Mar 18, 2024
[paper] Symmetric BSIM-SOI
Dec 20, 2023
[paper] PSP RF Model
1 School of Physics and Electronics, Hunan Normal University, Changsha 410081, China
2 Key Laboratory of Physics and Devices in Post-Moore Era, College of Hunan Province, Changsha 410081, China.
Nov 13, 2023
[paper] PSP RF Model
1 School of Physics and Electronics, Hunan Normal University, Changsha 410081, China.
2 Key Laboratory of Physics and Devices in Post-Moore Era, College of Hunan Province, Changsha 410081, China.
May 11, 2023
OpenPDK Networking Workshop
Networking Workshop FMD-QNC on 27-28 June 2023
Location:
IHP; Im Technologiepark 25; 15236 Frankfurt (Oder)
Contact:
Sergei Andreev; Phone: +49 335 5625 523
Presentation |
Presenter/Institution |
Timeline |
Day 1 |
||
Welcome by coordinator FMD-QNC |
Dr. Andreas Bruning |
9:00-9:10 |
Introduction FMD-QNC project status and IHP OpenPDK Roadmap |
Dr. Rene Scholz |
9:10-9:30 |
Status OpenPDK and OpenTooling for SG13G2 BiCMOS technology |
Sergei Andreev |
9:30-10:00 |
An Ultra-Low-Power High-Density Wireless Biomedical Sensing System
|
Prof. Harald Pretl |
10:00-10:30 |
Teaching digital design by using open-source EDA tools |
Prof. Steffen Reith |
10:30-11:00 |
Coffee break |
11:00-11:40 |
|
CMOS Rail-to-Rail Operational Amplifier for HPGe Radiation Detector |
Prof. Herman Jalli Ng |
11:40-12:10 |
Design-flow approaches for mmWave and sub-THz integrated transceiver circuits for radar and communication |
Sasha Breun
|
12:10-12:40 |
Lunch break |
12:40-13:40 |
|
TBD |
Dr. Frank K. Gurkaynak |
13:40-14:10 |
TBD |
Joachim Hebeler |
14:10-14:40 |
Coffee break |
14:40-15:10 |
|
TBD |
Prof.
Dietmar Kissinger |
15:10-15:40 |
LibMan - an easy way to manage your open source design flow |
Dr. Anton Datsuk |
15:40-16:10 |
Get together (Barbecue) |
|
17:00-… |
Day 2 |
||
ngspice - status and future developments |
Prof. Holger Vogt |
9:00-9:20 |
DMT - Python Toolkit for Device Modeling |
Mario Krattenmacher |
9:20-9:40 |
OpenVAF - Next Generation Verilog-A Compiler with ngspice integration |
Mario Krattenmacher |
9:40-10:00 |
Coffee break |
10:00-10:40 |
|
Best practices for implementing and optimizing KLayout DRC and LVS decks |
Matthias Köfferlein |
10:40-11:00 |
Generating DRC and LVS Runsets for KLayout |
Dr. Andreas Krinke |
11:00-11:20 |
OpenEMS in open source EDA |
Jan Taro Svejda |
11:20-11:40 |
Lunch break |
11:40-12:40 |
|
Panel discussion on the roadmap – open source tools for IC design Topics:
|
Dr. Norbert Herfurth Panelists: TBD |
12:40-14:10 |
Feb 20, 2023
[C4P] T-ED Special Issue
Call for Papers - Special Issue on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications."
Submission deadline: 31 August 2023
Publication date: February 2024
Submit papers today: https://bit.ly/3fESTgZ
Prof. Matteo Meneghini, University of Padova, ItalyProf. Patrick Fay, University of Notre Dame, USAProf. Digbijoy Nath, IISC BangaloreProf. Geok Ing Ng, Nanyang Technical University, SingaporeProf. Junxia Shi, University of Illinois, ChicagoProf. Shyh-Chiang Shen, Georgia Tech.
Jan 12, 2022
[paper] Pseudo-morphic PHEMT: Numerical Simulation Study
3. Center Exploitation Satellite Communications Agency of Space Oran, Algeria
4. University of Mostefa Benboulaid, Batna, Algeria
Jan 5, 2022
[book] Advanced ASM-HEMT Model for GaN HEMTs
Table of contents:
- Front Matter; pp. i-xv
- Gallium Nitride Semiconductor Devices; pp. 1-8
- Compact Modeling; pp. 9-19
- Introduction to ASM-HEMT Compact Model; pp. 21-31
- Core Formulations in ASM-HEMT Model; pp. 33-45
- Non-ideal Effects in Device Current and Their Modeling; pp. 47-62
- Trapping Models; pp. 63-81
- Non-Ideal Effects in GaN Capacitances and Their Modeling; pp. 83-100
- Gate Current Model; pp. 101-113
- Effect of Ambient Temperature on GaN Device; pp. 115-124
- Noise Models; pp. 125-130
- Parameter Extraction in ASM-HEMT Model; pp. 131-150
- Advance Simulations with ASM-HEMT Model; pp. 153-174
- Resources for ASM-HEMT Model Users; pp. 175-175
- Back Matter; pp. 175-188
Nov 13, 2021
Advances in RF and THz emerging electronic devices webinar at IPN-UAB
- Aníbal Uriel Pacheco Sanchez or
- Eloy Ramirez Garcia, IPN co-organizer
Jul 21, 2021
[paper] 11.8 GHz Fin Resonant Body Transistor
Mar 15, 2021
[paper] 3D integrated GaN/RF-SOI SPST switch
Sep 29, 2020
[thesis] RF UTBB FDSOI MOSFET
Sep 8, 2020
[paper] RF Small-Signal Model for Four-Port Network MOSFETs
2Maxim Integrated, Chandler, AZ, USA.
3Klipsch School of Electrical and Computer Engineering, New Mexico State University, Las Cruces, NM, USA.
Acknowledgment: This work has been supported by PRODEP program from SEP (Secretariat of Public Education, Mexico) and Universidad Autonoma de Aguascalientes, Aguascalientes, Mexico.
Sep 3, 2020
Broadband Measurements to 220 GHz
- Miniature mmWave MA25400A NLTL module connects directly to probes without cables for best dynamic range and stability
- MPI TITAN Probes available in 50, 75, and 100 um pitch
- Probes are field replaceable
- SOLT up 40 or 70 GHz if standards provide required performance
- LRM, ALRM, LRRM, and multiline TRL up to 220 GHz
- SOLR when thru is not 0 length, is not well matched, insertion loss is less known, and there is no .s2p file describing the thru
- Available from MPI
- When possible, use a ceramic chuck to minimize the potential for multimode parasitic propagation.
- Alternatively, use an isolation wafer on metal chuck if available
May 25, 2020
[paper] IoT Vision empowered by EH-MEMS and RF-MEMS
A (not so evanescent) unifying vision empowered
by EH-MEMS (energy harvesting MEMS) and RF-MEMS (radio frequency MEMS)
Fondazione Bruno Kessler (FBK) in Trento (IT)
FIG: Scheme of the pillar drivers supporting evolution of the IoT into IoE andTactile Internet. Some relevant IoT technology enablers are indicated. |
Apr 14, 2020
ICMTS2020 #paper: Cutoff Frequency Fluctuation in RF-MOSFETs
Novel Statistical Modeling and Parameter Extraction Methodology
of Cutoff Frequency for RF-MOSFETs
Fig: Calculated σfT is plotted against σfT obtained from measured data. |
Jul 12, 2019
IEEE ICECS 2019 paper submission deadline
Please distribute this reminder to possible contributors and interested researchers and colleagues. Topics of interest include but are not limited to:
• Analog/mixed-signal/RF circuits
• Biomedical and Bio-Inspired Circuits and Systems
• EDA, Test and Reliability
• Digital circuits and systems
• Linear and Non-linear Circuits
• Low-Power Low-Voltage Design
• Microsystems
• Neural networks, Machine and Deep Learning
• Sensors and Sensing Systems
• Signal Processing, Image and Video
• VLSI Systems and Applications
The technical committee invites authors to submit 4-page papers in standard IEEE double-column format, including references, figures and tables, to clearly present the work, methods, originality, significance and applications of the techniques discussed.
Maurizio Valle; IEEE ICECS 2019 General Chair
https://www.ieee-icecs2019.org/
Aug 28, 2017
[paper] Nanoscale MOSFET Modeling
Part 1: The Simplified EKV Model for the Design of Low-Power Analog Circuits
Jul 25, 2017
[paper] Compact On-Wafer Test Structures for Device RF Characterization
doi: 10.1109/TED.2017.2717196
Feb 17, 2017
[call for papers] 2017 IEEE S3S Conference
Tuesday, Oct.17: Monolithic 3D Half-day Tutorial
Scope: We welcome papers in the following areas: | |
Silicon On Insulator (SOI) | |
• Advanced Materials,
Substrate and Processes • Device Physics, Characterization and Modeling • Device/Circuit Integration • SOI Design, Circuits and Applications |
• Non-Digital Devices and
Applications (RF, HV, Photonics, NEMS, MEMS, Analog...) • New SOI Structures, Circuits and Applications |
Low-Voltage Microelectronics | |
• Space-Based and Unattended
Remote Sensors • Biomedical Devices • Low-Voltage Handheld/wireless systems • Ultra-Low-Power Digital Computation • Analog and RF Technologies |
• Low Voltage Memory
Technologies • Energy Harvesting Techniques • Asynchronous Circuits • Novel Device and Fabrication Technology |
3D Integration | |
• Low Thermal Budget
Processing • Fabrication Techniques and Bonding Methods • Design and Test Methodologies • Processes for Multi Wafer Stacking • 3D IC EDA and Design Technology |
• Heterogeneous Structures • 3D Manufacturing and Logistics • Reliability of 3D Circuits • Fault Tolerant 3D Designs |
Paper Submission:
Prospective authors should prepare a 2page abstract (follow online guidelines).
Acceptance is based on paper’s technical quality and relevance.
Conference manager contact Joyce Lloyd
6930 De Celis Pl., #36
Van Nuys, CA 91406
Tel: +1 818 795 3768
Fax: +1 818 855 8392
Feb 9, 2017
[paper] RF-MEMS for Future Mobile Applications: Experimental Verification of a Reconfigurable 8-Bit Power Attenuator up to 110 GHz
Jacopo Iannacci1 and Christian Tschoban2
1Center for Materials and Microsystems - CMM, Fondazione Bruno Kessler , Trento, ITALY
2Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM , Berlin, GERMANY
Journal of Micromechanics and Microengineering
Accepted Manuscript online 8 February 2017