Jun 17, 2020

[paper] Compact Model for Ferroelectric FET

Lu, Darsen, Sourav De, Mohammad Aftab Baig, Bo-Han Qiu, and Yao-Jen Lee
Computationally efficient compact model for ferroelectric field-effect transistors 
to simulate the online training of neural networks
Semiconductor Science and Technology (2020)
DOI: 10.1088/1361-6641/ab9bed

Abstract: In this paper, a compact drain current formulation that is simple and adequately computationally efficient for the simulation of neural network online training was developed for the ferroelectric memory transistor. Tri-gate ferroelectric field effect transistors (FETs) with Hf0.5Zr0.5O2 gate insulators were fabricated with a gate-first high-k metal gate CMOS process. Ferroelectric switching was confirmed with double sweep and pulse programming and erasure measurements. Novel characterization scheme for drain current was proposed with minimal alteration of ferroelectric state in subthreshold for accurate threshold voltage measurements. The resultant threshold voltage exhibited highly linear and symmetric across multilevel states. The proposed compact formulation accurately captured the FET gate-bias dependence by considering the effects of series resistance, Coulomb scattering, and vertical field dependent mobility degradation.
Fig.: Transmission electron micrograph of the fabricated tri-gate Fe
finFET device across the fin, with approximately 60 nm fin width, 30 nm fin
height, and 10 nm HZO Fe layer.

Acknowledgements: This work was jointly supported by the Ministry of Science and Technology (Taiwan) grant MOST–108–2634–F–006–08 and is part of research work by MOST’s AI Biomedical Research Center. We are grateful to the Taiwan Semiconductor Research Institute for nanofabrication facilities and services and to Dr. Wen-Jay Lee and Nan-Yow Chen of the National Center for High-Performance Computing for helpful suggestions on AI computation. This manuscript was edited by Wallace Academic Editing.

#Samsung #MOSIS Collaboration https://t.co/IOrXK5W1Y8 #paper https://t.co/VXZqf03bmY


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June 17, 2020 at 09:14AM
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Jun 16, 2020

Learning with brain chemistry https://t.co/UJRbFdHuUh #paper https://t.co/PB4Ty0moUg


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June 16, 2020 at 05:39PM
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#GNU #Health #Embedded #OpenSource Health Platform Works on Raspberry Pi 3/4, and soon Olimex SBC's https://t.co/mIXu3NfQPy https://t.co/I0tkTqXijs


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June 16, 2020 at 04:46PM
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[paper] TFT Compact Modeling

Arun Dev Dhar Dwivedi, Sushil Kumar Jain, Rajeev Dhar Dwivedi and Shubham Dadhich
Numerical Simulation and Compact Modeling 
of Thin Film Transistors for Future Flexible Electronics
Submitted: July 4th 2019Reviewed: October 28th 2019Published: June 10th 2020
DOI: 10.5772/intechopen.90301

Abstract: In this chapter, we present a finite element method (FEM)-based numerical device simulation of low-voltage DNTT-based organic thin film transistor (OTFT) by considering field-dependent mobility model and double-peak Gaussian density of states model. Device simulation model is able to reproduce output characteristics in linear and saturation region and transfer characteristics below and above threshold region. We also demonstrate an approach for compact modeling and compact model parameter extraction of organic thin film transistors (OTFTs) using universal organic TFT (UOTFT) model by comparing the compact modeling results with the experimental results. Results obtained from technology computer-aided design (TCAD) simulation and compact modeling are compared and contrasted with experimental results. Further we present simulations of voltage transfer characteristic (VTC) plot of polymer P-channel thin film transistor (PTFT)-based inverter to assess the compact model against simple logic circuit simulation using SmartSpice and Gateway.
Fig.: Schematic cross-sectional diagram of organic TFTs 
along with the chemical structure of SAM and organic semiconductor.

Acknowledgments: The authors are thankful to SERB, DST, Government of India, for the financial support under Early Career Research Award (ECRA) for Project No. ECR/2017/000179.

#Intel’s #10nm Node: Past, Present, and Future [EETimes] https://t.co/P3Fi3xUogJ #paper https://t.co/QoFX5z22br


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June 16, 2020 at 02:31PM
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[slides] (Ultra-) Wide-Bandgap Devices

(Ultra-) Wide-Bandgap Devices: Reshaping the Power Electronics Landscape
Presenter Dr. Yuhao Zhang, Assistant Professor,
Center for Power Electronics Systems, Virginia Tech
IEEE EDS SCV-SF Seminar 
Friday, June 12, 2020 at 12PM – 1PM PDT

Abstract: Power electronics is the application of solid-state electronics for the control and processing of electrical energy. It is used ubiquitously in consumer electronics, electric vehicles, data centers, renewable energy systems, and smart grid. The power semiconductor device, as the cornerstone technology in power electronics, is key to improving the efficiency, cost and form factor of power electronic systems.  Recently, the power electronics landscape has been significantly reshaped with the production and application of power devices based on wide-bandgap (WBG) semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC). Besides advancing the performance of traditional power systems, WBG devices have also enabled many emerging applications that are beyond the realm of silicon (Si) as well as changed the manufacturing paradigm of power electronics. On the horizon is the power devices based on ultra-wide-bandgap (UWBG) materials, which promises superior performance over GaN and SiC and is at the relatively early stage of research development.  This talk will provide a comprehensive overview of major WBG and UWBG power device technologies, spanning materials, devices, reliability and applications. Some research projects in the PI’s group in collaboration with industry will also be introduced.
FIG: WBG Semiconductor: Superior Power Semiconductor Over Si

The seminar presentation is now available on our IEEE EDS SCV-SF webpage:
http://site.ieee.org/scv-eds/files/2020/06/SCV_SF_EDS_Yuhao_Zhang_excerpt.pdf

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