Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
11th International MOS-AK Workshop
(co-located with the IEDM and CMC Meetings)
Silicon Valley, December 5, 2018
Together with Silvaco, lead sponsor and local organization team, International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to consecutive, 11th International MOS-AK Workshop which will be organized at Silvaco HQ on Dev. 5, 2018 (co-located with the IEDM and CMC Meetings)
Planned 11th International MOS-AK Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.
Venue:
Silvaco
2811 Mission College Blvd., 6th Floor
Santa Clara, California 95054
Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:
- Compact Modeling (CM) of the electron devices
- Advances in semiconductor technologies and processing
- Verilog-A language for CM standardization
- New CM techniques and extraction software
- Open Source TCAD/EDA modeling and simulation
- CM of passive, active, sensors and actuators
- Emerging Devices, TFT, CMOS and SOI-based memory cells
- Microwave, RF device modeling, high voltage device modeling
- Nanoscale CMOS devices and circuits
- Technology R&D, DFY, DFT and reliability/ageing IC Designs
- Foundry/Fabless Interface Strategies
Important Dates:
- Call for Papers - Sept. 2018
- 2nd Announcement - Nov. 2018
- Final Workshop Program - Oct. 2018
- MOS-AK Workshop: Dec. 5, 2018
Online Abstract Submission is open
Postworkshop IJHSES Publications:
Extended MOS-AK Committee
Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems
WG041018
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