Dec 17, 2024

[job opening] Assembling Design Kit (ADK) Developer

IHP's growing Open Source PDK group is seeking a new team member!

The open-source initiative is evolving rapidly with many plans for the future, and this role is critical for driving the development of an Assembling Design Kit (ADK) for hetero and chiplet integration projects.

As part of the Research & Prototyping Service group, you will develop open-source EDA tool support, evaluate design tools for ASICs on a common substrate, implement and document the ADK, and focus on mixed-signal and RF applications up to 100 GHz, utilizing both open-source and proprietary tools.

The ideal candidate holds a Master’s degree in Computer Science with a background in semiconductors, physics, or electrical engineering. Expertise in ASIC design environments, Linux scripting (Python, Perl, TCL), and semiconductor devices is highly valued, as is knowledge of chip packaging and board development concepts. Strong organizational, communication, and teamwork skills are essential, along with fluency in English.

If you’re interested in open-source development at IHP and would like to explore other aspects of our initiatives, we welcome you to send us an unsolicited application - let’s explore how you can contribute to our growing team!

Dec 9, 2024

[Program Highlights] 17th International MOS-AK Workshop Silicon Valley, December 11, 2024

image.png 
17th International MOS-AK Workshop
Silicon Valley, December 11, 2024

Final MOS-AK Workshop Program

The 17th International MOS-AK Workshop on Compact/SPICE Modeling will online on Dec.11, 2024, in the timeframe of IEDM and Q4 CMC Meetings. This event is coorganized by Keysight Technologies, our local online host and partner, and the Extended MOS-AK TPC Committee. We cordially invite you to participate in the upcoming MOS-AK workshop, where you will have the opportunity to learn from leading experts in the field of the SPICE and Verilog-A modeling, OpenPDKs, and FOSS CAD/EDA IC designs. This event promises to be an invaluable experience for professionals and enthusiasts alike, offering deep insights and practical knowledge in these critical areas of the electron devices modeling and electronic design automation. The MOS-AK workshop program is available online and selected highlights are listed here:
 

Dec 2, 2024

[mos-ak] [2nd Announcement] 17th International MOS-AK Workshop Silicon Valley, December 11, 2024


17th International MOS-AK Workshop 
Silicon Valley, December 11, 2024
   
2nd Announcement and C4P

The 17th International MOS-AK Workshop on Compact/SPICE Modeling will take place on Dec.11, 2024, in the timeframe of IEDM and Q4 CMC Meetings. This event is coorganized by Keysight Technologies, our local online host and partner, and the Extended MOS-AK TPC Committee. We cordially invite you to participate in the upcoming MOS-AK workshop, where you will have the opportunity to learn from leading experts in the field of the SPICE and Verilog-A modeling, OpenPDKs, and FOSS CAD/EDA IC designs. This event promises to be an invaluable experience for professionals and enthusiasts alike, offering deep insights and practical knowledge in these critical areas of the electron devices modeling and electronic design automation.

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:
  • Compact Modeling (CM) of the electron devices
  • Advances in semiconductor technologies and processing
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • Open Source (FOSS) TCAD/EDA modeling and simulation
  • CM of passive, active, sensors and actuators
  • Emerging Devices, Organic TFT, CMOS and SOI-based memory
  • Microwave, RF device modeling, high voltage device modeling
  • Device level modeling for Agroelectronics, Bio/Med, IoT applications
  • Device cryogenic operation for Quantum Computing 
  • Nanoscale semiconductor devices/circuits and its reliability/ageing
  • Technology R&D, DFY, DFT and IC Designs
  • Foundry/Fabless Interface Strategies, Open Access PDK
    (eg: Skywater 130nm CMOS, GF 180nm, IHP 130nm RF BiCMOS, OpenSUSI) '
Online Abstract Submission is open 
(any related enquiries can be sent to abstracts@mos-ak.org)
(any related enquiries can be sent to registration@mos-ak.org)

Important Dates:
  • 2nd Announcement: Nov. 2024
  • Final Workshop Program: Dec. 2024
  • MOS-AK Workshop: Dec.11, 2024
    • in timeframe of Q4 CMC and IEDM Meetings
W.Grabinski for Extended MOS-AK Committee

WG021224

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Nov 29, 2024

1st Semiconductor Design Workshop in Yamagata

Ministry of Economy, Trade and Industry
Tohoku Bureau of Economy, Trade and Industry

1st Semiconductor Design Workshop in Yamagata
Date: December 20, 2024 (Friday)
Time: 1:00pm-5:00pm

Why not experience semiconductor design hands-on with the instructor on your own PC? This is a valuable opportunity to learn the basics of semiconductor design with intimate and detailed guidance in a small class setting.





Nov 26, 2024

[paper] Roadmap for Schottky Barrier Transistors

Eva Bestelink1*, Giulio Galderisi2, Patryk Golec1, Yi Han3, Benjamin Iniguez4, Alexander Kloes5, Joachim Knoch6, Hiroyuki Matsui7, Thomas Mikolajick2,8, Kham M. Niang9, Benjamin Richstein6, Mike Schwarz5, Masiar Sistani10, Radu A. Sporea1, Jens Trommer2, Walter M. Weber10,
Qing-Tai Zhao3 and Laurie E. Calvet11
Roadmap for Schottky Barrier Transistors
IOP Nano Futures in press (2024)
DOI: 10.1088/2399-1984/ad92d1

1 Advanced Technology Institute, University of Surrey, Guildford, UK
2 Namlab gGmbH, Nöthnitzer Str. 64a, 01187 Dresden, Germany
3 Peter Grünberg Institute, Forschungszentrum Jülich, 52428 Jülich, Germany
4 DEEEA, Universitat Rovira I Virgili, Tarragona, Spain,
5 NanoP, THM University of Applied Sciences, 35390 Giessen, Germany,
6 Institute of Semiconductor Electronics, RWTH Aachen University, Germany
7 Research Center for Organic Electronics (ROEL), Yamagata University, Japan
8 Chair for Nanoelectronics, TU Dresden, Germany
9 Electrical Engineering, Cambridge University, UK
10 Institute of Solid State Electronics, TU Wien, Vienna, Austria
11 LPICM, CNRS-Ecole Polytechnique, IPP, 91120 Palaiseau, France


Abstract: In this roadmap we consider the status and challenges of technologies that use the properties of a rectifying metal-semiconductor interface, known as a Schottky barrier, as an asset for device functionality. We discuss source gated transistors, which allow for excellent electronic characteristics for low power, low frequency environmentally friendly circuits. Also considered are reconfigurable field effect transistors, where the presence of two or more independent gate electrodes can be used to program different functionalities at the device level, providing an important option for ultrasecure embedded devices. Both types of transistors can be used for neuromorphic systems, notably by combining them with ferroelectric Schottky barrier transistors, which enable a large number of analog states. At cryogenic temperatures, SB transistors can advantageously serve for the control electronics in quantum computing devices. If the source/drain of the metallic contact becomes superconducting, Josephson junctions with a tunable phase can be realized for scalable quantum computing applications. Developing applications using Schottky barrier devices requires physicsbased and compact models that can be used for circuit simulations, which are also discussed. The roadmap reveals that the main challenges for these technologies are improving processing, access to industrial technologies and modeling tools for circuit simulations.

Fig: Illustration of the different applications of the SB Devices

Aknowleegements: RAS and EB acknowledge support from the Engineering and Physical Sciences Research Council (EPSRC) under Grants EP/V002759/1, EP/R028559/1, and EP/R511791/1, and from the Royal Society of Great Britain under Grants IES\R2\202056, IES\R3\193072, IEC\R3\183042, and IES\R3\170059. JT and GG are supported from the European Union’s Horizon Europe research and innovation programme under grant agreement No 101135316, SENSOTERIC. LEC and BI are supported from the European Union’s Horizon Europe research and innovation program under grant agreement No 101099555, BAYFLEX. Q-T Zhao, Y. Han, B. Richstein and J. Knoch gratefully acknowledge support from Deutsche Forschungsgemeinschaft under grant nos. KN 545/28, KN 545/29, and ZH-639/3. Q-T Zhao acknowledges partially support by the German BMBF project “NeuroTEC” (16ME0398K). KMN acknowledges support from the Engineering and Physical Sciences Research Council (EPSRC) under Grants EP/M013650/1 and EP/W009757/1. LEC acknowledges funding from the ANR under contract ANR-21-FAI1-0006-01.




Nov 20, 2024

[paper] Bendable non-silicon RISC-V microprocessor

Emre Ozer, Jedrzej Kufel, Shvetank Prakash2, Alireza Raisiardali, Olof Kindgren3, Ronald Wong,
Nelson Ng, Damien Jausseran, Feras Alkhalil, David Kong2, Gage Hills2, Richard Price
and Vijay Janapa Reddi2
Bendable non-silicon RISC-V microprocessor
Nature, vol. 634, pp. 341–346 (2024) 
DOI: 10.1038/s41586-024-07976-y

1 Pragmatic Semiconductor, Cambridge, UK
2 Harvard University, Cambridge, MA, USA
3 Qamcom, Karlstad, Sweden

Abstract: Semiconductors have already had a very profound effect on society, accelerating scientific research and driving greater connectivity. Future semiconductor hardware will open up new possibilities in quantum computing, artificial intelligence and edge computing, for applications such as cybersecurity and personalized healthcare. By nature of its ethos, open hardware provides opportunities for even greater collaboration and innovations across education, academic research and industry. Here we present Flex-RV, a 32-bit microprocessor based on an open RISC-V instruction set fabricated with indium gallium zinc oxide thin-film transistors on a flexible polyimide substrate, enabling an ultralow-cost bendable microprocessor. Flex-RV also integrates a programmable machine learning (ML) hardware accelerator inside the microprocessor and demonstrates new instructions to extend the RISC-V instruction set to run ML workloads. It is implemented, fabricated and demonstrated to operate at 60kHz consuming less than 6mW power. Its functionality when assembled onto a flexible printed circuit board is validated while executing programs under flat and tight bending conditions, achieving no worse than 4.3% performance variation on average. Flex-RV pioneers an era of sub-dollar open standard non-silicon 32-bit microprocessors and will democratize access to computing and unlock emerging applications in wearables, healthcare devices and smart packaging.

FIG a. Layout of the 9×6 mm2 test chip containing two Flex-RV microprocessors
b. The FlexPCB on which the die is assembled.

Data availability
Source data are provided with this paper.

Code availability
Serv is an open-source CPU, which is freely available at GitHub (https://github.com/olofk/serv). The source code of the test benchmarks, the changes made in the Serv CPU Verilog code, and the Verilog code of the ML hardware accelerator are available from the corresponding author upon request.

Nov 18, 2024

[WOSET] Q&A at OpenPDK session


Indira Iyer AlmeidaSumanto KarWladek Grabinski joined a great Q&A at #OpenPDK session at #WOSET

Workshop on Open-Source EDA Technology (WOSET) was organized by Prof. Matthew Guthaus and his R&D Team. WOSET 2024 Schedule is available online


 

 




Nov 14, 2024

[paper] TCAD for Circuits and Systems

Z. Stanojevic, X. Klemenschits, G. Rzepa, F. Mitterbauer, C. Schleich,
F. Schanovsky, O. Baumgartner, and M. Karner
TCAD for Circuits and Systems: Process Emulation, Parasitics Extraction, Self-Heating
2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium
BCICTS, Fort Lauderdale, FL, USA, 2024, pp. 294-297
doi: 10.1109/BCICTS59662.2024.10745677

1 Global TCAD Solutions GmbH., Boesendorferstraße 1/12, 1010 Vienna, Austria

Abstract: We present TCAD-based methodologies that go beyond process and device simulations of single transistors. We show that TCAD solvers can be used as effective tools to resolve the intricacies of current and future technology nodes that are otherwise difficult to access using EDA-level methods alone.

Fig: Single NMOS/PMOS FinFET with the local contacts and their parasitic R/C-components; fitting results for NMOS and PMOS FinFET: gate capacitance, transfer characteristics, output characteristics


[paper] Open-source Cell Libraries

Chenlin Shi1, Shinobu Miwa1, Tongxin Yang1, Ryota Shioya2, Hayato Yamaki1
and Hiroki Honda1
"CNFET-OCL: Open-source Cell Libraries for Advanced CNFET Technologies"
IEEE Access (2024)
DOI: 10.1109/ACCESS.2024.0429000

1 Department of Computer and Network Engineering, The University of Electro-Communications, Chofu, Tokyo (J)
2 Department of Creative Informatics, Graduate School of Information Science and Technology, Uni Tokyo, Bunkyo (J)

Abstract: In this paper, we propose CNFET-OCL, the first open-source cell libraries for 5-nm and 7nm carbon nanotube field-effect transistor (CNFET) technologies. Our CNFET-OCL is designed to emulate the predictive 5-nm and 7-nm CNFET technologies presented in a published paper. We achieved this by performing a number of SPICE simulations based on an open-source CNFET SPICE model and making certain assumptions used in previous work. Each of our cell libraries includes two types of delay model (i.e., the composite current source and nonlinear delay model), each having 56 typical standard cells, which is sufficient to design various VLSI circuits. CNFET-OCL fully supports both logic synthesis and timing-driven place and route design in the Cadence design flow. Our experimental results demonstrate that CNFET-OCL can achieve performance levels comparable to those reported in previous studies on CNFETs. Consequently, CNFET-OCL can serve as an effective evaluation tool for the CNFET research community.
FIG: I–V characteristics of transistors used in CNFET5, CNFET7 and ASAP7
with cross-section of a CNFET device.

Acknowledgments: This work is partially supported by JSPS KAKENHI under grant number 18K19778 and 23K18461, and VLSI Design and Education Center (VDEC), The University of Tokyo with the collaboration with CADENCE Corporation and Synopsys Corporation. We thank Logic Research Co., Ltd. for helping generate the LIBERTY files and Edanz (https://jp.edanz.com/ac) for editing a draft of this manuscript. We also thank Mr. Dooseok Yoon for his invaluable help with the SPICE netlist simulation of PROBE3.0.

Nov 12, 2024

[anysilicon.com] Open Source CAD/EDA Tools

A List of Open Source EDA Tools
<https://anysilicon.com/the-ultimate-guide-to-open-source-eda-tools/>

The FOSS CAD/EDA tools outlined adhere to establish an open source design flow, essential for IC development. The process involves several steps: describing IC schematics, analog/RF circuits, digital circuit in HDL format, followed by synthesis, placement and routing, and culminating with post-layout simulations.

CppSim: has been actively used since 2002. It is used for commercial and academic purposes. It performs system-level simulations of mixed-signal circuits. It automatically produces, compiles, and executes C++ code per the schematic design you produce.

Electric: among one the powerful CAD systems which can handle different types of circuit design tasks including MOS, Bipolar, schematics, printed circuitry, hardware description languages, etc. It can analyze design rule checking, simulation, and network comparison. It can perform synthesis as well, like routing, compaction, silicon compilation, PLA generation, and compensation.

eSim: an integrated tool built from open source software such as KiCad, Ngspice, Verilator, Makerchip, GHDL, and OpenModelica. It is an EDA tool for circuit design, simulation, and analysis.

IRSIM: a tool for simulating digital circuits. It is a switch-level simulator, where transistors are treated as ideal switches. In this simulator, the circuit under simulation can be modified and then incrementally restimulated. It maintains the history of circuit activity and only restimulates the part of the circuit that deviates from its history.

Mosaic: Analogue integrated circuit designs can be created and simulated using the tool mosaic. It emphasizes a cutting-edge, user-friendly interface, immediate design feedback, design reuse, verification, and automation. Regardless of your internet connection, Mosaic will remain quick and accessible and synchronize your modifications when you reconnect.

Ngspice: An open-source mixed-signal SPICE simulator. ngspice has a command line input interface and plots the waveforms. This tool offers active development and improved stability. ngspice is based on three open-source free-software packages: Spice3f5, Xspice, and Cider1b1:

QUCS(Quite Universal Circuit Simulator): a well-advanced circuit simulator that supports all kinds of simulations like DC, AC, s-parameter, noise, transient analysis, etc. It allows importing existing SPICE models as well.

X Circuit: The schematic diagrams drawn from the schematic capture program do not produce an image that is suitable for publication. Engineers have to draw the schematic with the help of general-purpose drawing tools. It is a drawing tool that is specifically for circuits only. It can produce high-quality schematic diagrams and other figures that are suitable for publication purposes.

Xschem: a schematic capture program for VLSI and ASIC design.

XYCE: a SPICE-compatible software, written in C++ and using MPI (Message Passing Implementation). It also includes Trilinos ( Sandra’s open source library), which includes KLU direct solver and many more circuit-specific solvers.

ChipVault: an organization tool for HDL. It allows for hierarchical file navigation, sorting, and editing.

EDA Playground: a free web application for HDL (including Verilog, system Verilog, VHDL, and other HDLs) simulations and synthesis. It generates a browser-based waveform viewer after a successful simulation. It is easy to use because no download is required and code sharing is easy.

GHDL: translates VHDL files directly into machine code and hence faster compilation and analysis of code than any other interpreted simulator.

Icarus Verilog: a compiler for Verilog HDL as described in the IEEE-1364 standard. With the help of written Verilog code, it compiles the code into some target format. This tool supports a waveform viewer named GTKWave.

Migen: a python-based tool that applies advanced software concepts like OOPs, and metaprogramming in the VLSI design process and building complex digital hardware. It is a brand new programming language based on FHDL

Yosys: a synthesis tool that can handle Verilog code and can synthesize complex projects as well.

Fairly Good Router: a software for routing, based on Lagrange multipliers. It is an academic tool and it is based on similar routers used on industrial levels.

KLayout: KLayout is an editor that helps with the layout. It is also helpful in changing and creating GDS and OASIS files.

Magic: is considered one of the easiest tools for circuit layout. This tool supports LVS and DRC as well.

QRouter: a tool for routing based on the standard Lee maze routing algorithm. It supports LEF and DEF formats as input and output.

OpenSTA: is used to verify the timings of a circuit at the gate level.

OpenTimer: A high-performance, commercial-grade timing analysis tool. It helps IC designers with its interactive analysis to verify circuit timings. It supports both path-based and graph-based timing analysis. It is relatively a new tool that supports industry-standard format support like  .lib, .v, .spef, and .sdc.

HiTas: Another tool for static timing analysis.

Netgen: is a verification tool for comparing a layout to a netlist. To ensure this physical verification and LVS is carried out.  Netgen version 1.5 is considered a commercial-grade tool.

Dragon: is an effective tool for standard cell placement for variable and fixed die ASIC design.

Gdsfactory: Since gdsfactory is entirely written in Python, some Python concepts are necessary. It is built on top of KLayout, gdspy (Python library for producing GDSII files), and Phidl (Python module for GDS layout and cad geometry).

Alliance/Coriolis VLSI CAD Tools: Alliance / Coriolis is a free software toolchain for VLSI design. The input is HDL (Verilog or VHDL) and the output is GDSII, which is all set for ASIC manufacture.

Qflow: Provides a set of tools and methods to turn an HDL code (written in Verilog or VHDL) into a physical circuit. It is capable of handling sub-systems like host-to-device communication, signal processing, arithmetic logic unit, etc.

OpenLane:  An automated VLSI design flow for digital synthesis. It is a collection of open-source tools. It performs all the tasks from RTL to GDS-II with the help of a predefined set of commands for design explanation and optimization. It has two modes.

OpenROAD: is a flow of open source tools for ASIC design. The whole flow is automated for digital SoC layout generation, focusing on the RTL-to-GDSII phase of system-on-chip design.

Silicon Compiler: automatically translates source code to hardware design. There are three steps.

IBTIDA:Fully open-source ASIC implementation of Chisel-generated System on a Chip

Nov 4, 2024

Recent Compact Modeling Papers

[1] Hao Su, Yunfeng Xie, Yuhuan Lin, Haihan Wu, Wenxin Li, Zhizhao Ma, Yiyuan Cai, Xu Si, Shenghua Zhou Guangchong Hu, Yu He Feichi Zhou, Xiaoguang Liu, Longyang Lin, Yida Li, Hongyu Yu, and Kai Chen; "Characterizations and Framework Modeling of Bulk MOSFET Threshold Voltage Based on a Physical Charge-Based Model Down to 4 K." In 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), pp. 733-736. IEEE, 2024. doi: 10.1109/ESSERC62670.2024.10719583

[2] Tung, Chien-Ting, Sayeef Salahuddin, and Chenming Hu; "A SPICE-Compatible Neural Network Compact Model for Efficient IC Simulations." In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 01-04. IEEE, 2024.

[3] Jana, Koustav, Shuhan Liu, Kasidit Toprasertpong, Qi Jiang, Sumaiya Wahid, Jimin Kang, Jian Chen, Eric Pop, and H-S. Philip Wong; "Modeling and Understanding Threshold Voltage and Subthreshold Swing in Ultrathin Channel Oxide Semiconductor Transistors." In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 01-04. IEEE, 2024.

[4] Manganaro, Gabriele. "Rethinking mixed-signal IC design." In 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), pp. 552-556. IEEE, 2024

[5] Wager, John F., Jung Bae Kim, Daniel Severin, Zero Hung, Dong Kil Yim, Soo Young Choi, and Marcus Bender; "Dual-Layer Thin-Film Transistor Analysis and Design." IEEE Open Journal on Immersive Displays (2024).

Oct 28, 2024

[paper] FOSS support for CM with Verilog-A

Bűrmen, Árpád, Tadej Tuma, Iztok Fajfar, Janez Puhan, Žiga Rojec, Matevž Kunaver
and Sašo Tomažič
Free software support for compact modelling with Verilog-A
Informacije MIDEM 54, no. 4 (October 9, 2024)

Abstract: Verilog-A is the analog subset of Verilog-AMS - a hardware description language for analog and mixed-signal systems. Verilog-A is commonly used for the distribution of compact models of semiconductor devices. For such models to be usable a Verilog-A compiler is required. The compiler converts the model equations into a form that can be used by the simulator. Such compilers have been supplied with commercial simulators for many years now. Free software alternatives are much more scarce and limited in the features they offer. The paper gives an overview of Verilog-A, Free software Verilog-A compilers, and Free software/Open source simulators that can simulate compact models defined in Verilog-A. Advantages and disadvantages of individual compilers and simulators are highlighted.

Tab: Comparison of Free software simulators
Asterisk denotes a feature under development as of Sep. 2024

Acknowledgements: This research was funded in part by the Slovenian Research Agency within the research program ICT4QoL—Information and Communications Technologies for Quality of Life, grant number P2-0246.


Oct 6, 2024

ROSMD 2024 Workshop

Advancing to the Fifth Milestone
ROSMD 2024
Professional Development Program
(HYBRID MODE)
on
RESEARCH OPPORTUNITIES IN SEMICONDUCTOR
MATERIALS AND DEVICES
(ROSMD)
18-23 October 2024
in association with
JOINTLY ORGANIZED BY
Department of Electronics and Communication Engineering
SRM Institute of Science and Technology (SRMIST),
Kattankulathur, Chennai
&
Indian Institute of Information Technology
Design and Manufacturing (IIITD&M),
Kancheepuram

ABOUT THE ROSMD 2024 PROGRAM 
Electronic devices serve as essential components in a wide range of applications. Recently, new semiconductor materials and devices have emerged as revolutionary technologies, leading the international research community. These advancements are driving the development of submicron technologies, reducing costs, and supporting key industries such as electronic information, energy, aerospace, and environmental protection. India has been actively involved in the semiconductor field for decades, with a history that dates back to notable scientists like Sir C. V. Raman and Sir J. C. Bose. Today, India is home to numerous research groups and VLSI foundries that significantly contribute to the global semiconductor landscape. The recent adoption of new materials and technologies has further enhanced the performance of semiconductor devices, allowing for a broader range of applications. In line with India's Atmanirbhar Bharat policy and semiconductor mission, many organizations are working towards the development of indigenous semiconductor technologies. This course aims to shed light on the current status and future potential of semiconductor materials and devices, both in India and around the world  <Read more...

REGISTRATION DETAILS
You are required to apply online using the following link
https://forms.gle/15kGBSkPwjcWkcg

or scan QR Code: 

PATRONS
Dr. T.R. Parivendhar, Founder Chancellor, SRMIST
Dr. Ravi Pachamoothoo, Pro-Chancellor (Admin.), SRMIST
Dr. P. Sathyanarayanan, Pro-Chancellor (Academics), SRMIST
ADVISORY COMMITTEE
Prof. C. Muthamizhchelvan, Vice Chancellor,SRMIST
Dr. S. Ponnusamy, Registrar, SRMIST
Dr. T. V. Gopal, Dean CET, SRMIST
Dr. K. Vijayakumar, Dean SEEE, SRMIST
STEERING COMMITTEE
Dr. M. Sangeetha, Professor and Head, ECE, SRMIST, KTR
Dr. B. Ramachandran, Professor, ECE, SRMIST, KTR
Dr. R. Kumar, Professor, ECE, SRMIST, KTR
Dr. S. Malarvizhi, Professor, ECE, SRMIST, KTR
Dr. P. Aruna Priya, Professor, ECE, SRMIST, KTR
Dr. T. Rama Rao, Professor, ECE, SRMIST, KTR
Dr. Shanthi Prince, Professor, ECE, SRMIST, KTR
CONVENER
Dr. Rajesh Agarwal, SRMIST, KTR
Dr. Soumyaranjan Routray, SRMIST, KTR
Dr. K P Pradhan, IIITD&M, Kancheepuram
COORDINATORS
Dr. Sounik Kiran Kumar Dash, SRMIST, KTR
Dr. Sanjay Kumar Sahu, SRMIST, KTR
Dr. Uday Kumar Singh, SRMIST, KTR
Dr. Ferents Koni Jiavana K, SRMIST, KTR
ORGANIZING COMMITTEE
Dr. Kasthuri Bha J.K
Dr. Damodar Panigrahy
Dr. Sandeep Kumar P
Dr. Prithiviraj Rajalingam
Dr. Praveen Kumar S
Dr. Bashyam S
Mr. Muthukumaran B
Mr. Ananda Venkatesan
Dr. Arijit Bardhan Roy
Dr. Md Jawaid Alam
Dr. Vivek Kachhatiya
Dr. Tulika Srivastava
Dr. Sayantani Bhattacharya
Dr. Veer Chandra
Dr. Vishvas Kumar

Sep 17, 2024

[mos-ak] [online publications] MOS-AK/ESSERC Workshop in Bruges (B) September 9, 2024


The MOS-AK Association has organized is consecutive 21st ESSERC compact/SPICE modeling workshop, to discuss status of the device level modeling and analog/RF and digital FOSS CAD/EDA IC design tools supporting IHP OpenPDK Initiative. All the recent MOS-AK presentations are available online:
The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and panel discussions around the globe thru the 2024 Year, including:
  • MOS-AK Brazil Panel (BR), Oct. 2024
  • 17th US MOS-AK Workshop, Silicon Valley (US) Dec.11, 2024
    • in the timeframe of CMC and IEDM Meetings
W.Grabinski on the behalf of International MOS-AK Committee
WG170924

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Sep 16, 2024

[Balloting] IEEE Annual Election: Division I Candidates




Below are the candidates for 2025 IEEE Division I Delegate-Elect/Director-Elect.

The candidates are listed in a pre-determined lottery order and indicates no preference.
  • Amara Amara (Nominated by IEEE Division I)
  • Fernando J. Guarin (Nominated by IEEE Division I)
Division I Societies:
  • Circuits and Systems Society
  • Electron Devices Society
  • Solid-State Circuits Society
View position description

Balloting for the 2024 IEEE Annual Election has begun. 
The deadline to cast your vote is 
  • 12:00 noon ET (16:00 UTC-04) on 1 October 2024.

Access Ballot

 

 


 

 

Sep 15, 2024

[C4P] WOSET 2024

Call for Papers
Workshop on Open Source EDA Technologies (WOSET)
https://woset-workshop.github.io/
Virtual! No registration fee! 
Submission Due Date: Sept 23 2024 

The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to share their experiences and coordinate efforts towards developing a reliable, fully open-source EDA flow. The workshop will feature presentations that overview existing or under-development open-source tools, designs and technology libraries. Break-out rooms will be utilized for discussion of works-in-progress. The workshop will feature a panel on the present status and future challenges in open-source EDA, and how to coordinate efforts and ensure quality and interoperability across open-source tools.

Topics of interest include, but are not limited to:
  • Overview of an existing or under-development open-source EDA tool.
  • Overview of support infrastructure (e.g. EDA databases and design benchmarks).
  • Open-source cloud-based EDA tools
  • Open-source hardware designs
  • Position statements (e.g. critical gaps, blockers/obstacles)
Submission Information:
  • All submissions must include links to open-source repositories with
  •   all source code and an open-source license (BSD, GPL, Apache, etc.)
  • Please reference your open-source repository!
  • Review is single blind (anonymous reviewers).
  • Videos will be put on the WOSET site if accepted.
  • Virtual presentation for regular papers (in addition to archival video)
  • Regular Paper Submissions (4 pages + 1 page references + 15 min video + virtual presentation)
  • Work in Progress Submissions (2 page abstract + 1 page references + 10 min video + virtual zoom room)
  • Submission site: https://openreview.net/group?id=WOSET-Workshop.github.io/2024
Important dates:
  • Sept 23 2024 (end of day, anywhere in the world): submission due date.
  • Oct 18 2024: notification date.
  • Nov 8 2024: video due (if accepted)
  • Nov 18 2024: workshop
Co-Chairs:
  • Matthew Guthaus, UC Santa Cruz 
  • Jose Renau, UC Santa Cruz
Program Chair:
  • Dustin Richmond, UC Santa Cruz
Proceedings Chair:
  • Dan Petrisko, University of Washington
Zoom Chair:
  • Seeking volunteers to help run the virtual meeting
Program Committee:
  • Jonathan Balkind, UC Santa Barbara
  • Tim Edwards, efabless
  • Steve Hoover, Redwood EDA
  • Lucas Klemmer, JKU Linz
  • Dirk Koch, University of Manchester
  • Christian Krieg, TU Wien
  • Rajit Manohar, Yale University
  • Guillem Lopez Paradis, Barcelona Supercomputing Center
  • Frans Skarman, Linköping University
  • Matt Venn, YosysHQ, TinyTapeout

Sep 4, 2024

[C4P] EDTM 2025 in Hong Kong, China

The 9th IEEE Electron Devices Technology
and Manufacturing
Hong Kong, China, March 9th – 12th, 2025
Theme: Shaping the Future with Innovations in Devices and Manufacturing

Call for Papers

Three-page camera-ready paper submission starts: August 15, 2024
Paper submission deadline: October 15 October 31, 2025
Notification for Acceptance: December 15, 2024

https://edtm2025.com/

Technical Areas
EDTM 2025 solicits papers in all areas of electronic devices, including materials, processes, modeling, device/circuit/system design, reliability, packaging, manufacturing, testing, and yield. EDTM 2025 will include parallel technical sessions of oral and poster presentations.

Publication Opportunities
The accepted and presented papers will be published in the EDTM 2025 Proceedings, included in IEEE Xplore. The authors of a selected number of high-impact papers will be invited to submit extended versions for publication in the special issue of IEEE Journal of Electron Devices Society (J-EDS) or IEEE Transactions on Electron Devices, subjected to J-EDS and TED policy.

Short Courses and Tutorials
EDTM 2025 will start with a set of short courses and tutorials on March 9, 2025. Tutorials will cover selected topics from the basics to the state-of-the-art. The Short Courses will discuss the latest research and challenges on emerging and advanced topics.

Exhibition
EDTM 2025 offers vendors to showcase their newest products and technologies, allowing attendees to learn about new tools and techniques. Award Opportunities EDTM 2025 offers one Best Paper Award in each sub-technical area.
General Chair:
Yang Chai (HK PolyU)

General Co-Chair:

Tim Cheng (HKUST)

TPC Chair:
Mansun Chan (HKUST)

TPC Co-Chair:

Yansong Yang (HKUST)

Steering Committee:

Shuji Ikeda (TEI Solutions) – Chair
Bin Zhao (CTI)
Arokia Nathan (Cambridge U.)
Ravi Todi (Synopsys)
Murty Polavarapu (BAE)
Roger Booth (Qualcomm)
Samar Saha (Prospicient Devices)
Albert Wang (UC Riverside)
Kazunari Ishimaru (Rapidus)
Yogesh Chauhan (IIT Kanpur)

Executive Committee:
Yang Chai (HK PolyU)
Roger Booth (Qualcomm)
Mansun Chan (HKUST)
Yansong Yang (HKUST)
Ru Huang (Southeast)
Qiming Shao (HKUST)
Merlyne De Souza (U Sheffield)
Pei-Wen Li (NCTU)
Can Li (HKU)
Masumi Saito (Kioxia)
Zhongrui Wang (HKU)
Meiki Ieong (Simbury)
Carmen Fung (HKSTP)
Man Hoi Wong (HKUST)
Roger Booth (Qualcomm)
Huaqiang Wu (Tsinghua)
Rino Choi (Inha U.)
Bernard Lim (Appscard)
Shinichi Yoshida (SONY)
Bill Nehrer (Atomera)
Bich-Yen Nguyen (SOITEC)
Benjamin Iniguez (URV)
Edmundo Gutierrez (INAOE)
Ming Yang (HK PolyU)

Sep 2, 2024

[mos-ak] MOS-AK/ESSERC Workshop in Bruges (B) September 9, 2024

Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
MOS-AK/ESSERC Workshop in Bruges (B)
September 9, 2024

Scheduled consecutive 21st MOS-AK/ESSDERC SPICE/Compact Modeling Workshop organized in Bruges, aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and TCAD/EDA tool developers and vendors. The content will be beneficial for anyone who needs to learn what is really behind the FOSS CAD/EDA IC simulation in modern device models in OpenPDKs. The MOS-AK workshop program is available online

It will be followed by ESSERC W13 Workshop "The Future of CMOS: Building an Infrastructure to Fill the Gap with the VLSI Design Research Ecosystem", which will link the W13 workshop to the pathfinding PDK as an important tool to enable interaction within the academic research ecosystem. The workshop would end with a panel discussion where the different speakers can exchange their views on how to build the proper infrastructure for this evolution. The W13/ESSERC workshop program is available online:

Our industrial partner is organizing a complementary Keysight Device Modeling Connect Seminar. The seminar program available online

-- W.Grabinski on the behalf of International MOS-AK Committee

Enabling Compact Modeling R&D Exchange

WG010924


Jul 23, 2024

[mos-ak] [upcoming events] MOS-AK workshop series

The MOS-AK Association continue SPICE modeling discussions and its standardization efforts by organizing future compact modeling meetings, workshops and panels around the globe thru the 2024 Year, including:
-- W.Grabinski on the behalf of the International MOS-AK Committee

Enabling Compact Modeling R&D Exchange

23072024

Jul 22, 2024

[open letter] EU must keep funding free software

Initially published by petites singularités. English translation provided by OW2.

Since 2020, Next Generation Internet (NGI) programmes, part of European Commission’s Horizon programme, fund free software in Europe using a cascade funding mechanism (see for example NLnet’s calls). This year, according to the Horizon Europe working draft detailing funding programmes for 2025, we notice that Next Generation Internet is not mentioned any more as part of Cluster 4.

NGI programmes have shown their strength and importance to supporting the European software infrastructure, as a generic funding instrument to fund digital commons and ensure their long-term sustainability. We find this transformation incomprehensible, moreover when NGI has proven efficient and economical to support free software as a whole, from the smallest to the most established initiatives. This ecosystem diversity backs the strength of European technological innovation, and maintaining the NGI initiative to provide structural support to software projects at the heart of worldwide innovation is key to enforce the sovereignty of a European infrastructure. Contrary to common perception, technical innovations often originate from European rather than North American programming communities, and are mostly initiated by small-scaled organizations.

Previous Cluster 4 allocated 27 million euros to:
  • “Human centric Internet aligned with values and principles commonly shared in Europe” ;
  • “A flourishing internet, based on common building blocks created within NGI, that enables better control of our digital life” ;
  • “A structured ecosystem of talented contributors driving the creation of new internet commons and the evolution of existing internet commons”.
In the name of these challenges, more than 500 projects received NGI funding in the first 5 years, backed by 18 organisations managing these European funding consortia.

NGI contributes to a vast ecosystem, as most of its budget is allocated to fund third parties by the means of open calls, to structure commons that cover the whole Internet scope - from hardware to application, operating systems, digital identities or data traffic supervision. This third-party funding is not renewed in the current program, leaving many projects short on resources for research and innovation in Europe.

Moreover, NGI allows exchanges and collaborations across all the Euro zone countries as well as “widening countries”1, currently both a success and an ongoing progress, likewise the Erasmus programme before us.  NGI is also an initiative that contributes to the opening and maintenance of relationships over a longer period of time than project financing. It encourages implementing projects funded as pilots, backing collaboration, identification and reuse of common elements across projects, interoperability in identification systems and beyond, and setting up development models that mix diverse scales and types of European funding schemes.

While the USA, China or Russia deploy huge public and private resources to develop software and infrastructure that massively capture private consumer data, the EU can’t afford this renunciation. Free and open source software, as supported by NGI since 2020, is by design the opposite of potential vectors for foreign interference. It lets us keep our data local and favors a community-wide economy and know-how, while allowing an international collaboration. This is all the more essential in the current geopolitical context: the challenge of technological sovereignty is central, and free software allows addressing it while acting for peace and sovereignty in the digital world as a whole.

Original text and list of signatories: https://pad.public.cat/lettre-NCP-NGI#

REF:
[1] As defined by Horizon Europe, widening Member States are Bulgaria, Croatia, Cyprus, the Czech Republic, Estonia, Greece, Hungary, Latvia, Lituania, Malta, Poland, Portugal, Romania, Slovakia and Slovenia. Widening associated countries (under condition of an association agreement) include Albania, Armenia, Bosnia, Feroe Islands, Georgia, Kosovo, Moldavia, Montenegro, Morocco, North Macedonia, Serbia, Tunisia, Turkey and Ukraine. Widening overseas regions are: Guadeloupe, French Guyana, Martinique, Reunion Island, Mayotte, Saint-Martin, The Azores, Madeira, the Canary Islands.

Jul 4, 2024

[paper] anybody can design and build a chip

Krzysztof Herman, Norbert Herfurth, Tim Henkes, Sergei Andreev, Rene Scholz, Markus Müller, Mario Krattenmacher, Harald Pretl, and Wladyslaw Grabinski
On the Versatility of the IHP BiCMOS Open Source and Manufacturable PDK: 
A step towards the future where anybody can design and build a chip
IEEE Solid-State Circuits Magazine, vol. 16, no. 2, pp. 30-38, Spring 2024
DOI: 10.1109/MSSC.2024.3372907

Abstract: In this article, we introduce the first European open source process design kit (PDK), namely IHP-Open130-G2. We provide a concise history of the PDK itself and offer a brief comparison with some alternative open source PDKs, such as SKY130 and GF180MCU. The article also includes a process description and details on deliverables, offering insights into available devices, models, supported open source tools, and workflows. As the IHP-Open130-G2 is currently under development, we present key points outlining future activities. This aims to inform and attract users to join the open source silicon community. The concluding section of the article compares measurement results for active devices with compact model results. The article concludes with a cryptographic Internet protocol (IP) core based on IHP-Open130-G2 as an exemplary use case.

FIG: Silicon Proven Application: The final layout of the HEP custom cryptographic IP core.

[REF] “130nm BiCMOS open source PDK, dedicated for analog, mixed signal and RF design.” GitHub. Online: https://github.com/IHP-GmbH/IHP-Open-PDK

Jul 3, 2024

[paper] 5-DC-Parameter MOSFET Model

Deni Germano Alves Neto 1,3, Mohamedkhalil Bouchoucha 2,3, Gabriel Maranhão 1, Manuel J. Barragan 3, Márcio Cherem Schneider 1, Andreia Cathelin 2, Sylvain Bourdel 1
and Carlos Galup-Montoro 1
Design-Oriented Single-Piece 5-DC-Parameter MOSFET Model
IEEE Access; vol. 12 (2024)
DOI: 10.1109/ACCESS.2024.3417316

1 Department of Electrical and Electronics Engineering, FUSC, Florianópolis (BR)
2 STMicroelectronics, Crolles (F)
3 Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA, Grenoble (F)

Abstract: This paper presents a novel charge-based MOSFET model, denoted ACM2, including velocity saturation and drain-induced barrier lowering. Employing the proposed model, all the DC characteristics (currents and charges) and the small-signal equations can be expressed as single-piece expressions valid in all inversion (weak, moderate, and strong) regions. When applied to bulk technology, ACM2 has 5 DC parameters, and an extra parameter is included for SOI technologies to account for back gate bias. Straightforward procedures are provided for extracting the short-channel parameters associated with velocity saturation and back gate bias. Experimental results demonstrate that the DC and small-signal characteristics of the ACM2 model match the silicon measurements in bulk and SOI technologies, with typical errors of less than 20 % in the DC currents and 30 % in the transconductances. The validity of the model is further verified with two design examples. Firstly, simulations of a CMOS inverter in a 130 nm bulk technology show similar results using the PSP or ACM2 models. Then, an RF design example is provided. The ACM2 model is employed to design a 2.4GHzlow-noise-amplifier in a 28nm FD-SOI CMOS technology. Obtained results in terms of S11, S21, NF, and IIP3 are consistent with simulations using the complete UTSOI2 model provided in the technology design kit.
 
Technology 130nm28nm
Transistor NMOS PMOS NMOS PMOS
W/L (um/um)
VTO (mV)
10/0.12
490
10/0.12
-478
1/0.06
389
1/0.06
-404
Is (uA)11.78 9.39 3.15 0.76
n1.41 1.46 1.15 1.01
σ0.053 0.048 0.018 0.029
ς0.007 0.031 0.039 0.024
δ- - 0.079 -0.076

FIG:  Conceptual structure of the ACM2 Model and its 6-DC parameters.

Acknowledgment: The authors would like to thank the STIC-AmSud multi national cooperative scientific program for supporting this research and STMicroelectonics and the Institute for High-Performance Microelectronics (IHP) for the design kits and silicon measurements. This work was supported in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (BR); in part by the Conselho Nacional de Desenvolvimento Científico e Tecnológico, (BR); in part by the TIMA Laboratory, Grenoble (F) and in part by STMicroelectronics, Crolles, France.

Jul 2, 2024

Using LEGO as a Tool for Science Communication

Johannes Brantl1,2, Martin Dierolf1,2 and Franz Pfeiffer1,2,3,4
Using LEGO® as a Tool for Science Communication: 
Design and Construction of a Model of the Munich Compact Light Source
Collection of Abstracts for the ICXS 2024 Workshop

1 Chair of Biomedical Physics, Department of Physics, TU Munich (D)
2 Munich Institute of Biomedical Engineering, TU Munich (D)
3 Department of Diagnostic and Interventional Radiology, TU Munich (D)
4 TUM Institute for Advanced Study, TU Munich (D)

Abstract : LEGO® bricks are a versatile and engaging tool for science communication and outreach. By using LEGO® to build miniaturized models of scientific facilities and instruments, researchers can educate the public and fellow investigators about complex scientific concepts in a fun and accessible way. In this work, we describe the construction of two large-scale LEGO® models of the Munich Compact Light Source (MuCLS), a cutting-edge research facility that produces quasi-monochromatic high-intensity X-rays for various scientific applications.


Fig : Rendering of the Munich Compact Light Source LEGO® model.