[paper] Open-Source Non-Contact Thermometer

Mohannad Jabbar Mnati^a, Raad Farhood Chisab^b, Azhar M.Al-Rawi^c, Adnan Hussein Ali^a 

and AlexVan den Bossche^d

An Open-Source Non-Contact Thermometer Using Low-Cost Electronic Components 

HardwareX (Elsevier) Available online 6 March 2021, e00183 

DOI: 10.1016/j.ohx.2021.e00183

^aInstitute of Technology Baghdad, Middle Technical University, Baghdad, Iraq
^bTechnical Institute Kut, Middle Technical University (MTU), Baghdad, Iraq
^cElectrical Power Techniques Department, Al-Mamon University College, Baghdad, Iraq
^dDepartment of Electrical Energy, Metals, Mechanical Constructions and Systems Ghent University, Ghent, Belgium

Abstract: Due to the spread of COVID-19 across the world and the increased need for non-contact thermometers to prevent the spread of disease, a new electronic thermometer has been designed and implemented for measuring human body temperature from a distance. This device is currently in use at building entrances to measure the body temperatures of employees, students, and customers. This system is designed using low-cost easy-to-assemble open-source electronic components. The system consists of seven main parts: an Arduino UNO microcontroller, an infrared (IR) thermometer for non-contact temperature measurements (GY-906 MLX90614ESF module), an IR motion sensor (TCRT 5000) for the purpose of contactless initiation of the system, a graphic LCD to display results, a DS3231 clock module for a real-time clock and calendar, and a micro-SD storage board to store device audio instructions.

Fig. The Operating Instructions Flowchart

Acknowledgements: This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

HardwareX - to promote free and open source design

HardwareX, https://t.co/8AD4W1BmPv by Elsevier, is an open access journal established to promote free and open source designing, building and customizing of scientific infrastructure (hardware).https://t.co/HpydEFSA0I#semi pic.twitter.com/GX8GzAjClT

— Wladek Grabinski (@wladek60) March 8, 2021

---

from Twitter https://twitter.com/wladek60

March 08, 2021 at 09:53AM
via IFTTT

The Silicon Saxony industry association requests #European #semi industry funding

The Silicon Saxony industry association has said funding for the #European #semi industry needs to be comparable with that in the United States and also warned against delay https://t.co/IYbcjyznAB pic.twitter.com/jw611i34O7

— Wladek Grabinski (@wladek60) March 7, 2021

---

from Twitter https://twitter.com/wladek60

March 07, 2021 at 11:34PM
via IFTTT

[C4P] SISPAD 2021, September 27-29

International Conference on Simulation of Semiconductor Processes and Devices

SISPAD 2021, September 27-29

The abstract submission deadline April 9th.

Two-page abstract (text and figures, A4, 10 – 12 pt, pdf) should be sent to <sispad2021@utdallas.edu>  Authors of accepted papers are requested to submit a four-page final paper which will be published in the conference proceedings. The deadline for submission of the four-page final paper is July 9, 2021.

The SISPAD conference series provides an open forum for the presentation of the latest results and trends in process and device simulation. The conference is the leading forum for Technology Computer-Aided Design (TCAD) and is held alternatingly in the United States, Japan, and Europe in September.

Original contributions are solicited for SISPAD 2021 on topics that include but are not limited to:

• Modeling and simulation of established semiconductor device, including FinFETs, GAA FETs, ultra-thin SOI devices, optoelectronic devices, TFTs, sensors, power electronic devices, and organic electronic devices.
• Modeling and simulation of emerging devices including tunnel FETs, SETs, spintronic devices, straintronic devices, bio-electronic devices, and new material-based devices for various applications
• Modeling and simulation of interconnects, including noise and parasitic effects
• Modeling and simulation of all sorts of semiconductor processes, including first principles material design, and growth simulation of nano-scale fabrication
• Advances in fundamental aspects of device modeling and simulation, including of charge, spin, and thermal transport, of collective states including spin/magnetic and charge, and of fluctuation, noise, and reliability.
• Numerical methods and algorithms, including grid generation, user-interface, and visualization
• Compact modeling for circuit simulation, including low-power, high frequency, and power electronics applications
• Process/device/circuit co-simulation in context with system design and verification, including for emerging devices
• Modeling and simulation of equipment, topography, lithography
• Benchmarking, calibration, and verification of simulators

Virtual Si Museum /2109/ Oric1

Released on 5 March 1981, the ZX81 was the successor to 1980s ZX80 and, like its predecessor, was based around a Z80 CPU. Two years later, in summer 1983, I bought my Oric1, my first home computer based around a 8-bit 6502A running at amazing CPU clock of 1 MHz. For a reference, next to the Oric1 logo, is Raspberry Pi Zero based around a 32-bit ARM11 running at CPU clock of 1 GHz. What an astonishing CPU clock rate gain over less than 4decades = 1000 time faster:

Fig.1: The Oric1 and, next to its logo, Raspberry Pi Zero

Fig.2: The Oric1 connectivity (Left to right): display output to drive a PAL UHF TV;  RGB output on a 5 pin DIN 41524 socket; cassette recorder connector via a 7 Pin DIN 45329 socket; printer port, compatible with the then-standard Centronics parallel interface; expansion port allowing full access to the CPU's data address and control lines including external ROM and RAM access/expansion.

REF:

• ZX81: https://en.wikipedia.org/wiki/ZX81
• Oric1: https://en.wikipedia.org/wiki/Oric
• MOS Technology 6502: https://en.wikipedia.org/wiki/MOS_Technology_6502
• Centronics: https://en.wikipedia.org/wiki/Centronics
• Raspberry Pi Zero: https://en.wikipedia.org/wiki/Raspberry_Pi#Pi_Zero