[webinar] SPICE Device Modeling and Circuit Simulation

Mansun Chan

Circuit Simulation and Device Modeling: From SPICE Fundamentals to Industrial BSIM Models

DOI 10.17023/9439-t168

This tutorial introduces the fundamentals of circuit simulation and compact device modelling for integrated circuit design. Starting from SPICE-based circuit simulation #it explains the role of device models #the requirements for DC #transient #and AC analyses #and the trade-offs between physical accuracy and simulation efficiency. The development of industrial compact models is illustrated using BSIM3 as an example #providing insight into how practical device models are constructed and used in modern circuit design [EDS Education Committee]

More EDS Education Resources like this:

SPICE Models: Problems and Opportunities

Compact Modeling of MOSFETs: Overview and Challenges

#simulation #modeling #circuit #SPICE #bsim #mosfet #transistor #compact #tcad #jacobian #conductance #voltage

[webinar] Silicon for AI

Silicon for AI: Breaking Barriers in IC Fabrication through Open Silicon

[IEEE CAS Webinar]

Join us for a CASS-supported webinar exploring Integrated-Circuit Fabrication through the IEEE DI Open Silicon Initiative

Date: 21 September 2026 at 10:00 AM ET | 7:00 AM PT

Don't miss this opportunity to learn more about efforts to break down barriers to silicon access and support innovation in integrated-circuit design and fabrication.

Register online or using the QR code in the graphic!

#IEEE #IEEECASS #OpenSilicon #IntegratedCircuits #ICDesign #Semiconductors #Silicon #AI

[mos-ak] //ICMC 2027// Conference committees: Call for Participation

Subject: [CMC] ICMC 2027 Conference committees: Call for Participation

Join the ICMC 2027 Organizing Team!

ICMC 2026 was a great success, thank you to everyone who contributed! We’re excited to announce that preparations are already underway for the next edition on July 15–16, 2027 in San Jose, California. For ICMC information and Photo Gallery, go to  https://si2-icmc.org.

We are currently seeking enthusiastic volunteers to join the ICMC 2027 conference committees. If you're interested in helping shape next year’s event, please complete this interest survey:

https://survey.zohopublic.com/zs/edC25U
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Summary of Committee Responsibilities:

• Organizing Committee: Oversees the overall planning and execution of the yearly edition of the ICMC Conference. Coordinates among sub-committees and maintains regular communication to track progress and confirm major decisions.
• Technical Program Committee: Defines the major topics and focus areas and develops the technical program for the conference, creates the call for papers, and defines, organizes and oversees the paper review procedures.
• Publicity Committee: Develops and implements the marketing plan to promote the conference and increase its visibility.

[conference] IRPhE' 2026 Sept. 28-30 2026, Yerevan

International Conference on Microwave & THz Technologies, Wireless Communications
and OptoElectronics

IRPhE' 2026 

<http://www.irphe.am/?q=conference>  

September 28-30 2026, Yerevan (Armenia)

The upcoming IRPhE' 2026 Conferences is dedicated to 90-years jubilee of academician Radik Martirosyan

IRPhE’ 2026 Main R&D Topics:

• Microwave devices, antennas, propagations and remote sensing
• THz technique, spectroscopy and applications
• Microwave Photonics
• Wireless communications and related information technologies
• Alternative semiconductor and dielectric materials, electronic and optoelectronic devices

Submission Information:

• Original one page abstracts will be accepted for review in Word and PDF formats
• Abstract submission deadline: August 31, 2026
• The authors of accepted abstracts will be invited to submit 4-6 page papers for publication in the Conference Proceedings. Final full paper submission deadline: October 10, 2026
• Best papers selected through peer-review process will be invited for publication in the special issue of a Scopus indexed journal publishing interdisciplinary research between electronics and systems, high speed technology, photonics and electronics (IET Digital Library and IEEE Xplore). Abstracts and papers must be submitted via email: irphe2024@gmail.com

Registration Information:

• For each paper independently, at least one co-author is required to register for the conference
• Registration deadline: September 15, 2026
• In-person registration fee - 200 USD
• virtual registration fee - 100 USD
• registration fee for local participants - 10000 AMD

Organized by:

Higher Education and Science Committee

National Academy of Sciences

Yerevan State University

[EDS Webinar] Emerging Technologies at ESREF 2026

Discover Emerging Tech Trends

IEEE EDS Webinar Series Emerging Technologies at ESREF 2026 Sponsored By: The IEEE Electron Devices Society Educational Activities Committee and Device Reliability Physics Committee The EDS Webinar on Emerging Technologies, held within ESREF 2026 at TU Wien in Vienna, will address recent developments and reliability challenges in emerging device technologies. Topics include 2D FETs, advanced MOS gate stacks, emerging and resistive-switching memories, and memristive devices for neuromorphic computing, covering aspects from device-level reliability and defect engineering to CMOS integration and system-level considerations. Date: 21 September 2026  Time: 9:30 AM - 12:20 PM EDT / 3:30 - 6:20 PM CEST (Time Zone Conversion Tool) Presenters: Dr. Erika Covi, Dr. Saptarshi Das, Dr. Jacopo Franco, Dr. Cristian Zambelli, Dr. Lambert Alff More Information Here This message is being sent on behalf of the EDS Vice President of Educational Activities, P Susthitha Menon As part of our commitment to advancing the vision and mission of the Electron Devices Society, we are pleased to invite you to attend our next scheduled webinar. All participants will receive virtual meeting details prior to the event. We sincerely hope that you can join us for this event. Register to Join Virtually