Mar 29, 2023

In Menoriam: Gordon Moore, 1929 - 2023


With great sadness, the Gordon and Betty Moore Foundation announces the passing of our founder, Gordon Moore. With his characteristic humility and word economy, Gordon Moore once wrote “my career as an entrepreneur happened quite by accident.” A brilliant scientist, business leader and philanthropist, Gordon co-founded and led two pioneering technology enterprises, Fairchild Semiconductor and Intel, and, with his wife, Betty, created one of the largest private grantmaking foundations in the U.S., the Gordon and Betty Moore Foundation
(read further *Contributors include Tom Waldrop and Intel Communications)

[paper] Extraction and Automated FEMM Creation of a Transformer SPICE Model

Denys I. Zaikin
Extraction of Transformer Parameters from FEMM Simulations 
and Automated Creation of a Transformer SPICE Model Using a Scripting Language
TechRxiv. Preprint. DOI 10.36227/techrxiv.22263358.v1

*Advent Technologies A/S Lyngvej 8, Aalborg, 9000, Denmark e-mail: denys.zaikin@advent.energy

Abstract: This study presents a method for extracting transformer parameters using simulations in the Finite Element Method Magnetics (FEMM) electromagnetic solver. The extracted parameters represent a full model of a linear transformer and can be used in Simulation Program with Integrated Circuit Emphasis (SPICE) simulations. A model of the transformer is presented in three variants, for which different approaches were used in the transformer simulation in the SPICE program, all yielding the same simulation results. A method for extracting transformer parameters from FEMM is proposed, along with an automated tool based on a scripting language built into the FEMM software [Online open souce https://www.femm.info]
FIG: An example of the simulation setup in FEMM 
and transformer equivalent circuits SPICE Pi-model



[Deadline Extended] IEEE LAEDC 2023


Paper Submission Deadline Extended:

15 April 2023

On behalf of the Organizing Committee of IEEE 2023 Latin American Electron Devices Conference (LAEDC) we want to invite you to the next edition of our conference. It will take place in Puebla, Mexico from July 3-5, 2023, https://attend.ieee.org/laedc-2023/

The conference is growing rapidly with worldwide participation and will cover key topics in the field of electronic devices. The main objective of LAEDC is to bring together specialists from all fields related to electronic devices, it will also be aimed at students and young researchers. This event is financially sponsored by IEEE Electron Devices Society (EDS). We are sure that thanks to your significant achievements and contributions, your attendance will significantly increase the value of our conference and motivate research groups and young generations in the field of electronic devices. Please note that discounted registration will be available until June 17, 2023.

Please consider submitting a full paper to our conference proceedings no later than March 31th and engage with our audience and participants while visiting one of the most lively and historic cities in Mexico. For more information, please visit our website and do not hesitate to contact us at laedc-program@ieee.org

Sincerely,
 

Mar 24, 2023

Thirteen regions of #EU have come together to form a #semi #alliance https://t.co/T655QCutbq https://t.co/l37dp4pHqI



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Mar 22, 2023

[analog-wg] Video of March 21 AWG Meeting

The Analog Workgroup (AWG) was formed by the CHIPS Alliance TSC to explore collaborations in open source Analog/Mixed-Signal design and verification. It focuses on sharing best practices, ideas, tooling (analog automation), and other challenge areas in the design space. The workgroup is composed of both industry and university members.

The AWG Video Meeting on March 21, 2023 included two presentations:
  • Ken Kundert "Why Fund OpenVAF"
  • Pascal Kuthe "OpenVAF: An innovative open-source Verilog-A Compiler"

Please note the following line of topics for the Analog Workgroup
  • 4th April: Update from Tim Edwards: Magic and PEX extraction
  • 18th April: Update from Sadayuki Yoshitomi: Ecosystem of compact model development 
  • 2nd May (tentative): Update from C. Enz,EPFL:  test structures measurements

Mar 21, 2023

Commemorative and Networking Event: 75th anniversary of the transistor

IEEE Switzerland Solid State Circuits Chapter
invites you to join the networking event to celebrate
the 75th anniversary of the transistor

Three IEEE Distinguished Lecturers will talk about the transistor history and its properties. It will be followed by short presentations about semiconductor industry activities in Switzerland, with the following networking apéro.

Attendance is free and open to all: mention it and forward to your friends and colleagues.

Please register for logistics reasons. 

Date and Time

Location

  • Date: 30 Mar 2023
  • Time: 01:00 PM to 07:30 PM
  • All times are (UTC+01:00) Bern
  • Add_To_Calendar_iconAdd Event to Calendar
  • EPFL Microcity
  • Rue de la Maladière 71C
  • CH-2020 Neuchâtel

  • Room Number: MC A1 272
  • Click here for Map


Agenda

13:00 – 13:30 Welcome Coffee 

13:30 – 14:15 Tom Lee: From Rocks to Chips: Stories of the Transistor

14:15 – 15:15 Chris Mangelsdorf: Don't try this with CMOS

15:15 – 15:45 Coffee break 

15:45 – 16:30 Christian Enz: The Design of Low-power Analog CMOS Circuits Using the Inversion Coefficient

16:30 – 17:30 Semiconductor industry in Switzerland, sharing experiences 
                        (W.Grabinski, Panel Moderator):

  • Bipolar transistor manufacturing in Switzerland – Hugo Wyss
  • Integrated Circuits – Eric Vittoz
  • Semiconductor design in the 21st century – Alain-Serge Poret
  • Micro-electronics for Swiss made products – Evert Dijkstra
  • Semiconductor manufacturing equipment – André Gerde

17:30 – 19:00 Apéro riche

Hosts

Switzerland Section Chapter, SSC37 : https://sscs.ieee.ch
Switzerland Section : https://ieee.ch/



Mar 17, 2023

Silicon Chip Industry Awareness Seminar

Silicon Chip Industry Awareness Workshop Seminar


Unlock Your Potential Today!

Whether you're a non-technologist struggling with the jargon or a specialist looking to understand the overall industry structure, this workshop is for you. Join us on Tue 28 March 2023, 9:30am to 4:00pm at the Holiday Inn in Kensington, London, England.  Gain a competitive edge in the Semiconductor Industry by learning how the IC industry works from the science that enables silicon chips to be made from sand to the market fundamentals that drive applications and economics. Experience the industry through Listen, Discuss, See, Touch, and Learn activities and enjoy improved job satisfaction and operational efficiency.

Priced at just UK£695 plus 20 percent UK VAT per delegate, the fee includes copies of presentation materials, coffee breaks and lunch.  Workshops can also be held in-house for your added convenience and flexibility.  Only 10 spots available, so don't wait – Secure Your Spot Today at: https://www.futurehorizons.com/page/12/silicon-chip-training


Past Attendee Comments
* As a non-technologist, it was very beneficial to have these issues so clearly explained
* The seminar provided a good basis to understanding the industry
* It was GREAT! I can't remember a day of a similar density
* I finally understand how to recognize products & their use in technology
* This has helped me structure my thoughts & plans for the company
* It gave me deeper insight into the industry in a way difficult to obtain anywhere else
* This will be very useful when involved in our core business development discussions


Please pass to your HR Department or a colleague if already attended or not suitable for you.


Sincerely

Malcolm Penn, Chairman & CEO
Blakes Green Cottage, Sevenoaks, Kent TN15 0LQ, England
Tel: +44 (0)1732 740440
Registered Company: 4380991


Follow us on Twitter @Future_Horizons 

and join our Linked In Group (http://uk.linkedin.com/in/malcolmpenn

and receive regular industry news, information and comments. 

#7nm #OpenROAD Design Contest



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March 17, 2023 at 08:47AM
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Mar 16, 2023

How new #semi fabrication #chip will power #India towards growth



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March 16, 2023 at 03:18PM
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Mar 15, 2023

#Samsung to invest in South Korea



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March 15, 2023 at 08:28PM
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First Indian #semi #fab will be declared in a few weeks



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March 15, 2023 at 04:42PM
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[paper] Noise Characterization of MOSFETs for Cryogenic Electronics

Variable-Temperature Broadband Noise Characterization of MOSFETs
for Cryogenic Electronics: From Room Temperature down to 3K
Kenji Ohmori1 and Shuhei Amakawa2
TechRxiv. DETM 2022 Preprint
DOI: 10.36227/techrxiv.21762917.v1

1 Device Lab Inc., Tsukuba, Ibaraki, Japan,
2 Hiroshima University, Higashihiroshima, Hiroshima, Japan

Abstract: A broadband noise measurement system is newly developed and demonstrated at temperatures between 3K and 300K. Using the system, wideband noise spectroscopy (WBNS) from 20kHz to 500MHz is carried out for the first time, revealing that shot noise is the dominant white noise down to 3K. The paper also suggests, by means of WBNS, the possibility of extracting the baseline noise characteristics, which do not include the noise component that varies a great deal from device to device.

FIG: a.) IdVg Curves at T = 2.9K ... 300K and b.) 1/f Noise at T=5K

Acknowledgement
This work was partially supported by NEDO-SBIR.


[paper] highly segmented hybrid pixel detectors

R. Ballabrigaa, J.A. Alozya, F.N. Bandia, G. Blajb, M. Campbella, P. Christodouloua c d, V. Cocoa, A. Dordaa e, S. Emiliania h, K. Heijhoff f, E. Heijne a c, T. Hofmanna, J. Kaplona, A. Koukabh,
I. Kremastiotisa, X. Lloparta, M. Noya, A. Paternoa, M. Pillera g, J.M. Sallesseh, V. Sriskarana,
L. Tlustosa c, M. van Beuzekomf
The Timepix4 analog front-end design: Lessons learnt on fundamental limits to noise and time resolution in highly segmented hybrid pixel detectors
Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume 1045, 1 January 2023, 167489
DOI: 10.1016/j.nima.2022.167489

a CERN, Experimental Physics Department, Meyrin, 1211, Switzerland
b SLAC National Accelerator Laboratory, Menlo Park, 94025, CA, United States
c IEAP, Czech Technical University in Prague, Prague, 11000, Czech Republic
d Department of Biomedical technology, Faculty of Biomedical Engineering, Czech Technical University in Prague, nam. Sitna 3105, Kladno, 272 01, Czech Republic
e KIT - Karlsruhe Institute of Technology, Institute for Data Processing and Electronics (IPE), Hermann-von-Helmholtz-Platz 1, Eggenstein-Leopoldshafen, 76344, Germany
f Nikhef, Science Park 105, Amsterdam, 1098, Netherlands
g Institute of Electronics, Graz University of Technology, Graz, 8010, Austria
h Electron Device Modeling and Technology Laboratory (EDLAB), EPFL, Switzerland


Abstract: This manuscript describes the optimization of the front-end readout electronics for high granularity hybrid pixel detectors. The theoretical study aims at minimizing the noise and jitter. The model presented here is validated with both circuit post layout simulations and measurements on the Timepix4 Application Specific Integrated Circuit (ASIC). The analog front-end circuit and the procedure to optimize the dimensions of the main transistors are described with detail. The Timepix4 is the most recent ASIC designed in the framework of the Medipix4 Collaboration. It was manufactured in 65 nm CMOS process, and consists of a four side buttable matrix of 448X512 pixels with 55µm pitch. The analog front-end has a gain of 36 mV/ke- when configured in High Gain Mode, and 20 mV/ke- when configured in Low Gain Mode. The Equivalent Noise Charge (ENC) is ~68e-rms and ~80e-rms in High Gain Mode and in Low Gain Mode respectively. In event driven mode, the incoming hits can be time stamped within a 200ps time bin and the chip can deal with a maximum flux of 3.6MHz mm-2s-1. In photon counting mode, the chip can deal with up to 5GHz mm-2s-1. The routine designed to optimize the Timepix4 front-end is then used to analyze the performance limits in terms of jitter and noise for Charge Sensitive Amplifiers in pixel detectors.

Fig: Transconductance that can be obtained for the input transistor as an EKV function of the Inversion Coefficient (IC). The asymptotes for the velocity without and with velocity saturation are shown.

Acknowledgments: The authors would like to acknowledge the Medipix Collaborations for their continuous support in the design of hybrid pixel detector readout chips.

Mar 14, 2023

IEEE CASS IIT Roorkee offline Workshop on Robust and Reliable VLSI Circuits Design

IEEE CASS SBC IIT Roorkee in collaboration with IEEE UP Section and some industry partners is organizing a workshop entitled "Robust and Reliable VLSI Circuits". This is a three-day residential workshop to learn the aspects of reliable and robust design in VLSI circuits from the leading academic/industrial experts. 

The benefits of this workshop to the participants will be multifold:

  1. Participants will get an opportunity to interact with leading researchers both from academic and the industry.

  2. Participants will get hand-on experience on various EDA tools.

  3. The participants will get the opportunity to present their recent domain work to the experts.


For Registration click here


To know more visit the R2VC website at 

https://r2vc.netlify.app/


Date: 7-9 April, 2023

Venue: Indian Institute of Technology(IIT) Roorkee,

Uttarakhand


Send you queries at - 

ieeecassiitr@gmail.com


Contact us at-

Neha Gupta

9719749045

Kartikay Mani Tripathi 

9810938752

Mar 13, 2023

#semiconductors #India #US #innovation 



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March 13, 2023 at 09:56AM
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Mar 12, 2023

AACD 2023 --- Final Program



We, AACD Organizers, are proud to announce the final program the 31st Advances in Analog Circuit Design Workshop (AACD23) held at Carinthia University of Applied Sciences (FH Karnten) in Villach, Austria on April, 12th-14th, 2023.

Flyer

Early-bird discounted registration is available till March 19th 2023.

Workshop Registration includes participation to the sessions, pdf documentation, lunches and coffee breaks for the three days, Welcome Cocktail (on April, 12th) and Gala Dinner (on April, 13th).

For any further information:

We look forward to meeting you in Villach!!!!

Andrea Baschirotto
AACD23 General Chairman

Mar 10, 2023

Hello world in #electornics https://t.co/xXWbkqxlen #semi [https://t.co/CYopGZA4rp] Congratulations, you are now an electrical engineer! 😀 https://t.co/eUc1iStenR



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March 10, 2023 at 09:11PM
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Mar 8, 2023

[paper] Cryogenic Characteristics of InGaAs MOSFET

L. Södergren, P. Olausson and E. Lind
Cryogenic Characteristics of InGaAs MOSFET
in IEEE TED, vol. 70, no. 3, pp. 1226-1230, March 2023,
DOI: 10.1109/TED.2023.3238382

Abstract: We present an investigation of the temperature dependence of the current characteristic of a long-channel InGaAs quantum well MOSFET. A model is developed, which includes the effects of band tail states, electron concentration-dependent mobility, and interface trap density to accurately explain the measured data over all modes of operation. The increased effect of remote impurity scattering is associated with mobility degradation in the subthreshold region. The device has been characterized down to 13 K, with a minimum inverse subthreshold slope of 8 mV/dec and a maximum ON-state mobility of 6700 cm2/Vs and with values of 75 mV/dec and 3000 cm2/Vs at room temperature.

FIG: Measured transfer characteristics at 13, 100, and 300 K together with the fit model with
(a) VDS=50 mV and (b) VDS=500 mV.






Mar 6, 2023

[open position] IHP Research Associate for Open PDK Development

Research Associate for Open PDK Development (m/f/d)
Developer for Open Source Process Design Kits
for SiGe-BiCMOS Technology
Job-ID: 7011/23 | Department: Technology | Salary: as per tariff TV-L | Working time: 40h/week (part-time work option) | Limitation: initially 2 years with option of extension for three more years | Entry Date: as soon as possible

IHP is an institute of the Leibniz Association and conducts research and development of silicon-based systems and ultra-high-frequency circuits and technologies, including new materials. It develops innovative solutions for application areas such as wireless and broadband communication, security, medical technology, industry 4.0, automotive industry, and aerospace. IHP employs approximately 350 people. It operates a pilot line for technological developments and the preparation of high-speed circuits with 0.13/0.25 µm-SiGe-BiCMOS technologies, located in a 1500 m² cleanroom that meets the highest industrial nanotechnology requirements.

The position:
As a member of the group Research & Prototyping Service, you will develop Process Design Kit for IHP’s BiCMOS technologies and new future technology modules with special focus on open source PDK development. Your detailed tasks will include programming of pCells and their integration into our verification process. Devices descriptions, user guides and test cases are important aspects of your work, too. Finally, managing our PDK repositories on Github with external contributions and adaption of existing tools like OpenRAM is part of the work. Implementation of new devices and investigations of new design tools and flows will give this position room for interesting development opportunities.

Your profile:
You hold a Master's degree in computer science with background in semiconductors, physics or electrical engineering. Knowledge in semiconductor devices and programming are of advantage. Your specialized knowledge preferably covers ASIC design environment like Cadence Virtuoso, Mentor/Siemens Tanner or KeySight ADS, OpenROAD/OpenLane, Linux and scripting languages (e.g. Python, Perl or TCL). You are well organized and always keep the overview even with many parallel projects. Thanks to your skillful communication, you are a binding and reliable contact person for our partners. You are also a strong team player, and you confidently handle the German and English language. You are also a strong team player. We are looking for a team member, who is able to structure his or her own work and to bring a well-organized and systematic way of working into the cooperation with creative minds. You are an ideal match for this position, when you have experimental, analytical and problem-solving skills, very strong communicative skills and the ability to quickly learn how to operate the latest technical equipment including various software. It is necessary that you confidently handle the English language. Knowledge of the German language is welcome. The consolidating of German language skills is expected and highly encouraged, for example in in-house language courses and intensive courses.

Your application:
Have we sparked your interest? Then we look forward to receiving your application via our online application form. For further information regarding the position, please contact Dr. René Scholz


[NIST Report] 7 Grand #Challenges for #US #chip industry



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March 06, 2023 at 08:54AM
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Mar 3, 2023

[C4P] SEMINATEC 2023

 

SEMINATEC 2023 Call for Papers

SEMINATEC 2023 will be held at the Institute of Physics Gleb Wataghin, IFGW, auditorium between March 29-31, 2023 as a continuation of previous workshops, all focused on technology trends in the areas of micro and nanotechnology. The goal of this event is to promote the interaction among industry, academy, research & development centers, government and students, all looking for real opportunities towards improving education, research, and technology.

Contributed papers will be selected based on submitted abstracts (up to two pages) in A4 format. Electronic submissions will only be accepted in pdf format and must be submitted prior to March 6, 2023 The notification of acceptance will be on March 12, 2023.

The XVII SEMINATEC welcomes the submission of original papers in all areas related to  

  • Optoelectronic devices
  • Optics and Photonic IC’s
  • Fabrication of micro & nano-structures
  • Microsystems
  • Devices modeling and characterization
  • Integrated circuits: design and testing
  • CAD and simulation

Abstract Submission  (To download the template, click  here Abstracts will be accepted in PDF format. Please fill the form below and upload your file. All fields required.

SEMINATEC is organized by the School of Electrical and Computer Engineering (FEEC), the Institute of Physics Gleb Wataghin (IFGW) and the Center for Semiconductors Components and Nanotechnologies (CCSNano) at the University of Campinas (UNICAMP), by the Integrated Systems Laboratory (LSI) at the University of São Paulo (USP) and by the Department of Electrical Engineering at FEI, with support/funding from the IEEE Electron Device Society (EDS) South Brazil Chapter, the EDS Student Chapter of UNICAMP and FEI and by the SSCS South Brazil Chapter. The event is also supported by INCT’s NAMITEC, SBMICRO, FAPESP’s Integrated Photonics Devices (iPhD) and Integrated Photonics Lab (LIF SISFOTON).

[Naveed Sherwani] view on ChipAct team needs



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March 03, 2023 at 09:57AM
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Mar 2, 2023

#Apple doubles its $1 billion investment in #German



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March 02, 2023 at 02:05PM
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#Yangtze #Memory to get another $1.9bn from #China government



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