Aug 31, 2023

[paper] The Future Transistors

Wei Cao, Huiming Bu, Maud Vinet, Min Cao, Shinichi Takagi, Sungwoo Hwang, Tahir Ghani
and Kaustav Banerjee
The future transistors
Nature vol. 620, pp. 501–515 (2023)
DOI: 10.1038/s41586-023-06145-x

Abstract: The metal–oxide–semiconductor field-effect transistor (MOSFET), a core element of complementary metal–oxide–semiconductor (CMOS) technology, represents one of the most momentous inventions since the industrial revolution. Driven by the requirements for higher speed, energy efficiency and integration density of integrated-circuit products, in the past six decades the physical gate length of MOSFETs has been scaled to sub-20 nanometres. However, the downscaling of transistors while keeping the power consumption low is increasingly challenging, even for the state-of-the-art fin field-effect transistors. Here we present a comprehensive assessment of the existing and future CMOS technologies, and discuss the challenges and opportunities for the design of FETs with sub-10-nanometre gate length based on a hierarchical framework established for FET scaling. We focus our evaluation on identifying the most promising sub-10-nanometre-gate-length MOSFETs based on the knowledge derived from previous scaling efforts, as well as the research efforts needed to make the transistors relevant to future logic integrated-circuit products. We also detail our vision of beyond-MOSFET future transistors and potential innovation opportunities. We anticipate that innovations in transistor technologies will continue to have a central role in driving future materials, device physics and topology, heterogeneous vertical and lateral integration, and computing technologies.

FIG: The history of transistor technology.

Acknowledgements: K.B. acknowledges support from the Army Research Office (grant W911NF1810366), the Air Force Office of Scientific Research (grant FA9550-18-1-0448), the Japan Science and Technology Agency CREST Program (grant SB180064) and the National Science Foundation (grant CCF 2132820). K.B. thanks the following individuals for their selfless support during the organization of the collaboration: T. Ernst, CEA-LETI, Grenoble, France; T. Sakurai, The University of Tokyo, Tokyo, Japan; J. Welser, IBM Almaden Research Centre, San Jose, USA. K.B. also thanks S. Oda, Tokyo Institute of Technology, Ōokayama, Japan, for useful discussions.






Aug 14, 2023

[11k online viewers] 7th Sino MOS-AK/Nanjing

Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
7th Sino MOS-AK Workshop in Nanjing (CN)
August 11-13, 2023 (online/onsite)
Recent, consecutive, 7th Sino MOS-AK/Nanjing Workshop discussing the Compact/SPICE modeling and its Verilog-A Standardization reached 11k online viewers. The MOS-AK participants and online attendees have followed one day SiC-related device modeling training on August 11 featured presentations by experts currently working at Robert Bosch GmbH and then two days workshop with 24 R&D Compact/SPICE modeling presentations:




Aug 10, 2023

[paper] 5-DC-parameter MOSFET model

Deni Germano Alves Neto1, Cristina Missel Adornes1, Gabriel Maranhao1, Mohamed Khalil Bouchoucha2,3, Manuel J. Barragan3, Andreia Cathelin2, Marcio Cherem Schneider1, Sylvain Bourdel3 and Carlos Galup-Montoro1
A 5-DC-parameter MOSFET model for circuit simulation in QucsStudio and SPECTRE
2023 21st IEEE Interregional NEWCAS Conference (NEWCAS) 
DOI: 10.1109/NEWCAS57931.2023.10198173

1 Federal University of Santa Catarina, Florianopolis (BR)
2 STMicroelectronics, Crolles (F)
3 Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA, Grenoble (F)


Abstract: A minimalist MOSFET model for circuit simulation with only five DC parameters written in Verilog-A is presented. The five parameters can be extracted from direct and simple methods in common circuit simulators. The DC characteristics of transistors in both 180-nm bulk CMOS and 28-nm FD-SOI technologies generated by the five-parameter model are compared with those generated by the BSIM and UTSOI2 models, respectively. The simulation of some basic circuits using the proposed 5-DC-parameter MOSFET model shows good matching with the simulation using the BSIM model, at the benefit of a much simpler set of DC parameters.
Fig: DC characteristic gm/ID vs. id used to extract ζ.


REF:
[1] Advanced Compact MOSFET (ACM) in C. M. Adornes, D. G. Alves Neto, M. C. Schneider, and C. Galup-Montoro, “Bridging the gap between design and simulation of low voltage CMOS circuits,” Journal of Low Power Electronics and Applications, vol. 12, no. 2, 2022.

Aug 8, 2023

[mos-ak] [Final Program] 7th Sino MOS-AK Workshop in Nanjing (CN) August 11-13, 2023 (online/onsite)

Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
7th Sino MOS-AK Workshop in Nanjing (CN)
August 11-13, 2023 (online/onsite)

The 7th Sino MOS-AK Workshop in Nanjing (CN), carefully planned by the organizers Nanjing University of Posts and Telecommunications and Nanjing University of Aeronautics and Astronautics, will be held at the "Anheng Youth Theater" of Nanjing University of Posts and Telecommunications on August 11-13 2023. The SiC-related device modeling training on Aug.11 featured presentations by experts currently working at Robert Bosch GmbH. Considering the opportunity to allow more contributors to speak and communicate on stage, we fine-tuned the conference agenda and report time, so this time there are a total of 19 oral presentations, covering Advanced CMOS, GaN, SiC, SOI, Organic transistor, SiGe HBT, MRAM, etc., among which several new reports are from BGI Nine Days, Primarius, Nanjing University of Aeronautics and Astronautics, Southeast University, and others. Please refer to the Program https://www.mos-ak.org/nanjing_2023/

-- Min Zhang <zhang@xmodtech.cn>






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Aug 2, 2023

[video] Semiconductor industry in Switzerland

75th Anniversary of the Transistor
Semiconductor Industry in Switzerland

A commemorative and networking event was organized by the IEEE Solid-State Circuits Chapter of Switzerland at the EPFL Microcity building in Neuchâtel, Switzerland. In the first part of the afternoon, we had the honor to host three Distinguished Lecturers:
  • Prof. Tom Lee presentation “From Rocks to Chips: Stories of the Transistor” covered the early history of the transistor.
  • Dr. Chris Mangelsdorf described circuit design techniques using the bipolar junction transistor (BJT) in his talk “Don’t Try This With CMOS!”.
  • Prof. Christian Enz concluded this session, describing the development of low power CMOS using the EKV MOSFET model.
This video covers the second part of the event, “From transistor manufacturing in the late 1950’s until today”. It hosted five speakers who were key actors or are still active in the semiconductor sector of Switzerland.


[video] Interviews from FSiC, Paris, 2023


Interviews from the Free Silicon Conference, Paris, 2023

The 2023 Free Silicon Conference (FSiC) took place in Paris (Sorbonne Université, 4 Place Jussieu, Paris) on July 10 - 12 2023 (Monday to Wednesday). The conference brought together experts and enthusiasts who want to build a complete Free and Open Source CAD ecosystem for designing analog and digital integrated circuits. The conference covered the full spectrum of the design process, from system architecture, to layout and verification.

Interviews with selected Free Silicon Conference Participation by Matt Venn are available online:

00:00 FSiC 2023 Intro, Matt Venn
00:23 Luca Alloatti, FSiC Organizing Committee
01:59 Thomas Benz, ETH Zurich
06:05 Jørgen Kragh Jakobsen, IC Works - Open Source Chip Design
08:57 Thomas Parry, SPHERICAL
11:05 Rene Scholz, IHP Microelectronics
14:06 Dan Fritchman, UC Berkeley
18:41 Harald Pretl, Johannes Kepler University Linz

All the conference proceedings (slide presentations and prerecorded talks) are also available at the FSiC website.


IFETC 2023


IEEE Electron Devices Society (EDS) and SCV/SF EDS chapter present:
5th IEEE International Flexible Electronics Technology Conference (IFETC) 2023

Date: August 13–16, 2023
Venue: DoubleTree by Hilton San Jose, 2050 Gateway Pl, San Jose, CA 95110

The IFETC 2023 prepared an excellent technical program including Tutorials, Short Courses, Plenary Talks, and Luncheon Talk by internationally recognized experts as well as invited and contributed technical presentations by researchers from academia, industry, and national and international research institutes.

For detailed IFETC 2023 Technical Program, please visit: https://2023.ifetc.org/, and register today to attend.

Featured Speakers and Talks:

1) Plenary
John Rogers, "Soft, Wireless Skin-Interfaced Devices for Health Monitoring and Haptic Interactions;"
Takao Someya, "Electronic Skins for Robotics and Healthcare Applications"
Zhenan Bao, "Skin-Inspired Sensors, Integrated Circuits and Bioelectronics"
Jeffrey King, "Flexible Substrates for Fabrication of Electronic Devices"
Dennis Nordlund, "Plasma Jet Printing for Printed Electronics"

2) Tutorials
Meyya Meyyappan, "Printed and Flexible Electronics and Devices: An Overview"
Min Zhang, "Nanocarbon-Based Flexible and Stretchable Electronics"
Niels Benson, "Flexible RFID-Tags for smart label applications in retail and logistics"

3) Short Courses
Sungjune Jung, "Inkjet-Printing Technology: From a Droplet to Flexible Electronics and 3D Artificial Tissues"
Gregory Whiting, "Distributed Printed Electronics for Sustainable Environmental Practices"
Mark Poliks, "Flexible and Hybrid Electronics"

4) Luncheon
Sri Peruvemba, "Marketing the Unknown"

5) Evening Panel: How and Why Investment Would Accelerate Growth in Flexible/Printable Electronics Industry

6) Special Event: Women in EDS / Young Professionals


Semiconductor Industry Update Webinar

Semiconductor Industry Update Webinar
Registration Now Open

Our 2023 forecast has again transpired both accurate and prescient, with most forecasters now aligned with our double-digit decline. With the downturn now bottoming, all eyes are on the speed and shape of the recovery. Will it be a sharp V-shaped rebound or a more gradual U, or will it instead be a protracted drawn out- hockey-stick recovery? And if the latter, how slow will that be? Find out the answer to these and other key questions at Future Horizons' IFS2023 September industry update outlook webinar, Sep 12, 2023, 3pm UK BST (GMT+1): https://www.futurehorizons.com/page/136/Industry-Update-Webinar


What
This one-hour broadcast will focus on the chip industry outlook, including:

• Has the market bust finally reached the bottom?

• What is the market outlook for 2H-2023?

• What are the likely ramifications for 2024?

• How to build resilient business strategies, plus

• Opportunity to ask specific questions in advance, during and after the webinar.

Who

• All companies, small and large, from startups to established market leaders

• Key decision-makers engaged in the design, manufacture, or supply of semiconductors

• Government organisations involved in trade and investment

• Those involved in investing or banking within the electronics industry

• Senior marketing executives planning future marketing strategy


Why
Founded in 1989, Future Horizons' track record and industry experience makes this a must-attend event for key decision makers in semiconductors, electronics, and all related industries. We always present accurate and insightful analysis at these events backed up by sound data based on our 55 plus years of direct industry experience, dating back to the first commercial IC, longer than any other analyst and most industry execs. We have been in the business of forecasting and analyzing the semiconductor market for over 40 years and have been a trusted advisor to governments, investors, startups and most of the top global semiconductor firms. Time and again we have saved our clients time and money with our insightful and accurate analysis of the industry.


Fee
For a small investment of UK £150 plus £30 UK VAT you will gain accurate industry insight to make good strategic decisions in these uncertain times

• Discount available for 3 or more attendees from the same company/organisation

• Can't attend? No need to miss out, order the webinar video recording and slides instead

• Please pass to a colleague if already registered or not suitable for you

• This event can also be held in-house for your added convenience and flexibility


Sign Up NOW!
Don't miss out, sign up now here: 

https://us02web.zoom.us/webinar/register/9016905717544/WN_akISM9QxS8uNZS_oihzqFQ#/registration


View
May 2023 Webinar highlights here: 

https://www.youtube.com/watch?v=LWlhrqO5sgc


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Chairman & CEO

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