[paper] From RTL to Prompt Coding Chip Design

Lukas Krupp∗, Matthew Venn† and Norbert Wehn∗

From RTL to Prompt Coding: Empowering the Next Generation of Chip Designers through LLMs

arXiv:2601.13815v1 [cs.AR] 20 Jan 2026

∗RPTU University of Kaiserslautern-Landau, Kaiserslautern, Germany

†Tiny Tapeout

Abstract: This paper presents an LLM-based learning platform for chip design education, aiming to make chip design accessible to beginners without overwhelming them with technical complexity. It represents the first educational platform that assists learners holistically across both frontend and backend design. The proposed approach integrates an LLM-based chat agent into a browser-based workflow built upon the Tiny Tapeout ecosystem. The workflow guides users from an initial design idea through RTL code generation to a tapeout-ready chip. To evaluate the concept, a case study was conducted with 18 high-school students. Within a 90-minute session they developed eight functional VGA chip designs in a 130 nm technology. Despite having no prior experience in chip design, all groups successfully implemented tapeout-ready projects. The results demonstrate the feasibility and educational impact of LLM-assisted chip design, highlighting its potential to attract and inspire early learners and significantly broaden the target audience for the field.

Fig: Overview of the proposed idea-to-GDSII learning workflow integrating the LLM-based chat agent for the RTL implementation, VGA simulation tool, and GitHub-driven backend flow.

Acknowledgments: This paper was funded by the German Federal Ministry of Research, Technology and Space (BMFTR) as part of the “Chipdesign Germany” project under grant number 16ME0890.

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Open Silicon microelectronic bootcamp

Call for leaders to organize an Open Silicon microelectronic bootcamp

Bring Chip Design to Your Community!

Join the global Open Silicon movement and gain hands-on experience in chip design and fabrication. Our Q1 2026 bootcamps provide access, mentoring, and real silicon opportunities for students, educators, and innovators.

The IEEE is seeking passionate leaders from around the world to organize microelectronics design bootcamps in their local communities, under the IEEE division 1 OPEN SILICON initiative.

If you organize a bootcamp between February and May 2026, IEEE will sponsor the fabrication of three of your designs. You'll receive your fabricated chips (tape-out) mounted on a development board for testing and hands-on exploration.

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