Dec 17, 2024
[job opening] Assembling Design Kit (ADK) Developer
Dec 9, 2024
[Program Highlights] 17th International MOS-AK Workshop Silicon Valley, December 11, 2024
Dec 2, 2024
[mos-ak] [2nd Announcement] 17th International MOS-AK Workshop Silicon Valley, December 11, 2024
- Compact Modeling (CM) of the electron devices
- Advances in semiconductor technologies and processing
- Verilog-A language for CM standardization
- New CM techniques and extraction software
- Open Source (FOSS) TCAD/EDA modeling and simulation
- CM of passive, active, sensors and actuators
- Emerging Devices, Organic TFT, CMOS and SOI-based memory
- Microwave, RF device modeling, high voltage device modeling
- Device level modeling for Agroelectronics, Bio/Med, IoT applications
- Device cryogenic operation for Quantum Computing
- Nanoscale semiconductor devices/circuits and its reliability/ageing
- Technology R&D, DFY, DFT and IC Designs
- Foundry/Fabless Interface Strategies, Open Access PDK
(eg: Skywater 130nm CMOS, GF 180nm, IHP 130nm RF BiCMOS, OpenSUSI) '
(any related enquiries can be sent to abstracts@mos-ak.org)
Online Free Registration is open
(any related enquiries can be sent to registration@mos-ak.org)
- 2nd Announcement: Nov. 2024
- Final Workshop Program: Dec. 2024
- MOS-AK Workshop: Dec.11, 2024
- in timeframe of Q4 CMC and IEDM Meetings
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Nov 29, 2024
1st Semiconductor Design Workshop in Yamagata
Why not experience semiconductor design hands-on with the instructor on your own PC? This is a valuable opportunity to learn the basics of semiconductor design with intimate and detailed guidance in a small class setting.
Nov 26, 2024
[paper] Roadmap for Schottky Barrier Transistors
Qing-Tai Zhao3 and Laurie E. Calvet11
1 Advanced Technology Institute, University of Surrey, Guildford, UK
2 Namlab gGmbH, Nöthnitzer Str. 64a, 01187 Dresden, Germany
3 Peter Grünberg Institute, Forschungszentrum Jülich, 52428 Jülich, Germany
4 DEEEA, Universitat Rovira I Virgili, Tarragona, Spain,
5 NanoP, THM University of Applied Sciences, 35390 Giessen, Germany,
6 Institute of Semiconductor Electronics, RWTH Aachen University, Germany
7 Research Center for Organic Electronics (ROEL), Yamagata University, Japan
8 Chair for Nanoelectronics, TU Dresden, Germany
9 Electrical Engineering, Cambridge University, UK
10 Institute of Solid State Electronics, TU Wien, Vienna, Austria
11 LPICM, CNRS-Ecole Polytechnique, IPP, 91120 Palaiseau, France
Nov 20, 2024
[paper] Bendable non-silicon RISC-V microprocessor
Nelson Ng, Damien Jausseran, Feras Alkhalil, David Kong2, Gage Hills2, Richard Price
and Vijay Janapa Reddi2
2 Harvard University, Cambridge, MA, USA
Data availability
Source data are provided with this paper.
Code availability
Nov 18, 2024
[WOSET] Q&A at OpenPDK session
Workshop on Open-Source EDA Technology (WOSET) was organized by Prof. Matthew Guthaus and his R&D Team. WOSET 2024 Schedule is available online
Nov 14, 2024
[paper] TCAD for Circuits and Systems
1 Global TCAD Solutions GmbH., Boesendorferstraße 1/12, 1010 Vienna, Austria
[paper] Open-source Cell Libraries
and Hiroki Honda1
"CNFET-OCL: Open-source Cell Libraries for Advanced CNFET Technologies"
with cross-section of a CNFET device.
Nov 12, 2024
[anysilicon.com] Open Source CAD/EDA Tools
CppSim: has been actively used since 2002. It is used for commercial and academic purposes. It performs system-level simulations of mixed-signal circuits. It automatically produces, compiles, and executes C++ code per the schematic design you produce.
Electric: among one the powerful CAD systems which can handle different types of circuit design tasks including MOS, Bipolar, schematics, printed circuitry, hardware description languages, etc. It can analyze design rule checking, simulation, and network comparison. It can perform synthesis as well, like routing, compaction, silicon compilation, PLA generation, and compensation.
eSim: an integrated tool built from open source software such as KiCad, Ngspice, Verilator, Makerchip, GHDL, and OpenModelica. It is an EDA tool for circuit design, simulation, and analysis.
IRSIM: a tool for simulating digital circuits. It is a switch-level simulator, where transistors are treated as ideal switches. In this simulator, the circuit under simulation can be modified and then incrementally restimulated. It maintains the history of circuit activity and only restimulates the part of the circuit that deviates from its history.
Mosaic: Analogue integrated circuit designs can be created and simulated using the tool mosaic. It emphasizes a cutting-edge, user-friendly interface, immediate design feedback, design reuse, verification, and automation. Regardless of your internet connection, Mosaic will remain quick and accessible and synchronize your modifications when you reconnect.
Ngspice: An open-source mixed-signal SPICE simulator. ngspice has a command line input interface and plots the waveforms. This tool offers active development and improved stability. ngspice is based on three open-source free-software packages: Spice3f5, Xspice, and Cider1b1:
QUCS(Quite Universal Circuit Simulator): a well-advanced circuit simulator that supports all kinds of simulations like DC, AC, s-parameter, noise, transient analysis, etc. It allows importing existing SPICE models as well.
X Circuit: The schematic diagrams drawn from the schematic capture program do not produce an image that is suitable for publication. Engineers have to draw the schematic with the help of general-purpose drawing tools. It is a drawing tool that is specifically for circuits only. It can produce high-quality schematic diagrams and other figures that are suitable for publication purposes.
Xschem: a schematic capture program for VLSI and ASIC design.
XYCE: a SPICE-compatible software, written in C++ and using MPI (Message Passing Implementation). It also includes Trilinos ( Sandra’s open source library), which includes KLU direct solver and many more circuit-specific solvers.
ChipVault: an organization tool for HDL. It allows for hierarchical file navigation, sorting, and editing.
EDA Playground: a free web application for HDL (including Verilog, system Verilog, VHDL, and other HDLs) simulations and synthesis. It generates a browser-based waveform viewer after a successful simulation. It is easy to use because no download is required and code sharing is easy.
GHDL: translates VHDL files directly into machine code and hence faster compilation and analysis of code than any other interpreted simulator.
Icarus Verilog: a compiler for Verilog HDL as described in the IEEE-1364 standard. With the help of written Verilog code, it compiles the code into some target format. This tool supports a waveform viewer named GTKWave.
Migen: a python-based tool that applies advanced software concepts like OOPs, and metaprogramming in the VLSI design process and building complex digital hardware. It is a brand new programming language based on FHDL
Yosys: a synthesis tool that can handle Verilog code and can synthesize complex projects as well.
Fairly Good Router: a software for routing, based on Lagrange multipliers. It is an academic tool and it is based on similar routers used on industrial levels.
KLayout: KLayout is an editor that helps with the layout. It is also helpful in changing and creating GDS and OASIS files.
Magic: is considered one of the easiest tools for circuit layout. This tool supports LVS and DRC as well.
QRouter: a tool for routing based on the standard Lee maze routing algorithm. It supports LEF and DEF formats as input and output.
OpenSTA: is used to verify the timings of a circuit at the gate level.
OpenTimer: A high-performance, commercial-grade timing analysis tool. It helps IC designers with its interactive analysis to verify circuit timings. It supports both path-based and graph-based timing analysis. It is relatively a new tool that supports industry-standard format support like .lib, .v, .spef, and .sdc.
HiTas: Another tool for static timing analysis.
Netgen: is a verification tool for comparing a layout to a netlist. To ensure this physical verification and LVS is carried out. Netgen version 1.5 is considered a commercial-grade tool.
Dragon: is an effective tool for standard cell placement for variable and fixed die ASIC design.
Gdsfactory: Since gdsfactory is entirely written in Python, some Python concepts are necessary. It is built on top of KLayout, gdspy (Python library for producing GDSII files), and Phidl (Python module for GDS layout and cad geometry).
Alliance/Coriolis VLSI CAD Tools: Alliance / Coriolis is a free software toolchain for VLSI design. The input is HDL (Verilog or VHDL) and the output is GDSII, which is all set for ASIC manufacture.
Qflow: Provides a set of tools and methods to turn an HDL code (written in Verilog or VHDL) into a physical circuit. It is capable of handling sub-systems like host-to-device communication, signal processing, arithmetic logic unit, etc.
OpenLane: An automated VLSI design flow for digital synthesis. It is a collection of open-source tools. It performs all the tasks from RTL to GDS-II with the help of a predefined set of commands for design explanation and optimization. It has two modes.
OpenROAD: is a flow of open source tools for ASIC design. The whole flow is automated for digital SoC layout generation, focusing on the RTL-to-GDSII phase of system-on-chip design.
Silicon Compiler: automatically translates source code to hardware design. There are three steps.
IBTIDA:Fully open-source ASIC implementation of Chisel-generated System on a Chip
Nov 4, 2024
Recent Compact Modeling Papers
[1] Hao Su, Yunfeng Xie, Yuhuan Lin, Haihan Wu, Wenxin Li, Zhizhao Ma, Yiyuan Cai, Xu Si, Shenghua Zhou Guangchong Hu, Yu He Feichi Zhou, Xiaoguang Liu, Longyang Lin, Yida Li, Hongyu Yu, and Kai Chen; "Characterizations and Framework Modeling of Bulk MOSFET Threshold Voltage Based on a Physical Charge-Based Model Down to 4 K." In 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), pp. 733-736. IEEE, 2024. doi: 10.1109/ESSERC62670.2024.10719583
[2] Tung, Chien-Ting, Sayeef Salahuddin, and Chenming Hu; "A SPICE-Compatible Neural Network Compact Model for Efficient IC Simulations." In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 01-04. IEEE, 2024.
[3] Jana, Koustav, Shuhan Liu, Kasidit Toprasertpong, Qi Jiang, Sumaiya Wahid, Jimin Kang, Jian Chen, Eric Pop, and H-S. Philip Wong; "Modeling and Understanding Threshold Voltage and Subthreshold Swing in Ultrathin Channel Oxide Semiconductor Transistors." In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 01-04. IEEE, 2024.
[4] Manganaro, Gabriele. "Rethinking mixed-signal IC design." In 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), pp. 552-556. IEEE, 2024
[5] Wager, John F., Jung Bae Kim, Daniel Severin, Zero Hung, Dong Kil Yim, Soo Young Choi, and Marcus Bender; "Dual-Layer Thin-Film Transistor Analysis and Design." IEEE Open Journal on Immersive Displays (2024).
Oct 28, 2024
[paper] FOSS support for CM with Verilog-A
Oct 6, 2024
ROSMD 2024 Workshop
Dr. T.R. Parivendhar, Founder Chancellor, SRMISTDr. Ravi Pachamoothoo, Pro-Chancellor (Admin.), SRMISTDr. P. Sathyanarayanan, Pro-Chancellor (Academics), SRMIST
Prof. C. Muthamizhchelvan, Vice Chancellor,SRMISTDr. S. Ponnusamy, Registrar, SRMISTDr. T. V. Gopal, Dean CET, SRMISTDr. K. Vijayakumar, Dean SEEE, SRMIST
Dr. M. Sangeetha, Professor and Head, ECE, SRMIST, KTRDr. B. Ramachandran, Professor, ECE, SRMIST, KTRDr. R. Kumar, Professor, ECE, SRMIST, KTRDr. S. Malarvizhi, Professor, ECE, SRMIST, KTRDr. P. Aruna Priya, Professor, ECE, SRMIST, KTRDr. T. Rama Rao, Professor, ECE, SRMIST, KTRDr. Shanthi Prince, Professor, ECE, SRMIST, KTR
Dr. Rajesh Agarwal, SRMIST, KTRDr. Soumyaranjan Routray, SRMIST, KTRDr. K P Pradhan, IIITD&M, Kancheepuram
Dr. Sounik Kiran Kumar Dash, SRMIST, KTRDr. Sanjay Kumar Sahu, SRMIST, KTRDr. Uday Kumar Singh, SRMIST, KTRDr. Ferents Koni Jiavana K, SRMIST, KTR
Dr. Kasthuri Bha J.KDr. Damodar PanigrahyDr. Sandeep Kumar PDr. Prithiviraj RajalingamDr. Praveen Kumar SDr. Bashyam SMr. Muthukumaran BMr. Ananda VenkatesanDr. Arijit Bardhan RoyDr. Md Jawaid AlamDr. Vivek KachhatiyaDr. Tulika SrivastavaDr. Sayantani BhattacharyaDr. Veer ChandraDr. Vishvas Kumar
Sep 17, 2024
[mos-ak] [online publications] MOS-AK/ESSERC Workshop in Bruges (B) September 9, 2024
- MOS-AK/ESSERC Workshop in Bruges (B) <https://mos-ak.org/bruges_2024/>
- MOS-AK Brazil Panel (BR), Oct. 2024
- 17th US MOS-AK Workshop, Silicon Valley (US) Dec.11, 2024
- in the timeframe of CMC and IEDM Meetings
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Sep 16, 2024
[Balloting] IEEE Annual Election: Division I Candidates
IEEE Annual Election: Division I Candidates
- Amara Amara (Nominated by IEEE Division I)
- Fernando J. Guarin (Nominated by IEEE Division I)
- Circuits and Systems Society
- Electron Devices Society
- Solid-State Circuits Society
- 12:00 noon ET (16:00 UTC-04) on 1 October 2024.
Sep 15, 2024
[C4P] WOSET 2024
Topics of interest include, but are not limited to:
- Overview of an existing or under-development open-source EDA tool.
- Overview of support infrastructure (e.g. EDA databases and design benchmarks).
- Open-source cloud-based EDA tools
- Open-source hardware designs
- Position statements (e.g. critical gaps, blockers/obstacles)
- All submissions must include links to open-source repositories with
- all source code and an open-source license (BSD, GPL, Apache, etc.)
- Please reference your open-source repository!
- Review is single blind (anonymous reviewers).
- Videos will be put on the WOSET site if accepted.
- Virtual presentation for regular papers (in addition to archival video)
- Regular Paper Submissions (4 pages + 1 page references + 15 min video + virtual presentation)
- Work in Progress Submissions (2 page abstract + 1 page references + 10 min video + virtual zoom room)
- Submission site: https://openreview.net/group?id=WOSET-Workshop.github.io/2024
- Sept 23 2024 (end of day, anywhere in the world): submission due date.
- Oct 18 2024: notification date.
- Nov 8 2024: video due (if accepted)
- Nov 18 2024: workshop
- Matthew Guthaus, UC Santa Cruz
- Jose Renau, UC Santa Cruz
- Dustin Richmond, UC Santa Cruz
- Dan Petrisko, University of Washington
- Seeking volunteers to help run the virtual meeting
- Jonathan Balkind, UC Santa Barbara
- Tim Edwards, efabless
- Steve Hoover, Redwood EDA
- Lucas Klemmer, JKU Linz
- Dirk Koch, University of Manchester
- Christian Krieg, TU Wien
- Rajit Manohar, Yale University
- Guillem Lopez Paradis, Barcelona Supercomputing Center
- Frans Skarman, Linköping University
- Matt Venn, YosysHQ, TinyTapeout
Sep 4, 2024
[C4P] EDTM 2025 in Hong Kong, China
The 9th IEEE
Electron Devices Technology and Manufacturing Hong Kong, China, March 9th – 12th, 2025 Theme: Shaping the Future with Innovations in Devices and Manufacturing Call for Papers Three-page camera-ready paper submission starts: August 15, 2024 Paper submission deadline: Notification for Acceptance: December 15, 2024 https://edtm2025.com/ Technical Areas EDTM 2025 solicits papers in all areas of electronic devices, including
materials, processes, modeling, device/circuit/system design,
reliability, packaging, manufacturing, testing, and yield. EDTM 2025
will include parallel technical sessions of oral and poster
presentations.
Publication Opportunities The accepted and presented papers will be published in the EDTM 2025
Proceedings, included in IEEE Xplore. The authors of a selected number
of high-impact papers will be invited to submit extended versions for
publication in the special issue of IEEE Journal of Electron Devices
Society (J-EDS) or IEEE Transactions on Electron Devices, subjected to
J-EDS and TED policy.
Short Courses and Tutorials EDTM 2025 will start with a set of short courses and tutorials on March
9, 2025. Tutorials will cover selected topics from the basics to the
state-of-the-art. The Short Courses will discuss the latest research
and challenges on emerging and advanced topics.
Exhibition EDTM 2025 offers vendors to showcase their newest products and
technologies, allowing attendees to learn about new tools and
techniques. Award Opportunities EDTM 2025 offers one Best Paper Award
in each sub-technical area. |
General Chair: Yang Chai (HK PolyU) General Co-Chair: Tim Cheng (HKUST) TPC Chair: Mansun Chan (HKUST) TPC Co-Chair: Yansong Yang (HKUST) Steering Committee: Shuji Ikeda (TEI Solutions) – Chair Bin Zhao (CTI) Arokia Nathan (Cambridge U.) Ravi Todi (Synopsys) Murty Polavarapu (BAE) Roger Booth (Qualcomm) Samar Saha (Prospicient Devices) Albert Wang (UC Riverside) Kazunari Ishimaru (Rapidus) Yogesh Chauhan (IIT Kanpur) Executive Committee: Yang Chai (HK PolyU) Roger Booth (Qualcomm) Mansun Chan (HKUST) Yansong Yang (HKUST) Ru Huang (Southeast) Qiming Shao (HKUST) Merlyne De Souza (U Sheffield) Pei-Wen Li (NCTU) Can Li (HKU) Masumi Saito (Kioxia) Zhongrui Wang (HKU) Meiki Ieong (Simbury) Carmen Fung (HKSTP) Man Hoi Wong (HKUST) Roger Booth (Qualcomm) Huaqiang Wu (Tsinghua) Rino Choi (Inha U.) Bernard Lim (Appscard) Shinichi Yoshida (SONY) Bill Nehrer (Atomera) Bich-Yen Nguyen (SOITEC) Benjamin Iniguez (URV) Edmundo Gutierrez (INAOE) Ming Yang (HK PolyU) |
Sep 2, 2024
[mos-ak] MOS-AK/ESSERC Workshop in Bruges (B) September 9, 2024
Jul 23, 2024
[mos-ak] [upcoming events] MOS-AK workshop series
- 8th Sino MOS-AK Workshop Xi'an (CN); August 15-17, 2024
<https://www.mos-ak.org/xian_2024/> - 21st MOS-AK/ESSERC Workshop in Bruges (B); September 9, 2024
<https://mos-ak.org/bruges_2024/> - In conjunction with ESSERC W13: "The future of CMOS: building an infrastructure to fill the gap with the VLSI design research ecosystem" in Bruges (B); September 9, 2024
<https://www.esserc2024.org/w13-the-future-of-cmos> - Complementary Keysight Device Modeling Connect Seminar in Bruges (B); September 9, 2024
<https://www.keysight.com/de/de/lib/events/seminars/keysight-device-modeling-user-group-meeting.html> - 17th MOS-AK Workshop inSilicon Valley, (CMC/IEDM Timeframe) Dec. 2024
<Link TBD>
Jul 22, 2024
[open letter] EU must keep funding free software
NGI programmes have shown their strength and importance to supporting the European software infrastructure, as a generic funding instrument to fund digital commons and ensure their long-term sustainability. We find this transformation incomprehensible, moreover when NGI has proven efficient and economical to support free software as a whole, from the smallest to the most established initiatives. This ecosystem diversity backs the strength of European technological innovation, and maintaining the NGI initiative to provide structural support to software projects at the heart of worldwide innovation is key to enforce the sovereignty of a European infrastructure. Contrary to common perception, technical innovations often originate from European rather than North American programming communities, and are mostly initiated by small-scaled organizations.
Previous Cluster 4 allocated 27 million euros to:
- “Human centric Internet aligned with values and principles commonly shared in Europe” ;
- “A flourishing internet, based on common building blocks created within NGI, that enables better control of our digital life” ;
- “A structured ecosystem of talented contributors driving the creation of new internet commons and the evolution of existing internet commons”.
NGI contributes to a vast ecosystem, as most of its budget is allocated to fund third parties by the means of open calls, to structure commons that cover the whole Internet scope - from hardware to application, operating systems, digital identities or data traffic supervision. This third-party funding is not renewed in the current program, leaving many projects short on resources for research and innovation in Europe.
Moreover, NGI allows exchanges and collaborations across all the Euro zone countries as well as “widening countries”1, currently both a success and an ongoing progress, likewise the Erasmus programme before us. NGI is also an initiative that contributes to the opening and maintenance of relationships over a longer period of time than project financing. It encourages implementing projects funded as pilots, backing collaboration, identification and reuse of common elements across projects, interoperability in identification systems and beyond, and setting up development models that mix diverse scales and types of European funding schemes.
While the USA, China or Russia deploy huge public and private resources to develop software and infrastructure that massively capture private consumer data, the EU can’t afford this renunciation. Free and open source software, as supported by NGI since 2020, is by design the opposite of potential vectors for foreign interference. It lets us keep our data local and favors a community-wide economy and know-how, while allowing an international collaboration. This is all the more essential in the current geopolitical context: the challenge of technological sovereignty is central, and free software allows addressing it while acting for peace and sovereignty in the digital world as a whole.
Original text and list of signatories: https://pad.public.cat/lettre-NCP-NGI#
Jul 4, 2024
[paper] anybody can design and build a chip
Abstract: In this article, we introduce the first European open source process design kit (PDK), namely IHP-Open130-G2. We provide a concise history of the PDK itself and offer a brief comparison with some alternative open source PDKs, such as SKY130 and GF180MCU. The article also includes a process description and details on deliverables, offering insights into available devices, models, supported open source tools, and workflows. As the IHP-Open130-G2 is currently under development, we present key points outlining future activities. This aims to inform and attract users to join the open source silicon community. The concluding section of the article compares measurement results for active devices with compact model results. The article concludes with a cryptographic Internet protocol (IP) core based on IHP-Open130-G2 as an exemplary use case.
[REF] “130nm BiCMOS open source PDK, dedicated for analog, mixed signal and RF design.” GitHub. Online: https://github.com/IHP-GmbH/IHP-Open-PDK
Jul 3, 2024
[paper] 5-DC-Parameter MOSFET Model
Technology | 130nm | 28nm | ||
Transistor | NMOS | PMOS | NMOS | PMOS |
W/L (um/um) VTO (mV) | 10/0.12 490 |
10/0.12 -478 |
1/0.06 389 |
1/0.06 -404 |
Is (uA) | 11.78 | 9.39 | 3.15 | 0.76 |
n | 1.41 | 1.46 | 1.15 | 1.01 |
σ | 0.053 | 0.048 | 0.018 | 0.029 |
ς | 0.007 | 0.031 | 0.039 | 0.024 |
δ | - | - | 0.079 | -0.076 |
FIG: Conceptual structure of the ACM2 Model and its 6-DC parameters.