Mar 25, 2010
IPL group releases PDK standard
What's next? Under this framework, OpenPDK will base its PDK technology on the OpenAcess database. It will also use several of the components developed by IPL: OA schematic symbols, component description format (CDF) and callbacks. For its part, Si2 will attempt to get the industry to develop standards around several other components: Spice models, tech files and DRC/LVS/LPE. [more]
Mar 22, 2010
Design, Test, Integration & Packaging of MEMS/MOEMS
DTIP 2010, 5-7 May 2010 , Seville, Spain
DTIP 2010 will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France and in 2009 in Rome, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and CMP.
DTIP 2010 will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France and in 2009 in Rome, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and CMP.
Download the call for participation.
Mar 21, 2010
Mar 19, 2010
Big Success in Dresden for new DATE 2010
The conference again proved its World-Wide leadership with attendees from 39 Countries. Germany accounts for a fourth of the attendees, followed by USA and France. China showed a substantial increase and was already number 4 of the participating countries. The number of attendees (1,300) again reached the very high level of the previous years [more].The proceedings of DATE10 are now available on-line.
Mar 17, 2010
[mos-ak] Final Program MOS-AK/GSA Workshop in Rome
Please visit the MOS-AK/Rome Workshop web site:
http://www.mos-ak.org/rome/ with final workshop program
http://www.mos-ak.org/rome/ with final workshop program
April 8-9, 2010 Sapienza Università di Roma
* Free On-line Registration Form:
http://www.mos-ak.org/rome/index.php#Register
* Venue and Recommended Hotels:
http://www.mos-ak.org/rome/index.php#Venue
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