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Feb 12, 2026
Fwd: Webinar Recording: New CLI, OpenFrame & Production
Feb 11, 2026
[C4P] ESSERC 2026
ESSERC 2026 PAPERS SUBMISSION DEADLINE
APRIL 3, 2026
Papers submitted for ESSERC 2026 review must clearly state:
- The purpose of the work
- How and to what extent it advances the state-of-the art
- Specific results and their impact.
Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference. Measurement results or calibration against measured data is required to support the claims of the submitted paper.
ESSERC 2026 Conference Tracks
- Advanced Technology, Process and Materials
- Analog, Power and RF Devices
- Modelling and Simulation of Electron Devices
- Analog Circuits
- Data Converters
- RF & mm‑Wave Circuits
- Frequency Generation Circuits
- Digital Circuits & Systems
- Power Management
- Wireless Systems
- Wireline and Optical Circuits and Systems
- Emerging Computing Devices and Circuits
- Architectures and Circuits for AI and ML
- Devices & Circuits for Sensors, Imagers and Displays
After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by May 27, 2026.
At the same time, the complete program will be published on the conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication. The submitted final PDF files must be IEEE Xplore compliant.
Best Paper Award: Papers presented at the conference will be considered for the “Best Paper Award” and “Best Young Scientist Paper Award”. The selection will be based on the results of the paper selection process and the judgment of the conference participants. The award delivery will take place during ESSERC 2027.
For each paper independently, at least one (co-)author is required to register for the conference (one registration one paper policy). Registration fees and deadlines will be available on the conference website.
Feb 10, 2026
Open Silicon microelectronic bootcamp
Call for leaders to organize an Open Silicon microelectronic bootcamp
Bring Chip Design to Your Community!
Join the global Open Silicon movement and gain hands-on experience in chip design and fabrication. Our Q1 2026 bootcamps provide access, mentoring, and real silicon opportunities for students, educators, and innovators.
The IEEE is seeking passionate leaders from around the world to organize microelectronics design bootcamps in their local communities, under the IEEE division 1 OPEN SILICON initiative.
If you organize a bootcamp between February and May 2026, IEEE will sponsor the fabrication of three of your designs. You'll receive your fabricated chips (tape-out) mounted on a development board for testing and hands-on exploration.
Selected bootcamp leaders will be invited to an online training session with Matt Venn (Tiny Tapeout) during the last week of February.
To be considered, please provide the following information at REGISTRATION FORM
Key Dates:
- Bootcamp Leader Registration Deadline: Sunday, February 22nd, 2026
- Leader Training Session: Last week of February (TBD)
- Bootcamp Period: March–May 2026
- Tapeout Submission Deadline: March 23rd, 2026 / May 1st, 2026
- Development Board Shipping: September 2026 / November 2026
Feb 9, 2026
ICMC 2026: Paper Deadline Extended!
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Feb 4, 2026
[C4P] MIXDES 2026
CALL FOR PAPERS
33rd International Conference
MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
25 - 27 June 2026, Poznań, Poland
1. Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardwaresoftware codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.2. Thermal Issues in Microelectronics
Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.3. Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.4. Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.5. Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.
6. Power Electronics
Design, manufacturing and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
7. Signal Processing
Digital and analogue filters, telecommunication circuits. Neural networks. Fuzzy logic. Low voltage and low power solutions.
8. Embedded Systems
Design, verification and applications.
9. Medical Applications
Medical and biotechnology applications. Biometrics. Thermography in medicine.10. Artificial Intelligence in Electronic SystemsAI-driven design. AI-driven signal and data processing. Edge AI.
Tutorials and Special Sessions Call for Proposals
Several tutorials/special sessions will be held prior to the conference. Authors willing to propose a tutorial at MIXDES 2026 are invited to send a proposal to the Organizing Committee. The proposal should consist of a three-page summary including tutorial title, name and affiliation of the lecturer(s), tutorial objectives and audience, topical outline and provisional schedule of the tutorial.
Enquiries:
Mariusz Orlikowski (Conference Secretary) e-mail: mixdes2026@dmcs.p.lodz.pl
Lodz University of Technology
Department of Microelectronics and Computer Science (K-22)
ul. Wólczańska 221 (building B18)93-005 Łódź, Poland
tel.: +48 604397239
fax: +48 426360327
fax: +48 426360327
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