Sedemos News: September 2022

Sep 28, 2022

#Intel says #Moore's Law is still alive and well. #Nvidia says it's ended

[https://t.co/eQQbFMtmHc] #Intel says #Moore's Law is still alive and well. #Nvidia says it's ended. #semi #chips #manufacturing #technology https://t.co/1xNwtmprmX
— Wladek Grabinski (@wladek60) Sep 28, 2022

from Twitter https://twitter.com/wladek60

September 28, 2022 at 04:31PM
via IFTTT

Sep 27, 2022

IRPhE’2022 Yerevan Armenia

International Conference on Microwave & THz Technologies and Optoelectronics

IRPhE’2022

Dedicated to 100-years jubilee of academician Emil Mirzabekyan

September 27-29, 2022

[online] Consultation workshop "Chips for Europe" Initiative

Consultation workshop "Chips for Europe" Initiative

Shaping Europe's digital future

As part of the ongoing consultation on the upcoming implementation of the "Chips for Europe" Initiative, as foreseen within Pillar 1 of the proposed Chips Act, we are organising a virtual workshop on Thursday 29th September 2022. Here we will be presenting the Commission's ideas on future pilot lines and a design platform, key components of the Commission's strategy to strengthen the semiconductor ecosystem in Europe and accelerate the process from the lab to the fab.

The workshop will be split into two parts:

10:00 – 12:30 CET: design platform and its implementation
14:00 – 16:30 CET: pilot lines and their implementation

The agenda will include an opportunity for an exchange of views with stakeholders.

Those interested in joining are invited to register.

Sep 25, 2022

Hermann K. Gummel Obituary

as posted <https://ieee-ceda.org/post/hermann-k-gummel-obituary>

Beloved Hermann Gummel passed away on Monday, 5 September at 99 years old, surrounded by his ‘dearly ones’. Hermann was born on 6 July 1923 in Hannover, Germany to Hans and Charlotte Gummel, the middle brother of an older sister, Bärbel, and younger brother, Achi. After graduating high school, Herman was enlisted as a radio operator for the German army in World War II. He was wounded and taken prisoner during the Normandy Landing (DDay) and ultimately sent to a hospital in Scotland. Throughout his life, Hermann was deeply grateful for the compassionate care of the doctors and staff there, who saved his leg from amputation.

Hermann’s intellectual aptitude and interest in academia would define the trajectory of his life. After the war, he enrolled in the University of Marburg as a wounded veteran, where he fell in love with, and later married, his wife Erika Reich. They were married for 64 years before her passing in 2016.

In addition to love, academia also took Hermann to new land. Hermann was awarded a Fullbright scholarship to Syracuse University, marking the beginning of a new life that he and Erica would forge together in the United States. Hermann obtained his doctorate in Physics, during which he also became a father for the first time to his daughter Monica in 1953. Hermann and Erica’s second daughter, Margaret was born five years later in 1958.

After completing his Doctorate, the family moved to Plainfield, NJ in 1957 and Hermann began a lifelong career working at Bell Laboratories. Hermann worked as a Director at “Mother Bell” for 30 years, then as a consultant for an additional 10+ years after his “retirement”. Throughout this time, the family lived in North Plainfield (1960-1976), then Berkeley Heights (1976-2005), and finally, at the Cedar Crest Senior Living Community in northern New Jersey.

Within the scientific community, Hermann is considered a pioneer in the semiconductor industry, leaving behind a distinguished legacy in the field of design technology for integrated electronics. He was a scientific mentor, leader, and visionary for many in the field. Awarded the prestigious Phil Kaufman award and known for the ‘Gummel Number’, the Gummel-Poon Model, and numerous other technical achievements. Within his family, he continues to be simply and lovingly, “Dad” and “Opa”.

Hermann is survived and loved by both his children, Monica and Margi, his grandchildren, Tracy and Pammy, as well as his great-grandchildren, Marco and Nico. The scientific community will remember Hermann for his technical contributions. His loved ones will remember him for his integrity, boundless intellectual curiosity and discipline, his loyalty, and a heart that was endlessly grateful for the life he lived and those he loved.

Sep 23, 2022

'Moore's Law Is Dead,' Says Nvidia CEO Says - Slashdot https://t.co/AJY0GBJOpv #semi https://t.co/QFRTwAud1D

'Moore's Law Is Dead,' Says Nvidia CEO Says - Slashdot https://t.co/AJY0GBJOpv #semi https://t.co/QFRTwAud1D
— Wladek Grabinski (@wladek60) Sep 23, 2022

from Twitter https://twitter.com/wladek60

September 23, 2022 at 10:07PM
via IFTTT

Sep 21, 2022

Distinguished Lecturer Program on "FOSS TCAD/EDA Tools SPICE and Verilog-A Modeling Flow"

We are glad to inform you that the IEEE Student Branch MNIT Jaipur in association with IEEE EDS Student Branch Chapter MNIT Jaipur is organizing an invited talk on ''FOSS TCAD/EDA Tools SPICE and Verilog-A Modeling Flow'' by Dr Wladek Grabinski, R&D SPICE Manager, MOS-AK (EU)

There is no registration fee, however prior registration is required. This invited talk will be held in online mode.

E-certificate will be provided to all registered participants.

Title: ''FOSS TCAD/EDA Tools SPICE and Verilog-A Modeling Flow"

Abstract:Compact/SPICE models of circuit elements (passive, active, MEMS, RF, Microwave, Photonics) are essential to enable advanced IC design using nanoscaled semiconductor technologies. Compact/SPICE models are also a communication means between the semiconductor foundries and the IC design teams to share and exchange all engineering and design information. To explore all related interactions, we are discussing selected FOSS CAD tools along the complete technology/design tool chain from nanascaled technology processes; thru the compact modeling; to advanced IC transistor level design support. New technology and device development will be illustrated by application examples of the FOSS TCAD tools: Cogenda TCAD and DEVSIM. Compact modeling will be highlighted by review topics related to its parameter extraction and standardization of the experimental and measurement data exchange formats. Application and use of these tools for advanced IC design (e.g. analog/RF, Microwave, Photonics applications) directly depends on the quality of the compact model implementations in these tools as well as reliability of extracted models and generated libraries/PDKs. Discussing new model implementation into the FOSS CAD tools (Gnucap, Xyce, ngspice and Qucs as well as others) we will also address an open question of the compact/SPICE model Verilog-A standardization. We hope that this presentation will be useful to all the researchers and engineers actively involved in the developing compact/SPICE models as well as designing the integrated circuits in particular at the semiconductor device level and then trigger further discussion on the compact/SPICE model Verilog-A standardization and development supporting FOSS CAD tools.

Registration Link:

https://forms.gle/xnkEo2i92UzdjK5PA

Joining Link:

http://meet.google.com/cpd-mopg-eea

Date: 22nd September 2022

Time: 03:00-04:00 PM IST

We are looking forward to active participation from your side.

Girdhar Gopal

Research Scholar, MNIT Jaipur

Chair, Student Branch Chapter

MNIT, Jaipur

Sep 20, 2022

[https://t.co/ESTgq7BilY] Automated SoC, Mixed-Signal Design using OpenROAD and OpenFASoC #RTL #GDSII #OpenSource #semi https://t.co/F1wjbbSWnO

[https://t.co/ESTgq7BilY] Automated SoC, Mixed-Signal Design using OpenROAD and OpenFASoC #RTL #GDSII #OpenSource #semi https://t.co/F1wjbbSWnO
— Wladek Grabinski (@wladek60) Sep 20, 2022

from Twitter https://twitter.com/wladek60

September 20, 2022 at 02:59PM
via IFTTT

Sep 19, 2022

Fwd: Call for Papers: ICAEEET-2022

CALL FOR PAPERS

International Conference on Advancement in Electrical & Electronics Engineering and Technology (ICAEEET-2022)

Mode of Conference - Online

November 10-11, 2022

Bansal Institute of Engineering and Technology

Lucknow, Uttar Pradesh, India

Technically Associated With

IEEE UP Section

Greetings from Bansal IET, Lucknow.

It is a matter of immense pleasure to inform you that the Department of Electrical Engineering, Bansal Institute of Engineering and Technology, Lucknow is going to organize the International Conference on Advancement in Electrical & Electronics Engineering and Technology (ICAEEET-2022) during November 10-11, 2022. International Conference on Advancement in Electrical & Electronics Engineering and Technology (ICAEEET) focused on advancement in electrical and electronics engineering and interdisciplinary research in computer, instrumentation, automation, and communication engineering. ICAEEET aims to bring together researchers, scientists, engineers, scholars and students to exchange and share their experiences, new ideas, and research results. This conference is about various aspects of engineering, discussion on the practical challenges encountered and the solutions adopted. Expert talks are planned for exchange of ideas and sharing expertise. The conference serves to be a better platform to enrich research activities.

The conference website is available at: https://icaeeet.wordpress.com/

We request you to please submit your work and kindly encourage your colleagues, research scholars and students to share their research papers at ICAEEET-2022.

The deadline for paper submission is September 27, 2022 .

Submission portal: https://easychair.org/conferences/?conf=icaeeet2022

We look forward to your participation and support.

-- With regards -- ICAEEET-2022 Organizing Committee

Sep 15, 2022

Micro-Transfer-Printing to be held in Erfurt, Germany, on November 21 & 22, 2022. Register today at: https://t.co/5Dq6B2ZUk6 #semi #microtransferprinting #3Dintegration #heterogenousintegration #advancedpackaging #Erfurt https://t.co/UqTwBCdAnj

Micro-Transfer-Printing to be held in Erfurt, Germany, on November 21 & 22, 2022. Register today at: https://t.co/5Dq6B2ZUk6 #semi #microtransferprinting #3Dintegration #heterogenousintegration #advancedpackaging #Erfurt https://t.co/UqTwBCdAnj
— Wladek Grabinski (@wladek60) Sep 15, 2022

from Twitter https://twitter.com/wladek60

September 15, 2022 at 08:47AM
via IFTTT

Sep 14, 2022

Future Horizons Semiconductor Industry Update Webinar

Has the chip market boom come to an end? What fate now awaits the industry? Find out the answer to these and other key questions at Future Horizons' IFS2022 Mid-Term Semiconductor Industry Update Webinar, Sep 13, 2022 - 3pm UK BST (GMT+1):

https://www.futurehorizons.com/page/136/Industry-Update-Webinar

Why? Founded in 1989, Future Horizons’ track record and industry experience makes this a must-attend event for key decision makers in the semiconductor, electronics and all related industries. We always present accurate and insightful analysis at these events backed up by sound data

What You Will Learn: This one-hour broadcast will focus on the chip industry outlook, including:
• Has the market boom turned to bust
• What is the market outlook for 2023
• What are the exposures, vulnerabilities, opportunities, losers and gainers
• What will the likely downturn repercussions be
• How to build resilient strategies and business models
• Opportunity to ask specific questions in advance, during and after the webinar.

Who Should Attend?
• All companies, small and large, from startups to established market leaders
• Key decision-makers engaged in the design, manufacture, or supply of semiconductors
• Government organisations involved in trade and investment
• Those involved in investing or banking within the electronics industry
• Senior marketing executives planning future marketing strategy

Why Future Horizons?

We have been in the business of forecasting and analysing the semiconductor market for over 55 years and have been a trusted advisor to governments, investors and most of the top global semiconductor firms. Time and time again, we have delivered sound advice and saved our clients time and money with our forensic and accurate analysis of the industry.

Malcolm Penn; Chairman & CEO; Future Horizons Registered Company: 4380991

Future Horizons on Social Media
Follow FH on Twitter, like FH on Facebook and join FH Linked In Group and receive regular industry news, information and comments.

Handbook of Semiconductor Devices

Massimo Rudan, Rossella Brunetti, Susanna Reggiani (Eds.)

Springer Handbook of Semiconductor Devices

Series: Springer Handbooks

1st ed., 2022, ca. 1700 p., 1300 illus.

Order online at link.springer.com or customerservice@springernature.com

Covers physical backgrounds, fabrication, application and modeling
Describes in detail both conventional and innovative devices
An indispensable resource for practitioners, professionals and researchers

This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications.

Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers.

Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances.

Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in. specific subject can easily identify personal reading path through the vast contents of the handbook.

Technological aspects

CMOS Manufacturing processes. Semiconductor memory technologies. BCD process technologies. Measuring techniques for the semiconductor's parameters. Interconnect Processing: Integration, Dielectrics, Metals. Wet Chemical Processes for BEOL Technology. From FinFET to nanosheets and beyond. Advanced Lithography. Advanced technologies for future materials and devices

Basic devices and applications

MOS Capacitors, MOS Transistors and Charge-Transfer Devices. Electrostatic doping and devices. Planar MOSFETs and their application to IC design. Silicon power devices. Silicon Carbide Power Devices. GaN- based lateral and vertical devices. Bipolar transistors and silicon diodes. Memory Challenges. Silicon sensors. Solar Cells. X-ray detectors. Photodetectors based on Emerging Materials. Terahertz Electronic Devices. Semiconductor Lasers

New-generation devices and architectures

Heterojunction tunnel field-effect transistors. Carbon based field-effect transistors. Negative capacitors and applications. Flexible Electronics and Biomedical Sensors. Bio-Degradable Electronics. Resistive Switch- ing Memories. Phase-Change Memories. Spin-Based Devices for Digital Applications. Memristive/CMOS devices for neuromorphic applications. Nanoelectronic Systems for quantum computing

Modeling

Compact/SPICE Modeling. Process simulation. A digital twin for MEMS and NEMS. Macroscopic Transport Models for Classical Device Simulation. Grid generation and Algebraic solvers. Spherical Harmonics Expansion and Multi-Scale Modeling. Charge Transport Models for Amorphous Chalcogenides. Application of the k.p method to device simulation. Ab initio methods for electronic transport in semiconductors and nanostructures. Quantum Transport in the Phase Space, the Wigner Equation. The Non-Equilibrium Green Function (NEGF) Method. Tight-Binding Models, their Applications to Device Modeling and Deployment to. Global Community

[Steven Kosier] Google, National Institute of Standards and Technology (NIST), and SkyWater Technology Foundry bring wafer-level economies of scale to materials and device research through this CRADA! #madeinamerica #freePDK #semi https://t.co/oI71mlHwfD

[Steven Kosier] Google, National Institute of Standards and Technology (NIST), and SkyWater Technology Foundry bring wafer-level economies of scale to materials and device research through this CRADA! #madeinamerica #freePDK #semi https://t.co/oI71mlHwfD
— Wladek Grabinski (@wladek60) Sep 14, 2022

from Twitter https://twitter.com/wladek60

September 14, 2022 at 09:20AM
via IFTTT

Sep 4, 2022

[mos-ak] [online publications] Recent MOS-AK Workshops

The MOS-AK Association has organized two subsequent compact/SPICE modeling workshops, its selected MOS-AK presentations with assigned DOI Numbers are available online:

4th International MOS-AK/LAEDC Workshop in Puebla (MX) on July 3, 2022
https://www.mos-ak.org/puebla_2022/
6th Sino MOS-AK Workshop in Guangzhou (CN) Aug. 11-12, 2022
https://www.mos-ak.org/guangzhou_2022/

The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and panels around the globe thru the 2022 Year, including:

IRPhE'2022, Yerevan (AM) Sept. 27-30, 2022
MOS-AK Brazil Panel (BR), Oct. 2022
15th US MOS-AK Workshop, Silicon Valley (US) Dec. 2022

in the timeframe of CMC and IEDM Meetings

W.Grabinski on the behalf of International MOS-AK Committee

WG040922

--
You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to mos-ak+unsubscribe@googlegroups.com.
To view this discussion on the web visit https://groups.google.com/d/msgid/mos-ak/CALp-Rj-F2meB1QwtSZT5wxez-_RR%3DOdj1ESpchGe8731f-CFAw%40mail.gmail.com.

[C4P] micro-nano 2022

Micro Nano 2022

9th International Conference on Micro-Nanoelectronics, Nanotechnology and MEMS

4-5 November 2022

Democritus University of Thrace, Vas. Sofias 12, 67132, Xanthi, Greece

https://2022.micro-nano.gr/

The annual conference is organized by the Micro&Nano Scientific Society of Greece and aims to connect people from academia, research and industry, to stimulate discussions on latest scientific achievements and further promote micro- and nanotechnology.

Important dates of the 9th International Micro-Nano Conference

Abstract submission deadline: 22 September 2022
Early bird registration: 7 October 2022
Late poster presentation: 16 October 2022
Conference: 4-5 November 2022

The conference committee encourages authors to submit papers on the thematic topics for oral or poster presentation.

Selected papers will be published in a special issue of Microelectronic Engineering, after peer review; see: Call for Papers and additional contact information: online form

TOPICS:

MATERIALS FOR ELECTRONICS, PHOTONICS & SENSORS

Semiconductors (Si-based, II-VI, III-V, SiC, Diamond)
Porous materials
Dielectrics
Organic materials
Self-assembling/self-organizing materials
Magnetic Materials
Metamaterials
Photonic Structures

MICRO AND NANO – FABRICATION

Front-end and back-end processes for IC fabrication
Patterning Technologies
Epitaxial growth
Self-assembly
Integration
Micromachining
Process Modeling and simulation

SENSORS AND ACTUATORS

Physical sensors
Chemical sensors
Bio-chemical sensors
Energy Harvesting devices
Microfluidics
MEMS
Detectors

ELECTRONIC, OPTOELECTRONIC AND PHOTONIC DEVICES

CMOS
Emerging non-CMOS
Devices based on 2-D materials
Microwave Devices
Thin Film Devices
Light Emitting and Organic electronic devices
Other Optoelectronic and Photonic Devices

MICRO AND NANO-TECHNOLOGY IN ENERGY

Energy storage (microbatteries, micro- and nano materials for electrodes, supecapacitors)
Energy harvesting (solar cells, electrostatic, piezoelectric)

Sep 3, 2022

Exploded view of first ASIC, inside the TinyTapeout project

Exploded view of my first ASIC, inside the TinyTapeout project

https://t.co/sBEUbFSbmZ #semi
— Wladek Grabinski (@wladek60) Sep 3, 2022

from Twitter https://twitter.com/wladek60

September 03, 2022 at 09:15PM
via IFTTT