The 2007 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) will be held this year in Vienna (Sept 25-27 2007), organized by TU-Wien (Technische Universität Wien). SISPAD is considered one of the top conference on device and process simulation.
You can find all the information in:
The topics of SISPAD include all kinds of modeling techniques.
I want to remark that, according to the CFP, one of the topics is "Compact device modeling for circuit simulation".
For compact model developers, SISPAD can be a very attractive forum to present new developments and results, and to interact with researchers working in numerical and predictive process and device simulation.
Besides, there are two interesting companion workshops:
1) Workshop on Electromigration Reliability (Sept 24)
2) Workshop on Organic Electronics (Sept 28)
Of course, it is also a good opportunity to enjoy the wonderful city of Vienna!