Dec 11, 2020

IEEE Connecting Experts


Dear IEEE Young Professionals,
as part of our IEEE Connecting Experts program, together with IEEE Croatia Section, we are bringing you a panel about design thinking in STEM area and project-based education through interdisciplinary teams, going beyond engineering, to prepare students for the marketplace. The technical talk entitled "Interdisciplinary Project-based Learning" is organized in collaboration with IEEE Croatia Section and is starting tomorrow, December 11 at 15:10 UTC.

MS Teams details
You can join the session here.

About the topic
In this interactive session, the development, design, and implementation of an interdisciplinary project-based learning approach at the WSU will be presented and discussed by the team who designed it and tested its performance. The project called SOAR (STEM-Oriented Alliance for Research) offers a transformative educational experience to students, merging coursework across three different academic disciplines. Science, Technology, Engineering, and Math (STEM) education has been challenged by industries to incorporate business and communication experiences (and vice versa) that prepare students for the workplace. Incorporating interdisciplinary project-based coursework provides experiential learning for students, a skillset that employers indicate as desirable.
The data obtained during the work on the SOAR project suggest that the collaboration in interdisciplinary project-based learning does initially produce disorientation, some trepidation, and confusion. However, ultimately these disorienting dilemmas lead to transformative learning, increased confidence, and cohesion among disciplines. The results of this paper will inform and guide engineering educators in creating interdisciplinary project-based coursework that meets the growing demands of the workplace of today and the future.
To engage in the interactive part of the session, you will need the link: www.pollev.com/jmurray180
All this project, and this Workshop, really is about is how to make students engage their full creativity potentials and make learning more interesting and, ultimately, useful and applicable in the fast-changing economy and society. 

About the speakers
It is our pleasure to host a wonderful team of professors from the Washington State University, Everett:
  • Prof. Lucrezia Cuen Paxson, Clinical Assistant Professor, Edward E. Murrow College of Communication,
  • Dr. Mark Beattie, Associate Vice Chancellor for Academic Affairs and Clinical Assistant Professor in the School of Hospitality Business Management,
  • Dr. Jacob Murray, Clinical Assistant Professor and Program Coordinator for the School of Electrical Engineering and Computer Science,
  • Dr. Soobin Seo, Assistant Professor of hospitality business management at the WSU Everett.

You can check our real-time schedule of talks in the IEEE Connecting Experts Calendar and follow us and our live streams on our Facebook page or YouTube channel.  

Kind regards,
Dubravko Sabolic - IEEE Croatia Section
Vinko Lesic - IEEE Region 8 Young Professionals

Dec 10, 2020

[Foreword] Special Issue on Compact Modeling of Semiconductor Devices

Foreword
Special Issue on Compact Modeling of Semiconductor Devices
DOI: 10.1109/JEDS.2020.3039023

THIS Special Issue is dedicated to recent research in the field of compact modeling of semiconductor devices. This is the first J-EDS Special Issue on compact modeling. In the last years, a number of new semiconductor device structures, for electronic and photonic applications, have been developed. Compact models are needed for the incorporation of these new devices in integrated circuits. Therefore, a Special Issue was needed to present recent compact modeling solutions for semiconductor devices

A total of 8 regular papers and 2 invited papers have been accepted in this Special Issue. All papers, including the invited ones, were subjected to a thorough peer reviewing. A high number of reviewers participated in this process. This has resulted in a Special Issue containing very high-quality papers.  The published papers target compact modeling aspects for a wide number of devices, such as SiGe HBTs, IGBTs, SiC SB diodes, LDMOSFETs, Multi-Gate MOSFETs, RRAMs, TFET SRAMs, and organic TFTs. Open source Verilog-A compil- ing is also targeted by one paper. Different operation regimes and conditions are addressed: charging/discharging, THz, high power, tunneling radiation environments, . . . 

One invited paper, by U. Sharma and S. Mahapatra, addresses the modeling of HCD Kinetics for full VG/VD span under different experimental conditions across architectures and its SPICE implementation The other invited paper, by Fregonese et al., presents a review of THz characterization and modeling of SiGE HBTs.

I [BJ] would like to thank the work done by the rest of the Editors of this Special Issue and also by all the reviewers who participated in this process. And of course, I want to thank all the authors for their interest in submitting papers to this Special Issue. Thanks to authors, reviewers, and editors, this high-quality Special Issue has been possible.

BENJAMIN IÑIGUEZ, Guest Editor-in-Chief
Department of Electronic, Electrical and
Automatic Control Engineering
University Rovira i Virgili
43007 Catalonia, Spain

YOGESH SINGH CHAUHAN, Guest Associate Editor
Department of Electrical Engineering
Indian Institute of Technology Kanpur
Kanpur 208016, India

SLOBODAN MIJALKOVIC, Guest Associate Editor
Simulation Group
EDA Division
Silvaco Europe Ltd.
Cambridgeshire PE27 5JL, U.K.

KEJUN XIA, Guest Associate Editor
Department of Front End Innovation
NXP Semiconductors
Chandler, AZ 85224 USA
JUNG-SUK GOO, Guest Associate Editor
Department of Compact Model Development
GLOBALFOUNDRIES Inc.
Santa Clara, CA 95054 USA

MARCELO PAVANELLO, Guest Associate Editor
Department of Electrical Engineering
Centro Universitario FEI
09850-901 São Bernardo do Campo, Brazil

MAREK MIERZWINSKI, Guest Associate Editor
Department of PathWave Software and Solutions
Keysight Technologies
Santa Rosa, CA 95403 USA
(e-mail: )

WLADEK GRABINSKI, Guest Associate Editor
Department of Research and Development Modelling
GMC Consulting
1291 Commugny, Switzerland

Dec 9, 2020

James D. Meindl, master of integrated circuits, dies at 87

Meindl was a visionary engineer who saw the potential of integrated circuits and was an early proponent of an interdisciplinary approach to engineering research [read more by Andrew Myers]

In 1984, electrical engineering professors James D. Meindl (right) and John Hennessy (center) brainstorm with research engineer John Shott about the MIPS project, which simplified computers with RISC architecture. (Image credit: Chuck Painter / Stanford News Service)

Dec 8, 2020

Solid-State Electronics Editorial Board

Solid-State Electronics Editorial Board
DOI: 10.1016/S0038-1101(20)30401-9



FOUNDING EDITOR
Dr W. Crawford Dunlap

EDITORS
Enrique Calleja
Dept. of Electronic Engineering (ISOM), 
ETSI Telecommunication,
Universidad Politécnica de Madrid 
(UPM), 28040 Madrid, Spain

Sorin Cristoloveanu 
Grenoble INP, Ref: LPCS-SSE, 46 av. Felix Viallet, 
F-38031 Grenoble Cedex 1, France

Kuniyuki Kakushima
Tokyo Institute of Technology, Midori-ku, Yokohama, Japan

Alexander Zaslavsky
Solid State Electronics, Brown University Engineering, 
182 Hope Street, Providence, RI 02912, USA


EDITORIAL ADVISORY BOARD
  • G. Baccarani, Bologna, Italy
  • J. Chennupati, Australian National University, Canberra, Australia 
  • L. Colombo, Dallas, TX, USA
  • G. Ghibaudo, Grenoble, France
  • S. Hall, Liverpool, UK
  • T. Hashizume, Saitama, Japan
  • R. Huang, Peking University, Beijing, China
  • S. Hwang, Yongin-si, Gyeonggi-do, South Korea
  • S. Keller, Santa Barbara, CA, USA
  • J.-H. Lee, Gwanag-Gu, Seoul, South Korea
  • C. McAndrew, Tempe, AZ, USA
  • J.-M. Sallese, EPFL, Switzerland
  • J. Schmitz, Enschede, Netherlands
  • A. Seabaugh, Notre Dame, IN, USA
  • M. S. Shur, Troy, NY, USA
  • A. Waag, Braunschweig, Germany
  • H. Wong, City University of Hong Kong, Kowloon, Hong Kong

Incize Newsletter (Q4-2020)


on research & development at Incize
 
Incize currently has 7 ongoing research projects. The research projects revolve around materials and innovative characterization techniques to serve the 5G technologies and beyond. Take a look at two projects: Porous Silicon and Contactless Measurements.

Porous Silicon

Pre-processed and Post-processed (Incize's solution) porous silicon integration. From research and development to prototyping, we customise it to fit your application needs. Check out our porous services here.

Contactless Measurements

Incize is working towards contactless measurements to enable quick characterization with a dedicated research project. After two years of R&D in Phase 1, Phase 2 has just kicked off with the funds of the Walloon Region and cooperation with the 'haute école de la province de Liège'.

Want to co-develop a R&D project? Our experts are here for you.
Contact us
Incize interview - SOI Industry Consortium

Interview with SOI Industry Consortium

5G is imminent. Incize researches new materials, and how to respond to new challenges in design and characterization for 5G communication systems/technologies, and beyond. 

Mostafa Emam, founder and CEO of Incize talks about how the company is getting ready for 5G in an interview for SOI Industry Consortium.
Read the article here.

Meet our new team member - Romain

Meet Romain


In October 2020, Romain Tuyaerts joined Incize as a senior engineer. Romain is now part of the process team, his current research interests include micro-fabrication techniques, and the integration of porous silicon in various applications such as RF microelectronics.
 

Romain received his master degree in physical engineering, with an orientation in nanotechnologies. 
He continued with a PhD in materials science at UCLouvain, obtained in 2018, focused on the coupling between micro-structure, mechanical, optical, and electrical properties of transparent conductive oxides deposited by reactive sputtering.

Visit Incize website, now