[mos-ak] [online publications] 16th International MOS-AK Workshop Silicon Valley, Dec. 13, 2023

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Enabling Compact Modeling R&D Exchange

www.mos-ak.org

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Recent, 16th International MOS-AK Workshop hosted by Keysight Technologies in Santa Clara, CA 95051, on Dec. 13, 2023, featured invited talks from EDS Distinguished Lecturers (DL) and leading experts in the field. The selected R&D topics include self-heating and trapping effects in GaN HEMTs, Si2 CMC updates, integrated antennas, European open source PDK Initiative, re-energizing analog design using the open-source ecosystem, SPICE modeling of Si, GaN and SiC power FET devices, new models to capture generic device physics, quantum computing and simulation, open source neuromorphic computing, and custom IC designs using open source OpenFASOC. The workshop presentations are listed below:

T_0	Opening and MOS-AK Intro Wladek Grabinski MOS-AK (EU)
T_1	Welcome and A Brief History of Keysight Nilesh Kamdar Keysight EDA
T_2	Accurate Modeling of the Self-Heating and Trapping Effects in GaN HEMTs DOI:10.5281/zenodo.1042343 Yiao Li Keysight Technologies
T_3	Si2 Compact Model Coalition 2023 Updates DOI: 10.5281/zenodo.10423502 Peter M. Lee and Colin Shaw Si2 Compact Model Coalition

T_4	Some efforts toward the modeling of integrated antennas DOI: 10.5281/zenodo.10401753 Roberto S. Murphy-Arteaga, IEEE EDS DL INAOE, Puebla, Mexico
T_5	European Open Source PDK Initiative DOI: 10.5281/zenodo.10423518 Wladek Grabinski, IEEE EDS DL MOS-AK (EU)

T_6	Re-Energizing Analog Design using the Open-Source Ecosystem DOI: 10.5281/zenodo.10423729 Boris Murmann University of Hawaii
T_7	SPICE Modeling of Si, GaN and SiC Power FET Devices DOI: 10.5281/zenodo.10423740 Bogdan Tudor Silvaco, Inc.
T_8	A Transformer-Based Foundation Model to Capture Generic Device Physics DOI: 10.5281/zenodo.10423765 Hyunbo Cho Alsemy Inc.

T_9	Quantum Computing and Simulation DOI: 10.5281/zenodo.10423785 Hiu Yung Wong San Jose State University
T_10	Open Source Neuromorphic Computing DOI: 10.5281/zenodo.10423809 Jason Eshraghian // online Neuromorphic Computing Group at UC Santa Cruz
T_11	Accelerating custom Circuits using OpenFASOC DOI: 10.5281/zenodo.xxx Mehdi Saligane // online UMich (US)

The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and panels around the globe thru the 2024 Year, including:

• FOSDEM, Bruxelles (BE) Feb. 3-4, 2024
• MOS-AK/EDTM, Bangalore (IN) March 3-6, 2024
• 6th MOS-AK/LADEC, Guatemala City (GT) May 8-10, 2024
• Special CM Session, MIXDES, Gdańsk (PL) June 27-29, 2024
• 8th Sino MOS-AK Workshop (CN), August 2024
• 21st MOS-AK at ESSERC, Bruges (BE) Sept. 9-12, 2024
• 17th MOS-AK/Silicon Valley, (CMC/IEDM Timeframe) Dec. 2024

-- W.Grabinski on the behalf of the International MOS-AK Committee

22122023

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IFS2024 - Semiconductor Industry Update

Semiconductor Industry Update Webinar 

Registration Now Open

Last year's IFS forecast called for a double-digit decline in 2023, contrary to perceived wisdom favored ongoing industry growth. Our forecast proved right.

With 2023 now firmly in the rear-view mirror, all eyes are fixed on 2024's outlook. This time around, industry consensus favors strong double-digit growth, driven by Gen AI, strong demand for GPUs, and a recovery in memory and, on an annualized basis, the math clearly shows the chip industry value growth is powering ahead.

But, inventory levels remain stubbornly high with wafer fab utilization rates low, casting a shadow over the future
• When will unit growth return?
• Can the world economy continue to defy gravity forever?
• Is the current surge in ASPs sustainable?
• Is the 'recovery' real or just a reflection of last year's bad data providing a weak base for comparison?

Find out the answer to these and other key questions at Future Horizons' IFS2024 annual industry update outlook webinar, Jan 16, 2024, 3pm UK GMT
https://www.futurehorizons.com/page/136/Industry-Update-Webinar

Register at https://us02web.zoom.us/webinar/register/7416911384194/WN_NHk_8-UiS3KSh90PA3dptw

What Will You Hear
This one-hour broadcast will focus on the chip industry outlook, including:
• What happened in 2023 vs. last year's January forecast?
• What is the market forecast for 2024?
• What's happening in CapEx, investment, and onshoring trends?
• What are the likely opportunities and implications for the industry?
• How to build resilient business strategies, plus
• Opportunity to ask specific questions in advance, during and after the webinar.

Who Should Attend
All companies, small and large, from startups to established market leaders.
• Key decision-makers in the design, manufacture, or supply of semiconductors.
• Government organizations in industry, trade, and investment.
• Those involved in M&A, investment, or finance within the electronics industry.
• Senior industry executives planning future marketing strategy.

Your Trusted Industry Advisor
Founded in 1989, Future Horizons has been in the business of forecasting and analyzing the semiconductor market for 35 years and has been a trusted advisor to governments, investors, startups, and most of the top global semiconductor firms. Our forecast track record and hands-on industry experience, dating back to the first commercial IC, longer than any other analyst and most industry execs, make this a must-attend event for key decision makers in semiconductors, electronics, and all related industries. We always present accurate and insightful analysis at these events, consistently helping our clients save time and money with our insightful and accurate analysis of the industry.

Fee
For a small investment of UK £150 plus £30 UK VAT you will gain accurate industry insight to make good strategic decisions in these uncertain times
• Discount available for 3 or more attendees from the same company/organisation
• Can't attend? No need to miss out, order the webinar video recording and slides instead.
• If already registered or not directly suitable for you, please pass it to a colleague or associate.
• The event can also be repeated on-line or in-person in-house for your added convenience and flexibility.

Register now at https://us02web.zoom.us/webinar/register/7416911384194/WN_NHk_8-UiS3KSh90PA3dptw

Malcolm Penn
Chairman & CEO

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[paper] PSP RF Model

Xiaonian Liu1, 2, and Yansen Liu1, 2

Scalable PSP RF Model for 0.11 µm MOSFETs

Progress In Electromagnetics Research Letters, Vol. 113, 43–51, 2023

1 School of Physics and Electronics, Hunan Normal University, Changsha 410081, China
2 Key Laboratory of Physics and Devices in Post-Moore Era, College of Hunan Province, Changsha 410081, China.

Abstract: An accurate, efficient and scalable SPICE model is essential for modern integrated circuits design, especially for radio frequency (RF) circuit design. A PSP based scalable RF model is extracted and verified in 0.11 µm CMOS manufacturing process. The S parameter measurement system and open-short de-embedding technique is applied. The macro-model equivalent subcircuit and parameters extraction strategy are discussed. The extracted model can match the de-embedded S parameters data well. By combining the model parameters’ dependencies on each geometry quantity, the scalable expression of parameters with all geometry quantities included can be obtained. This work can be a reference for the RF MOSFETs modeling and RF circuit design.

Fig: The PSP RF subcircuit model and its S-par s fitting

results of NMOS with Wf = 2 µm, Lf = 0.12 µm, nf = 16

Acknowledgment: This work is supported by the National Natural Science Foundation of China under Grant 62204083, and the Youth Fund of Education Department of Hunan Province under Grant 21B0057.

[paper] Device for the Detection and Quantification of Exosomes

Diego Barrettino1, Christoph Zumbühl1, Raphael Kummer1, Markus Thalmann1, Carolina Balbi2, Giuseppe Vassalli2, Rosane Moura Dos Santos3 and Jean-Michel Sallese3

Low-Cost Portable Medical Device for the Detection and Quantification of Exosomes

2023 IEEE SENSORS, Vienna, Austria, 2023, pp. 1-4,

doi: 10.1109/SENSORS56945.2023.10325271. 

1 Lucerne University of Applied Sciences and Arts (HSLU), Institute of Electrical Engineering, CH- 6048 Horw, Switzerland
2 Istituto Cardiocentro Ticino, Via Tesserete 48, CH-6900 Lugano, Switzerland
3 Swiss Federal Institute of Technology Lausanne (EPFL), EPFL SCI STI EDLAB, Station 11, CH-1015 Lausanne, Switzerland

Abstract: The design, fabrication and testing of a low-cost portable medical device for the detection and quantification of exosomes is presented in this paper. The portable medical device comprises a sensor array that can detect the presence of exosomes and quantify its concentration, a microfluidic device that handles the human serum containing the exosomes, and all the necessary readout and control electronics. Measurement results performed with exosomes showed that the portable medical device can detect exosomes with a concentration of 2.5x108 /µL thus paving the way to a wide range of diagnostic applications.

Fig. Exosome immobilized on top of the functionalized (antibody CD63 +protein G
+ polydopamine + graphene oxide) JLFET biosensor and tagged with a gold (Au) nanoparticle attached to an exosome biomarker (antibody CD31)

[C4P] 50th ESSERC, Sept. 9-12. 2024, Bruges (BE)

CALL FOR PAPERS

https://www.esserc2024.org/papers

The aim of ESSERC (European Solid-State Electronics Conference) is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. It is a continuation of the past ESSDERC-ESSCIRC conferences. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary. 

ESSERC is governed by a Steering Committee and consists of Plenary Keynote Presentations, invited papers and session on technology, circuits and joint papers bridging both device and circuit communities, respectively. 

PAPERS SUBMISSION DEADLINE: APRIL 5, 2024

Papers submitted for review must clearly state:

• The purpose of the work
• How and to what extent it advances the state-of-the art
• Specific results and their impact

Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference. Measurement results or calibration against measured data is required to support the claims of the submitted paper.

After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 24 May 2024.

At the same time, the complete program will be published on the conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication. The submitted final PDF files should be IEEE Xplore compliant.

For each paper independently, at least one (co-)author is required to register for the Conference (one registration one paper policy). Registration fees and deadlines will be soon available

CONFERENCE TRACKS (although not limited, papers are solicited for the following main topics):

1. Advanced Technology, Process and Materials
2. Analog, Power and RF Devices
3. Compact Modeling and Process/Device Simulation
   
   TCAD and advanced simulation techniques and studies, compact/ SPICE modeling of electronic, optical, organic, emerging, and hybrid devices and their IC implementation and interconnection. Verilog-A models of semiconductor devices (including bio/ med sensors, MEMS, microwave, RF, high voltage and power, emerging technologies, and novel devices), parameter extraction, reliability and variability, performance evaluation and open-source benchmarking/implementation methodologies. Modeling of interactions between process, device and circuit design, design/technology co-optimization, foundry/fabless interface strategies. Numerical, analytical, statistical modeling and simulation of electronic, optical and hybrid devices, interconnect, isolation, and 2D/3D integration. Simulations of material properties and fabrication processes. Advanced physical phenomena (quantum mechanical and non-stationary transport phenomena, ballistic transport). Mechanical and/or electro-thermal modeling and simulation. Simulations of reliability aspects of materials and devices.
4. Analog Circuits
5. Data Converters
6. RF & mm-Wave Circuits
7. Frequency Generation Circuits
8. Digital Circuits & Systems
9. Power Management
10. Wireless Systems
11. Wireline and Optical Circuits and Systems
12. Emerging Computing Devices and Circuits
13. Architectures and Circuits for AI and ML
14. Devices & Circuits for Sensors, Imagers and Displays

WHY BRUGES?

Bruges is a place that lives and breathes history. Visiting this historic city means travelling back in time to the Middle Ages. It is both magical and authentic. Brugge in medieval times was known as a commercial metropolis in the heart of Europe. 

Bruges is one of Europe’s best-preserved cities, evidenced by the fact that its historic city center has been designated an UNESCO World Heritage Site. The iconic spires of its cathedral and bell tower, its cobbled streets, winding canals and whitewashed façades are almost painfully picturesque.

In the 15th century, Brugge was the cradle of the Flemish Primitives and a center of patronage and painting development for artists such as Jan van Eyck and Hans Memling. Many of their works were exported and influenced painting styles all over Europe. Exceptionally important collections have remained in the city until today. Travelers from all over the world are coming to Belgium to visit Bruges.