Jul 9, 2026

[paper] Reconfigurable Characteristics in MoS2 Transistors

Matteo Farronato, Fabio Carletti, Niccolò Garegnani, Anupam Jana, Matteo Porzani, Saverio Ricci, Augusta Ungarelli, Christian Monzio Compagnoni, Paolo Fantini, Innocenzo Tortorelli, Agostino Pirovano, Christian Rinaldi and Daniele Ielmini
Voltage-controlled reconfigurable characteristics in MoS2 transistors 
via ion migration for reprogrammable logic.
NPJ 2D Mater Appl (2026)
DOI: 10.1038/s41699-026-00720-2

1 DEIB, Politecnico di Milano and IU.NET, Milano, Italy
2 Dipartimento di Fisica, Politecnico di Milano, Italy
3 Micron Technology Inc., Vimercate (MB), Italy

Abstract: 2D semiconductors such as MoS2 offer a promising pathway for future logic and analog transistors and memories. These materials feature scalable channel size, back-end of the line compatibility, and high mobility for relatively small channel thickness approaching few atomic monolayers. An open issue for the development of mature 2D-based digital technology is the availability of both n- and p-type transistors, as well as the ability to control the transistor type in a reconfigurable way. This work presents a novel MoS2-based transistor exhibiting reconfigurable n- or p-type characteristics, namely switching from n-type to p-type and vice versa, which is attributed to ion-assisted doping from the gate dielectric layer. Extensive characterization of the device shows repeatable switching with relatively low cycle-to-cycle (C2C) and device-to-device (D2D) variability. A reconfigurable p-n junction is demonstrated via a junction-less multi-gate MoS2-based transistor. We also demonstrate various reconfigurable logic gates, including a complementary metal-oxide-semiconductor (CMOS) inverter, a fully n-type inverter and an XNOR logic gate based on MoS2 transistors, showcasing the generality and flexibility of channel reconfiguration for logic circuit applications. These results underscore the strong potential of reconfigurable MoS2 transistors for ultra-scaled, reconfigurable logic circuits.
Fig: Logic gates with reconfigurable MoS2 transistors. (a) SEM image of a logic inverter or CMOSNOT gate with two transistors in the same MoS2 flake. (b) Schematic of the inverter with reconfigurable MoS2 transistors and logic truth table.

Acknowledgments: This article has received funding from the European Research Council (ERC) under the EuropeanUnion’s Horizon Europe Research and Innovation Programme (grant 101054098). Authors want tothank all the Polifab (the micro and nano technology infrastructure of Politecnico di Milano) staff fortheir help in the fabrication of the MoS2-based devices.

Jul 8, 2026

[paper] Harmonic Distortion of GaN HEMT Varactors

Loukas Chevas 1,  Matthias Bucher 1,  Nikolaos Makris 1,2, Ioannis Spiridon Fosteris 1,  Nikolaos Fasarakis 1,  Antonios Stavrinidis 2,1, Maria Kayambaki 2,  Athanasios Kostopoulos 2 
and George Konstantinidis 2
Methodology for Harmonic Distortion Characterization and Modelling of GaN HEMT Varactors
Instruments 2026, 10(3), 37; 

1 School of Electrical and Computer Engineering, Technical University of Crete, 73500 Chania, Greece
2 Institute of Electronic Structure and Laser, Foundation for Research and Technology-Hellas, 70013 Heraklion, Greece

Abstract: The bias-dependent capacitance of varactors can introduce harmonic distortion into the circuits where they are utilized. A gate capacitance model valid through inversion–depletion has been presented for GaN HEMT varactors in the drive for their utilization in monolithic GaN ASICs. This work focuses on the circuit and the methodology employed to accurately measure on wafer the harmonic distortion caused by one such device. The circuit is presented and its design considerations and operation trade-offs are discussed, followed by a presentation of the measurements resulting from its use. Second- and third-order harmonic distortion is recorded and presented, with Verilog-A model simulations used to fit the measured data. The model consists of a charge-based expression of the HEMT varactor capacitance, with a minimal number of parameters. The good fit of the model is demonstrated, proving both the suitability of the circuit used for the measurements and the validity of the capacitance model for real-world applications.  
Fig: Measurement setup schematic for the harmonic distortion characterization of HEMT varactors and V(f) characterization of the HEMT varactor. Inset is the parallel impedance combination measured by the LCR meter. (a) Cgc(Vg) for fixed frequencies. (b) Cgc(f) for fixed Vg levels. (c) Rp(Vg) for fixed frequencies. (d) Rp(f) for fixed Vg levels.

Aknowlegements: This research was partially funded by the European Union under the project AGAMI_EURIGAMI (ID:101102983).

Data Availability Statement: The measurement data generated and analyzed during the present study are available from the corresponding author upon reasonable request.

Jul 6, 2026

[mos-ak] [Final Program] 23rd MOS-AK/ESSERC Workshop in Palma de Mallorca (SP) Sept. 7, 2026

image.png
Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
MOS-AK FOSS OpenPDK Workshop
ESSERC, Palma de Mallorca, Sept. 7 2026

The 23rd MOS‑AK/ESSERC Compact Modeling Workshop in Palma de Mallorca brings together the international community advancing SPICE/Verilog‑A modeling, OpenPDKs, and open‑source IC design flows. Since 2002 ESSEDRC/ESSCIRC in Porto, MOS‑AK has been the leading forum connecting technology developers, circuit designers, and FOSS CAD/EDA contributors, supporting knowledge exchange and strengthening the open semiconductor ecosystem. This year’s program showcases cutting‑edge developments: GaN MOS‑HEMT compact models for emerging OpenPDKs, AI/ML‑driven modeling workflows replacing manual tuning, cryogenic FD‑SOI model libraries, fully open‑source RFIC design case studies using IIC‑OSIC‑TOOLS, reliability insights for advanced CMOS and RF technologies, and a new OpenPDK MOSFET matching matrix IC enabling fast mismatch characterization. The workshop organizers are inviting engineers, researchers, and students who want a clear, practical view of modern device models and open simulation frameworks. It directly supports global OpenPDK adoption and aligns with European ODE4EC‑AMS activities, promoting accessible, reproducible, and future‑ready IC design methodologies. The MOS-AK workshop program is available online as well as with the direct link:
<https://www.mos-ak.org/palma_2026/>

Venue: ESSERC, Palma de Mallorca (SP)
Online Registration is OPEN (Early: until FRIDAY July 17, 2026)

MOS-AK ESSERC W7 Workshop Agenda
9:30 - 11:00 W7 Workshop Opening
T_1  ODE4EC-AMS OpenPDK: the Status and Roadmap
Wladek Grabinski
IHP OpenPDK (D)
T_2  Advanced in Verilog-A Model Standardization
Arpad Buermen
Uni. Ljubljana (SL)
T_3  Compact Modeling of GaN MOS-HEMTs for Open PDKs
Ashkhen Yesayan
EPFL (CH)
T_4  From Manual Tuning to Agentic AI: Transforming Device Modeling with AI/ML
Roberto Tinti
Keysight (US)
11:00 - 11:30 Coffee Break
T_5  Development of Cryogenic Model Libraries for FD-SOI Transistors
Phanish Chava
AdMOS (D)
T_6  Open-Source RFIC Design: Case Studies Using IIC-OSIC-TOOLS
Georg Zachl
JKU Linz (A)
T_7  Reliability topics for the miniaturization and qualification in OpenSilicon perspective
Fernando Guarin
IEEE EDS D1 (US)
T_8  OpenPDK MOSFET Matching Matrix IC
Juan Brito
CEITEC (BR)
13:00-14:00 End of the W7 Workshop and Lunch Break

W.Grabinski for Extended MOS-AK Committee
WG060726

Jul 3, 2026

[mos-ak] [C4P] Submissions Now Open for IEDM 2026

Submit a Paper

Meeting Info

Contact Us

Submissions Now Open

Deadline: July 16, 2026

The IEEE International Electron Devices Meeting Committee is seeking paper submissions for the 2026 IEDM Conference, themed “Devices at the Hearth of the Intelligence Revolution” We invite contributions from various areas of expertise (view all suggested topics). 

  • Format: Papers must be submitted electronically in a PDF format, compatible with IEEE Xplore
  • Guidelines: Before preparing your paper, please review the paper preparation and submission guidelines on our website where you’ll find a paper template, sample paper and additional preparation details.
  • Presentation: Accepted papers MUST be presented in person at the conference AND authors must submit a pre-recording of their presentation for OnDemand registrants.
Call for Papers Info

Student Papers

We highly encourage student submissions. Papers presented by students based on their own work are eligible for the Best Student Paper Award. To be considered, the paper must be identified as a student paper during submission. The award will be judged on the paper's quality and its presentation, which must be delivered by the student. The winner of the award will be announced and honored at IEDM 2027.

MEETING HIGHLIGHTS

IEDM is the world’s preeminent forum for reporting technological breakthroughs in semiconductor and electronic device technology, design, manufacturing, physics, and modeling.


The conference will feature:

  • Three plenary presentations 
  • Special focus sessions 
  • Evening panel discussions 
  • Tutorial sessions
  • Short Courses 


Mark your calendar for December 12-16, 2026, and join us in San Francisco, CA.

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Jun 20, 2026

[paper] SPICE-Q Quantum Chip Production

Ling Qiao Cai1,2, Bin Yang1,2, Fumin Luo1,2, Chang Liu1,2, WeiGui Guo1,2, GuoRong Zhang1,2, XueFei Liu1,2, Qinglang Guo1,2 and Bin Wu
SPICE-Q and Large-Scale Quantum Chip Production
[quant-ph] 16 Jun 2026 
arXiv:2606.17907v1  

1.) Yangtze Delta Industrial Innovation Center of Quantum Science and Technology, Suzhou, (CN)
2.) China Academy of Electronics and Information Technology, No. 11 Shuangyuan Road, Shijingshan District, Beijing, (CN)


Abstract: The historical analogy with SPICE is based on foundational reports, numerical methods, and experience from integrated circuit design. The requirements for quantum computing and scaling refer to established work in the field. The background on superconducting qubits, transmons, circuit quantum electrodynamics, microwave networks, material loss, and three‑dimensional interconnects draw from widely recognized literature. The background on parameter extraction, simulation frameworks, and manufacturability is informed by recent research and practical developments.

Table of Contents (Top‑Level Sections)
  1. Abstract ... p. 4
  2. The Emergence of SPICE and Large‑Scale Classical Circuits
    and Its Implications for Quantum Chips ... p. 5
  3. SPICE‑Q Model Composition ... p. 24
  4. SPICE‑Q Device‑Level Models ... p. 40
  5. Standardized Manufacturing System ... p. 53
  6. Integrating SPICE‑Q with Process Models ... p. 66
  7. Design‑Technology Co‑Optimization (DTCO) ... p. 71
  8. Large‑Scale Production Examples and Design Scenarios ... p. 75
  9. Engineering Transition and Large‑Scale Quantum Chips ... p. 80
  10. Summary ... p. 84
  11. Acknowledgment ... p. 87
  12. Reference ... p. 87
  13. Appendix A ... p. 90
Acknowledgment The authors thank Jun Ye for helpful assistance. The authors also acknowledge the use
of AI tools for translation assistance and auxiliary text generation.