Oct 28, 2026

[paper] Cryo MOSFET Gate Capacitance

Sadık İlik, Masoud Babaie, Andrei Vladimirescu and Fabio Sebastiano
Characterization and Modeling of MOSFET Gate Capacitance Under Cryogenic Operation
IEEE Journal of the Electron Devices Society (2026)
DOI 10.1109/JEDS.2026.3745897

1 Delft University of Technology, 2628 CJ Delft (NL)
2 Qutech, 2628 CJ Delft (NL)
3 University of California at Berkeley, CA (US)

Abstract—The modeling of incomplete ionization is a key element for a reliable and scalable cryogenic transistor model. Despite the increasing interest in cryo-CMOS modeling, capacitance–voltage (CV) characteristics remain relatively unexplored, even though they are less sensitive to secondary effects, such as mobility variations, than DC measurements. While the experimental data in the literature are few and limited, a clear discrepancy is observed between model predictions and capacitance–voltage (CV) measurements. To address these limitations, this paper presents a new, accurate, and scalable capacitance model including an incomplete ionization model that predicts cryogenic behavior more accurately than existing models, along with a corresponding charge model derived from the proposed formulation. The model accurately reproduces all CV features, including the field-dependent ionization–induced flatband voltage dip, the depletion-region capacitance, the trap related threshold voltage humps, and the inversion region. Extensive CV characterizations over multiple device geometries, frequencies, AC excitation voltages, and temperatures are finally used to validate the model.
Fig: Inversion capacitance at 4.2 K for PMOS (a)–(d) and NMOS (e)–(h) devices with varying geometries. In (a), (b), (d), (e), (f), and (h), identical small-sized devices are connected in parallel to enable characterization with sufficient SNR.




Oct 27, 2026

[Open Hardware] CfP: FOSDEM 2027 Open Hardware and CAD/CAM Devroom

The Open Hardware and CAD/CAM "devroom" at FOSDEM 2027

is an opportunity for developers of Open Hardware projects and related software tools to gather and share their work, meet developers from other projects, network, and learn from one another.The 2027 devroom is once again being coordinated by Chris Hennes (@chennes, chennes@freecad.org) and Jo Hinchliffe (@concretedog, jo@concretedog.xyz). We carry on the tradition developed over the many years of this DevRoom's existence of a dynamic, interactive room full of interesting presentations and projects.

Call for Participation 

 We are pleased to announce the CfP for the Open Hardware and CAD/CAM devroom at FOSDEM 2027, 30 & 31 January 2027 in Brussels, Belgium. The devroom will take place on Sunday 09:00–13:00, 31 January 2027 at [ULB (Campus Solbosch)]. We hope you'll join us for a half day of talks, demos and interesting discussions on designing, modeling and testing hardware using Open Source tools. We welcome any talk proposals about the design and creation of physical objects. Topics of interest include, but are not limited to: 

- Open Hardware Projects 
* Open circuits 
* Product design 
* The business of open hardware 
- Circuit Design
* Printed circuit board design tools 
* Circuit simulation 
- 3D modeling and analysis
* Solid modeling tools
* Meshing, modeling and transforming physical representations
* Finite element analysis 
- 3D printing
* 3d slicing tools 
* Motor control 
- Machine design and integration
* Open Hardware projects
* ECAD/MCAD integration
* Thermal analysis
* Wire modeling 
- Physical Model Data storage
* Data representation and optimization
* Version control in hardware data storage
* Collaborative and team-based hardware design techniques 

Talk slots will be 20 minutes **total**, inclusive of time for questions. Presenters are encouraged to plan to speak for about 15 minutes, to ensure enough time for what is often a very lively Q&A segment. Note that this is shorter than previous years, since the 2027 edition is only a half day: talk fast! 

Important Dates 
* Submission deadline: 4 December 2026 
* Acceptance notifications: 11 December 2026 
* Final schedule announcement: 14 December 2026 
* Devroom: Sunday 31 January 2027 ## The submission process 

Please submit your proposal at the FOSDEM pretalx site before 4 Dec 2026. Select the "Open Hardware and CAD/CAM" session. Please note that the "Open Source Design" track, while a lovely group of wonderful hackers, is not the same. 

Please include the following information with your submission: 
- Abstract 
- Speaker bio 
- Link to any hardware / code /slides for the talk 
 
Fill in at least a title and abstract for the proposed talk. Keep in mind that much of the value in these meetings comes from the discussions, so please allot at least 20% of the talk time for questions and answers. 

Questions? 
If you have any questions or need guidance on any aspect of submitting, preparing or presenting, please e-mail channels at freecad.org. 

Volunteering 
If you are interested in helping the devroom run smoothly, please reach out to Chris Hennes (@chennes) or Jo Hinchliffe (@concretedog) and we'll be very happy to have your assistance! 

Recordings 
The talks will be recorded and live-streamed during FOSDEM'27. The recordings will be
published under the same licence as all FOSDEM content (CC-BY-4.0). Only presentations and
Q&A will be recorded, not informal discussions and whatever happens during breaks between
presentations. We require affirmative consent to this license. 

Please include the following statement in your submission notes: `
`` If my presentation is accepted for FOSDEM, I hereby agree to license all recordings, slides, and other associated materials under the Creative Commons Attribution Share-Alike 4.0 International License. Sincerely, <NAME> ``` 

Chris Hennes (@chennes)
The FreeCAD Project Association AISBL
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To unsubscribe send an email to open-hardware-devroom-leave@lists.fosdem.org
https://lists.fosdem.org/postorius/lists/open-hardware-devroom.lists.fosdem.org/

TSMC Europe OIP Ecosystem Workshop

Meet Dolphin Semiconductor at 
TSMC Europe OIP Ecosystem Workshop

📅 November 24, 2026

📍 Booth, Hilton Munich Airport, Germany

 

Come to our booth to learn how our TSMC-based, ultra-low-power, and smart IP solutions can shorten your design cycle and thus accelerate your Time-to-Market.

 

Book a meeting with us now to secure a dedicated slot before the show fills up.

We look forward to seeing you at TSMC Open Innovation Platform Ecosystem Forum and sharing a glimpse into the future of our technology with you!



Oct 24, 2026

[chipfoundry] December Shuttle (CI2612)



Commitment and 50% payment due November 4. Tapeout December 7. Plus new drop-in analog IP for your design.‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­‌   ­

Oct 17, 2026

[paper] ACM3 Compact MOSFET Model

Deni Germano Alves Neto; Márcio Cherem Schneider; Manuel J. Barragan; 
Sylvain Bourdel; Carlos Galup-Montoro,
ACM3 - An Advanced Compact MOSFET Model for Analog IC Design and Simulation
in IEEE Access, DOI: 10.1109/ACCESS.2026.3742180

1.) Federal University of Santa Catarina, 88040-900 Florianópolis (BR)
2.) Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA F-38000 Grenoble (F)

Abstract: This paper presents ACM3, an advanced compact MOSFET model that extends the designoriented ACM2 formulation by introducing gate-voltage dependencies for the slope factor n, the draininduced barrier lowering (DIBL) coefficient σ, and inversion charge dependence for the specific current IS. ACM3 preserves a single-piece, charge-based description of the drain current, valid from weak to strong inversion and from the linear to the saturation regions, while relying on an efficient analytical approximation of the Lambert W -function suitable for Verilog-A implementation. A robust yet straightforward parameterextraction flow is proposed, in which all eight DC parameters (VT 0, IS0, Φ, γ, θ, σWI , σSI and ζ) are obtained directly from ID–VGB and ID–VDS curves through a differential evolution (DE) algorithm that minimizes the root-mean-square percentage error between the reference and the modeled drain current. A distinctive feature of this flow is that the reference curves may originate either from silicon measurements or from another compact model, making the extraction equally applicable to measured and simulated data. At the device level, the parameters are extracted from silicon measurements of an open-source 130 nm BiCMOS technology, yielding agreement with the measured data for both short- and long-channel transistors across all regions of operation. At the circuit level, ACM3 is validated through simulations of a common-source amplifier, a self-biased current source, and a CMOS latch in a 180 nm CMOS technology, where the ACM3 parameters are extracted from BSIM4-generated characteristics and the results are compared against the foundry BSIM4 model. Representative process, voltage, and temperature (PVT) robustness is also evaluated against BSIM4. The ACM3 model has been implemented in Verilog-A and integrated into open-source circuit simulators, via OpenVAF, enabling accurate and intuitive analog IC design within fully open design flows.

TAB: Comparison of ACM3 with representative industrial 
and design-oriented compact MOSFET models

Aknowlegements: This study was financed in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior, (BRAZIL), Conselho Nacional de Desenvolvimento Científico e Tecnológico, (BRAZIL), and TIMA laboratory, Grenoble (FRANCE).