devoted to harvest, store and transfer energy, raising its level of abstraction to the concept of heat, which flows from warmer to cooler bodies.

Fig: Schematic of the self-recovery design solution [i]: 

a.) Complete schematic of the RF-MEMS micro-relay; 

b.) schematic with the MEMS membrane made invisible 

in order to show the underlying micro-heater

Acknowledgements: The author wishes herewith to express his gratitude to Ms. Moira Osti for designing and realizing all the images included in this work. The author also wants to sincerely say thanks to Brando and Pietro, for accompanying the writing of parts of this work with their energy and unconditional serenity.

REF:

[i] Iannacci J, Repchankova A, Faes A, Tazzoli A, Meneghesso G, Niessner M (2010) Experimental investigation on the exploitation of an active mechanism to restore the operability of malfunctioning RF-MEMS switches. Proc Eng 5:734–737. DOI: /10.1016/j.proeng.2010.09.213