EDKCON 2026 at SMIT on Nov. 12-13

4th IEEE International Conference of Electron Devices Society Kolkata Chapter 

EDKCON 2026

12-13 November, 2026

Sikkim Manipal Institute of Technology (SMIT)

Majitar, 737136 Rangpo, (E) Sikkim, India

https://attend.ieee.org/edkcon-2026

Organized by IEEE EDS Kolkata Chapter, EDKCON series of Conferences is expected to bring together researchers, educators, students from across academia, government, industry, and non-governmental organizations to discuss, share and promote current works and recent accomplishments across all aspects of Electron Devices, circuits, Nanotechnology and VLSI. This conference provides a platform for researchers and practitioners to explore how nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices, optoelectronic devices, low power devices, high-speed devices, process technology, device modeling and simulation, VLSI and embedded system can drive disruptive advancements for the next generation.

EDKCON 2026 topics of interests:

• Emerging Devices and Technology
• Analog/Digital/ Mixed Mode Circuits and Systems
• Memory Devices and Technology
• Device Modeling and Simulations
• Nano-electronic Devices and Technology
• Advance Processing and Characterizations
• Device and System Reliability
• Optoelectronic Devices and Circuits, Displays and Imagers
• Sensor and MEMS
• Intelligent Electronic Device, Circuit, and System
• VLSI System Design and Security
• Computer-Aided Design for VLSI and Verification

Paper submission deadline: 31st July, 2026  15th August, 2026

Date for acceptance: 30th August, 2026

Registration deadline: 15th September, 2026

Camera-ready paper submission: 10th October, 2026

Conference dates: 12-13 November, 2026

EDKCON-2026 Paper Submission Link

EDKCON-2026 Conference Registration Policy

EDKCON-2026 Committee

Chief Patron:

Prof. Dr. K. Ramnarayan, Pro Chancellor, Sikkim Manipal University (SMU)

Dr. Gopalakrishna Prabhu, Vice Chancellor, Sikkim Manipal University (SMU)

Patron:

Prof. Dr. Muralidhar V. Pai, Pro Vice Chancellor, Sikkim Manipal University (SMU)

Prof. Dr. Karma Sonam Sherpa, Registrar, Sikkim Manipal University (SMU)

Prof. Dr. Savitha G. Kini, Director, Sikkim Manipal Institute of Technology (SMIT)

University Advisory Committee: 

Dr. Kalpana Sharma, Director, Directorate of Research, SMU

Dr. Sangeeta Jha, Associate Director (Academics), SMIT

Dr. Chandrashekhar Bhuiyan, Associate Director (Research), SMIT

Dr. Pankaj Chettri, Associate Director (SA), SMIT

General Chairs:

Dr. Bikash Sharma, Head of the Department & Associate Professor,  Dept. of Electronics & Communication Engg., SMIT

Dr. Arpan Deyasi, Associate Professor Department of ECE RCC Institute of Information Technology Kolkata

Dr. Angsuman Sarkar, Professor & Head, ECE Dept., Kalyani Govt. Engg. College, Kalyani, West Bengal

Dr. Manash Chanda, Principal, Meghnad Saha Inst. of Technology, Kolkata

EDKCON-2026 Committee Members  

[mos-ak] [Final Program] 10th China MOS-AK International Conference on Device Modeling

10th China MOS-AK International Conference on Device Modeling

MOS-AK: Enabling Compact Modeling R&D Exchange

August 27-28, 2026 | SEU (Wuxi), Chin

The upcoming MOS-AK event is organized as the 10th China MOS-AK International Conference on Device Modeling and will be held at SEU (Wuxi), China, on August 27-28, 2026. The meeting continues MOS-AK's long-running mission of enabling R&D exchange in advanced electronic and photonic device modeling. The invited participants will cover two groups. The first follows the traditional MOS-AK focus on serving enterprise manufacturers and upstream/downstream model users by discussing practical model-related problems. The second initiative is to train students and professionals in open‑source (FOSS) CAD/EDA tools for integrated circuit (IC) design support.

With aggressive CMOS scaling and diverse emerging device technologies, accurate analytical and compact models have become essential for RF-THz, power, optical, FDSOI/SiGe HBT, 3D heterogeneous integration including OpenPDKs. This workshop offers a focused forum to present and discuss advances in device characterization, compact modeling, simulation, and validation across Si, GaN, IIIV, power, nanoscale, and emerging devices, reinforcing MOS‑AK’s role as a bridge between process technology manufacturing towards advanced circuit and system level designs.

Companies are welcome to showcase their latest tools, equipment, and modeling-related technologies, supporting practical exchange across the compact-modeling industry supply chain.

Important Dates

• Latest Workshop Program Published: August 2026
• China MOS-AK International Conference on Device Modeling: August 27-28, 2026

10th China MOS-AK/Wuxi Program is available online

• https://www.mos-ak.org/wuxi_2026/ or directly
• https://ic.seu.edu.cn/69803/ 

Featured MOS-AK Experts Guests

Wei Hong Southeast University, China

Yue Hao Xidian University, China

Hanming Wu Zhejiang University, China

MOS-AK Sponsors and Supporting Organizations

We gratefully acknowledge the following sponsors and supporting organizations:

Sponsors

Technical Co-Sponsors

Supporting Organization

Workshop Registration

Registration Fees	WeChat Registration Entry
Student RMB 300 Non-IEEE member RMB1,000 IEEE member RMB800 Registration deadline August 12, 2026	Registration QR code: scan with WeChat	Mini Program code: scan with WeChat

MOS-AK/Wuxi Organization Committee

Advisory Committee Fujiang Lin (USTC)	Technical Program Committee Yuehang Xu (UESTC)	General Chairs Weifeng Sun (SEU) Wladek Grabinski (MOS-AK)
International R&D Adviser Min Zhang (XMOD)	Finance Chair Chao Zhu (SEU)	Workshop Secretary Sonny Lou (APSTA)

WG06082026

Fwd: New on chipIgnite: 37 Commercial Analog & Mixed-Signal IP Blocks

Hello ,   Building a custom chip that interacts with the real world requires serious analog design. Historically, that meant you either needed a dedicated team of analog layout experts, or a massive budget to license commercial IP. We’re changing that today. We have officially added 37 commercial-grade analog and mixed-signal IP blocks to the chipIgnite platform for the SkyWater 130nm node. This isn’t just a few basic standard cells. This is a production-proven, industrial-grade portfolio that allows you to drop complex analog capabilities directly into your custom SoC. What can your team build now without being IC layout experts? Precision Industrial Sensors: Capture high-fidelity data using 12-to-20-bit Delta-Sigma ADCs. Smart Actuators & Motor Control: Drive solenoids directly using an integrated boost DC-DC converter. Edge AI Processing: Store active models locally in up to 64KB of fast, single-port SRAM. Autonomous IoT Monitors: Deploy battery-operated devices that sleep for months, relying on the ultra-low-power 32kHz RTC oscillator. These blocks have years of field history in volume commercial products. And because we’ve integrated them into the chipIgnite ecosystem, a full foundational analog subsystem licenses for a fraction of what traditional IP vendors charge (starting at just $14,300). Ready to stop reinventing the wheel and start focusing on your core application? Explore the IP Catalog If you have questions about integrating these blocks into your next tapeout, contact us at info@chipfoundry.io   We’re here to help. Best regards,   The ChipFoundry Team ­ ­ ChipFoundry You've received it because you've subscribed to our newsletter. Unsubscribe

[C4P] EDTM 2027 Fukuoka, Japan

11th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference

Theme: “Empowering the AI Era: 

The Role of Innovation in Semiconductor Devices and Manufacturing”

March 8–11, 2027 Fukuoka, Japan

https://attend.ieee.org/edtm-2027/

---

General Information Important Dates Paper submission deadline: October 15, 2026 Notification of acceptance: Late December 2026 Conference Overview The 11th EDTM conference is a four-day meeting fully sponsored by the IEEE Electron Devices Society (EDS). It serves as a forum for the electron devices community to collaborate on devices, materials, tools, and innovative technologies across the semiconductor ecosystem. Technical Areas Materials Processes, Tools, Yield, and Manufacturing Advanced Logic Devices Memory Technologies Photonics, Imaging and Display Power, RF, and Energy Devices Modeling and Simulation Reliability and Testing Packaging and Heterogeneous Integration Sensors, MEMS, BioElectronics Flexible and Wearable Electronics Nanotechnologies Disruptive Technologies Oral and Poster Sessions EDTM 2027 will feature parallel oral and poster technical sessions. Best Paper, Best Student Paper, and Best Poster Awards will be selected. Publications Accepted and presented papers will be published in the EDTM 2027 Proceedings (IEEE Xplore). Selected high-impact papers may be invited to submit extended versions to J-EDS. Short Courses & Tutorials Held on March 8, 2027. Tutorials cover fundamentals to state of‑the‑art; short courses focus on advanced topics aligned with the conference theme. Exhibition Vendors will showcase new products and technologies, enabling attendees to learn about tools and techniques supporting their work. Secretariat PCO, Inc. <edtm2027@pcojapan.jp>

EDTM 2027 Committees General Chair Masumi Saitoh (Kioxia) TPC Chair Kensuke Ota (Sony Semiconductor Solutions) Steering Committee Shuji Ikeda (Chair, tei Solutions) Masumi Saitoh (Kioxia) Arokia Nathan (Uni. Cambridge) Bin Zhao (Iotelligent) Ravi M. Tody (Synopsys) John Dallesasse (UIUC) Murty Polararapu (Space Electronics Solutions) Meikei Ieong (Simbury Limited) Subramaniam Iyer (UCLA) P. Susthitha Menon (UKM) Chen Yang (Analog Devices) Merlyne de Souza (Univ. of Sheffield) Bernard Lim (Appscard) Yang Chai (Poly Univ.) Yogesh Chauhan (IIT Kanpur) Changrock Song (SK Hynix) Kazunari Ishimaru (Rapidus) Hitoshi Wakabayashi (Science Tokyo) Executive Committee Shuji Ikeda (tei Solutions) Hitoshi Wakabayashi (Science Tokyo) Kazunari Ishimaru (Rapidus) Masumi Saitoh (Kioxia) Chen Jiang (Tsinghua University) Kensuke Ota (Sony Semiconductor Solutions) Yuichiro Ando (Osaka Metropolitan Univ.) Kimihiko Kato (AIST) Kazuaki Iwasawa (TEL) Shoichi Kabuyanagi (Kioxia) Tadashi Yamaguchi (Renesas) Takuya Maeda (Univ. Tokyo) Bich-Yen Nguyen (Soitec) Phuc Le Hoang (VSAP Lab)

[program] ICMC2026

INTERNATIONAL COMPACT MODELING CONFERENCE PROGRAM

2026.si2-icmc.org

The 2026 conference continues under the theme “Enhancing Collaboration in Modeling with the Semiconductor Industry.” This year, ICMC especially encourages contributions in several timely and important areas, including electrostatic discharge (ESD) modeling for protection design, reliability and aging-aware compact models and simulation techniques, and the use of AI or machine learning for model development, parameter extraction, and circuit simulation efficiency. The conference also covers a broad range of topics in compact modeling, including the application of device models, device model development, model enhancements and implementations, and emerging devices.

This year’s technical program includes 3 keynote speakers, 7 invited speakers, 28 technical talks, 12 posters and a panel session. The program reflects both the depth and diversity of current modeling research and practice, ranging from model calibration and validation methodologies to reliability, RF, high-voltage, cryogenic, and emerging device applications.

Program at a Glance

Speaker	Title
	Keynote Presentations
Chenming Hu	BSIM, FinFET, and Open Innovation
Yuan Taur	Physical Insights Beyond the Textbook Modeling of MOSFETs and pn-junctions
Elyse Rosenbaum	Measurement Challenges Impeding the Verification of ESD Compact Model Accuracy and Generalizability
	Invited Presentations
James Victory	Modeling and Simulation Challenges in Modern Power Discrete Semiconductor Technologies
Gilson Wirth	Modeling of Low-Frequency Noise and BTI in Electron Devices
Chien-Ting Tung	Application of AI and ML in the Compact Modeling Domain
Michael Stockinger	On-Chip ESD Protection Design Optimization Using ESD Device Compact Models
Darsen Lu	Ferroelectric Memory Devices Compact Modeling and Applications
Meng-Lin Lu	Applications of Machine Learning Techniques in the Compact Modeling Platform
Lorenzo Peri	Compact Quantum Dot Models for Hybrid Microwave Circuits and Quantum Information Processing

Program Grid – Friday, July 30

Time	Session
8:30 - 8:45	Day 1 Welcome (Queens Salon)
8:45 - 9:25	[Keynote] BSIM, FinFET, and Open Innovation by Prof. Chenming Hu
9:25 - 10:25	Advances in Compact Modeling (Queens Salon)
10:25 - 10:45	Coffee Break (Royal Salon & Kings View Room)
10:45 - 12:10	Ferroelectric and other Nonvolatile Memories (Queens Salon)
12:10 - 13:20	Lunch Served (Royal Salon & Kings View Room)
13:20 - 14:00	[Keynote] Physical Insights Beyond the Textbook Modeling of MOSFETs and p-n Junctions by Prof. Yuan Taur
14:00 - 15:05	Emerging Devices and Technologies (Queens Salon)
15:05 - 15:25	Coffee Break (Royal Salon & Kings View Room)
15:25 - 16:30	Wide Bandgap Material Device Models (Queens Salon)
16:30 - 17:00	Poster Introductions (Queens Salon)
17:00	Poster Session & Reception (Verandah Grill/Deck)

Program Grid – Friday, July 31

Time	Session
8:30 - 8:40	Day 2 Welcome (Queens Salon)
8:40 - 9:20	[Keynote] Measurement Challenges Impeding the Verification of ESD Compact Model Accuracy and Generalizability by Prof. Elyse Rosenbaum
9:20 - 10:05	ESD Protections Modeling (Queens Salon)
10:05 - 10:25	Coffee Break (Royal Salon & Kings View Room)
10:25 - 11:55	Machine Learning and Artificial Intelligence in Compact Modeling (Queens Salon)
11:55 - 12:55	Lunch Served (Royal Salon & Kings View Room)
12:55 - 13:55	Panel Session: Machine Learning for Compact Modeling – Promises, Pitfalls, and Paths to Industry Adoption
13:55 - 14:40	Modeling of Noise and Traps (Queens Salon)
14:40 - 15:00	Coffee Break (Royal Salon & Kings View Room)
15:00 - 16:20	Devices at Cryogenic Temperatures (Queens Salon)
16:20 - 17:00	Closing Ceremony & Awards (Queens Salon)