IMEC presented the world's first functional 22nm CMOS SRAM cells made using EUV lithography. The 0.099µm2 SRAM cells are made with FinFETs. In its core EC program PULLNANO, IMEC works together with leading IC companies on future CMOS technologies. Key partners in 2009 are Intel, Micron, Panasonic, Samsung, TSMC, Elpida, Hynix, Powerchip, Infineon, NXP, Qualcomm, Sony, ST Microelectronics. With such concerted collaborations, the semiconductor industry is able to keep innovating and to follow Moore's momentum, noted Luc Van den hove, COO at IMEC.
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