#paper M. Ba, A. K. Diallo, E. H. B. Ly, J. Launay and P. Temple-Boyer, "Numerical Modeling of Glucose Biosensor With pH-Based Electrochemical Field-Effect Transistor Device," in IEEE TED, vol. 67, no. 4, pp. 1787-1792, April 2020. https://t.co/h8fblSoTWn https://t.co/5G6IJilTPO

#paper M. Ba, A. K. Diallo, E. H. B. Ly, J. Launay and P. Temple-Boyer, "Numerical Modeling of Glucose Biosensor With pH-Based Electrochemical Field-Effect Transistor Device," in IEEE TED, vol. 67, no. 4, pp. 1787-1792, April 2020. https://t.co/h8fblSoTWn pic.twitter.com/5G6IJilTPO

— Wladek Grabinski (@wladek60) April 6, 2020

from Twitter https://twitter.com/wladek60

April 06, 2020 at 10:21AM
via IFTTT

#SI2 adopts #L-UTSOI compact #model for #FDSOI https://t.co/dKivOVohWc https://t.co/iVk1sFuAgU

#SI2 adopts #L-UTSOI compact #model for #FDSOI https://t.co/dKivOVohWc pic.twitter.com/iVk1sFuAgU

— Wladek Grabinski (@wladek60) April 2, 2020

from Twitter https://twitter.com/wladek60

April 02, 2020 at 04:04PM
via IFTTT

Non-invasive #brain #pressure #measurement treats brain as a tuned circuit https://t.co/SsBncRUyMt #paper https://t.co/g91lVvaNGi

Non-invasive #brain #pressure #measurement treats brain as a tuned circuit https://t.co/SsBncRUyMt#paper pic.twitter.com/g91lVvaNGi

— Wladek Grabinski (@wladek60) April 2, 2020

from Twitter https://twitter.com/wladek60

April 02, 2020 at 02:24PM
via IFTTT

#paper Y. Liao et al., "A Compact Model of Analog RRAM With Device and Array Nonideal Effects for Neuromorphic Systems," in IEEE TED, vol. 67, no. 4, pp. 1593-1599, April 2020 https://t.co/G0ciHLCNTt https://t.co/4Kb3pjIjoK

#paper Y. Liao et al., "A Compact Model of Analog RRAM With Device and Array Nonideal Effects for Neuromorphic Systems," in IEEE TED, vol. 67, no. 4, pp. 1593-1599, April 2020https://t.co/G0ciHLCNTt pic.twitter.com/4Kb3pjIjoK

— Wladek Grabinski (@wladek60) April 2, 2020

from Twitter https://twitter.com/wladek60

April 02, 2020 at 11:41AM
via IFTTT

EDS Newsletter [April 2020 Vol. 27, No. 2 Issn: 1074 1879]

EDS Newsletter [April 2020 Vol. 27, No. 2 Issn: 1074 1879]

Delivered by Newsletter Editorial Staff led 

by Dr. Daniel Tomaszewski, ITE, Editor-In-Chief

https://t.co/rX8txCpioS#paper

pic.twitter.com/jXUEaD4p8I
— Wladek Grabinski (@wladek60) April 2, 2020
from Twitter https://twitter.com/wladek60

April 02, 2020 at 09:37AM via IFTTT

Time to #OpenSource #Ventilators from Digital and Cyberspace Policy Program and Net Politics https://t.co/yum408VAoo https://t.co/j1ufYLxwAk

Time to #OpenSource #Ventilators
from Digital and Cyberspace Policy Program and Net Politicshttps://t.co/yum408VAoo pic.twitter.com/j1ufYLxwAk

— Wladek Grabinski (@wladek60) April 1, 2020

from Twitter https://twitter.com/wladek60

April 01, 2020 at 08:28PM
via IFTTT

[C4P] ESSDERC TRACK3 Compact Modeling

European ESSDERC/ESSCIRC conference will be organized in Grenoble (F) on Sept.14-18, 2020 with its integral TRACK3: Compact Modeling and Process/Device Simulation which is open for submissions, now. You and all your R&D partners are welcome to submit a modeling paper. The paper submission deadline is April 17, 2020

TRACK3: Compact modeling and process/device simulation (including TCAD and advanced simulation techniques and studies)  focuses on following domains among other R&D topics:

• Compact/SPICE modeling of electronic, optical, organic, and hybrid devices and their IC implementation and interconnection. 
• Verilog-A models of the semiconductor devices (including Bio/Med sensors, MEMS, Microwave, RF, HV and Power, emerging technologies and novel devices)
• Compact/SPICE parameter extraction
• Performance evaluation and open source (FOSS) benchmarking/implementation methodologies
• Modeling of interactions between process, device and circuit design, 
• Foundry/Fabless interface strategies
• Numerical TCAD, analytical, statistical modeling and simulation of electronic, optical and hybrid devices, interconnect, isolation and 2D/3D integration
• Aspects of materials, fabrication processes and devices e.g. advanced physical phenomena (quantum mechanical and non-stationary transport phenomena, ballistic transport, ...)
• Optical, mechanical or electro-thermal modeling and simulation
• DfM, ageing, reliability of materials and devices

Please share our TRACK3 C4P with all your academic and industrial R&D partners active in the compact/SPICE modeling, Verilog-A standardization and TCAD/EDA simulations. Of course, your and your research team proactive contribution to our TRACK3 is more than welcome. I do hope that despite of a last minute notice, with your help, we will be able to draw even more attention to the ESSDERC/ESSCIRC Conference and, in particular, our modeling TRACK3

-- ESSDERC TRACK3 TPC