Thursday, February 8, 2007


The 2007 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) will be held this year in Vienna (Sept 25-27 2007), organized by TU-Wien (Technische Universit├Ąt Wien). SISPAD is considered one of the top conference on device and process simulation.

You can find all the information in:

The topics of SISPAD include all kinds of modeling techniques.

I want to remark that, according to the CFP, one of the topics is "Compact device modeling for circuit simulation".

For compact model developers, SISPAD can be a very attractive forum to present new developments and results, and to interact with researchers working in numerical and predictive process and device simulation.

Besides, there are two interesting companion workshops:
1) Workshop on Electromigration Reliability (Sept 24)
2) Workshop on Organic Electronics (Sept 28)

Of course, it is also a good opportunity to enjoy the wonderful city of Vienna!

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