The 2007 European Solid-State Device Research Conference (ESSDERC) and European Solid-State Circuits Conference (ESSCIRC) will be held in Munich from 11 - 13 September 2007 (about one week before Oktoberfest).
As you may know, ESSDERC is the most prestigeous European conference on electron devices. The acceptance rate is usually less than 50%.
The deadline for paper submissions is April 7 2007.
This year compact modeling appears explicitly as one of the themes for papers to be submitted to ESSDERC:
"Compact, numerical, and physical modeling; device simulation; behavior models; quantum mechanical and non-stationary transport phenomena; ballistic transport; scattering models; process dispersions, parameter fluctuations, variability; TCAD; mixed electrical-thermal modeling and simulation."
Furthermore, on September 14 2007, one day after the end of ESSDERC and ESSCIRC, the MOS-AK Workshop on Compact Modeling will take place.