The 9th IEEE
Electron Devices Technology and Manufacturing Hong Kong, China, March 9th – 12th, 2025 Theme: Shaping the Future with Innovations in Devices and Manufacturing Call for Papers Three-page camera-ready paper submission starts: August 15, 2024 Paper submission deadline: Notification for Acceptance: December 15, 2024 https://edtm2025.com/ Technical Areas EDTM 2025 solicits papers in all areas of electronic devices, including
materials, processes, modeling, device/circuit/system design,
reliability, packaging, manufacturing, testing, and yield. EDTM 2025
will include parallel technical sessions of oral and poster
presentations.
Publication Opportunities The accepted and presented papers will be published in the EDTM 2025
Proceedings, included in IEEE Xplore. The authors of a selected number
of high-impact papers will be invited to submit extended versions for
publication in the special issue of IEEE Journal of Electron Devices
Society (J-EDS) or IEEE Transactions on Electron Devices, subjected to
J-EDS and TED policy.
Short Courses and Tutorials EDTM 2025 will start with a set of short courses and tutorials on March
9, 2025. Tutorials will cover selected topics from the basics to the
state-of-the-art. The Short Courses will discuss the latest research
and challenges on emerging and advanced topics.
Exhibition EDTM 2025 offers vendors to showcase their newest products and
technologies, allowing attendees to learn about new tools and
techniques. Award Opportunities EDTM 2025 offers one Best Paper Award
in each sub-technical area. |
General Chair: Yang Chai (HK PolyU) General Co-Chair: Tim Cheng (HKUST) TPC Chair: Mansun Chan (HKUST) TPC Co-Chair: Yansong Yang (HKUST) Steering Committee: Shuji Ikeda (TEI Solutions) – Chair Bin Zhao (CTI) Arokia Nathan (Cambridge U.) Ravi Todi (Synopsys) Murty Polavarapu (BAE) Roger Booth (Qualcomm) Samar Saha (Prospicient Devices) Albert Wang (UC Riverside) Kazunari Ishimaru (Rapidus) Yogesh Chauhan (IIT Kanpur) Executive Committee: Yang Chai (HK PolyU) Roger Booth (Qualcomm) Mansun Chan (HKUST) Yansong Yang (HKUST) Ru Huang (Southeast) Qiming Shao (HKUST) Merlyne De Souza (U Sheffield) Pei-Wen Li (NCTU) Can Li (HKU) Masumi Saito (Kioxia) Zhongrui Wang (HKU) Meiki Ieong (Simbury) Carmen Fung (HKSTP) Man Hoi Wong (HKUST) Roger Booth (Qualcomm) Huaqiang Wu (Tsinghua) Rino Choi (Inha U.) Bernard Lim (Appscard) Shinichi Yoshida (SONY) Bill Nehrer (Atomera) Bich-Yen Nguyen (SOITEC) Benjamin Iniguez (URV) Edmundo Gutierrez (INAOE) Ming Yang (HK PolyU) |
Sep 4, 2024
[C4P] EDTM 2025 in Hong Kong, China
Mar 4, 2024
[EDTM] Inauguration Session
The 8th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2024) will be held for the first time in India at Bangalore; the Silicon Valley of India and the hub of semiconductor companies. IEEE EDTM 2024 will be a full four-day conference to be held during March 3-6, 2024. IEEE EDTM 2024 aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training.
Plenary Talk by Prof. Chenming Hu "Semiconductor – the Next 75 Years?"
Oct 17, 2023
[webinar] IEEE SCV-EDS: Investigating quantum speed limits with superconducting qubits
When: Friday, Oct. 20, 2023 – 9am to 10am (PDT)
Where: This is an online event and attendees can participate via Zoom.
Registration or Send an email to hiuyung.wong at ieee.org to get the zoom link indicating if you are IEEE member, IEEE EDS member, IEEE Student member
May 8, 2023
[EDS MQ/DL] The Transistor Turns 75
DATE AND TIME | LOCATION | HOSTS | REGISTRATION |
Date: 02 Jun 2023 Time: 08:30 AM to 05:30 PM All times are (UTC+00:00) Edinburgh |
Moller Institute Cambridge, England UK CB3 ODE Click here for Map |
UK and Ireland
Section Chapter, ED15 Contact Host |
Starts 19 April
2023 06:00 AM Ends 30 May 2023 06:30 PM All times are (UTC+00:00) Edinburgh |
- Benjamin Iniguez: Modeling 2D Semiconductor Devices
- Lluis Marsal: Organic Photovoltaics: Opportunities and Challenges
- Arokia Nathan:
- Fernando Guarin: 75th Anniversary of the Transistor Semiconductor Industry Perspective
- Edmundo A. Gutierrez-D.: DC and RF reliability of advanced bulk and SOI CMOS technologies
- Merlyne De Souza: Challenges to Edge computing: an era beyond silicon CMOS
- Samar Saha:
- MK Radhakrishnan: Birth and Evolution of Transistor and Its Impact on Humanity
- Xiaojun Guo: Transistor Technologies for Hybrid Integration at Micro- and Macro-scales
- Hiroshi Iwai: Present status and future of the nanoelectronics technology
Feb 9, 2023
[Hisayo Momose] My Journey as a Researcher in the Semiconductor Field
Read Hisayo Momose's article from the IEEE EDS January Newsletter, "My Journey as a Researcher in the Semiconductor Field."
Dr. Momose has more than 30 years of experience in research and development at Toshiba Corporation, Japan. She is a recipient of several awards and honors, and has authored or co-authored nearly 200 papers published in technical journals and conference proceedings [read more...]
#IEEE #EDS #ElectronDevices #WiEDS #womeinengineering #semiconductors
Jan 19, 2023
IEEE EDS MQ at NIT Silchar Silchar, Assam (IN)
DATES | LOCATION | HOST | REGISTER |
---|---|---|---|
Date: 29 Jan 2023
Time:10:00AM to 06:00PM (UTC+05:30) Add Event to Calendar iCal Google Calendar | National Institute of Technology Silchar
Dept of ECE, NIT Silchar Silchar, Assam India 788010 Building: ECE/CSE Building | National Inst of Technology - Silchar, ED15 Kolkata Section Chapter NANO42 Co-sponsored by Dr. Trupti R. Lenka | Starts Dec.1, 2022 Ends Jan.28,2023 No Admission Charge Register NOW |
- Anil Kottantharayil (anilkg@ieee.org)
- Gananath Dash (gndash@ieee.org)
- Ajit Kumar Panda (akpanda62@hotmail.com)
- Manoj Saxena (msaxena@ieee.org)
- Brajesh Kumar Kaushik (bkkaushik23@gmail.com)
- Samar Saha (samar@ieee.org)
- Hiroshi Iwai (h.iwai@ieee.org)
- Taiichi Otsuji (taiichi.otsuji.e8@tohoku.ac.jp)
- Pei-Wen Li (pwli@nycu.edu.tw)
- Zhou Xing (EXZHOU@ntu.edu.sg)
- Albert Chin (albert_achin@hotmail.com)
- Mansun Chan (mchan@ust.hk)
- Chao-Sung LAI (cslai@mail.cgu.edu.tw)
- Wladek Grabinski, MOS-AK, EU (wladek@grabinski.ch)
Jun 9, 2022
[Program] MINI-COLLOQUIUM ON CAD/EDA MODELING
Chairperson:
Benjamin Iñiguez, EDS BoG Member and Chair of the ED Spain Chapter
Tuesday, June 28 2022
8:30-9:30 “Characterization and TCAD modeling based design assessment of ultra-high voltage SiC devices,” Muhammad Nawaz (Hitachi Energy, Sweden)
9:30-10:30 “Nanoscale InGaAs FinFETs: Band-to-Band Tunneling and Ballistic Transport,” Jesús del Alamo (MIT, USA)
10:30-11:00 Coffee break
11:00-12:00 “Physics-Based Parameter Extraction for Thin Film Transistors,” Arokia Nathan (Darwin College, University of Cambridge, UK)
12:00-13:00; “Characterization and modeling of organic solar cells,” LluÃs F. Marsal (University Rovira I Virgili, Tarragona, Spain)
13:00-15:00 Lunch
15:00-19:00 Meeting of the EDS SRC Region 8 Executive Committee
Wednesday, June 29 2022
11:00-12:00 “Trends and challenges in Nanoelectronics for the next decade,” Elena Gnani (University of Bologna, Italy)
12:00-13:00,“SPICE and Verilog-A Modelling Using FOSS TCAD/EDA Tools: Technology - Devices – Applications” (virtual), Wladek Grabinski (GMC, Switzerland)
13:00-14:20 Lunch
Joint Session
- MQ on CAD Modeling
- Graduate Student Meeting on Electronic Engineering
14:30-15:30 “Compact modeling of memristive devices for neuromorphic computing,” (virtual) Enrique Miranda (Autonomous University of Barcelona, Spain)
15:30-16:30 Physical Principles to Formulate Thin Film Transistor Models for Circuit Design (virtual), Samar Saha (Prospicient Devices, USA)
16:30-16:35 Closing remarks, B. Iñiguez
Mar 31, 2021
[webinar] "More Moore Roadmap" by IRDS and SINANO
IEEE EDS France, IRDS and the SINANO Institute will organize a Webinar
Other Webinars of the IRDS Chapters will be announced in the EDS Newsletters
Jan 22, 2021
Joint Spring MOS-AK, SB-MOS and IEEE EDS MQ
Dec 15, 2020
[VIRTUAL] EDS MQ on Compact Modeling
December 17, 2020 EDS MQ Program (times in CET) |
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10:20-10:30 Benjamin Iñiguez, IEEE EDS MQ Chair Department of Electronic, Electrical and Automatic Control Engineering, University Rovira I Virgili, Tarragona (Spain) Opening session |
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10:30-11:15 Yogesh. S Chauhan Department of Electrical Engineering, Indian Institute of Technology Kanpur (India) “BSIM-BULK and BSIM-HV: Industry Standard SPICE Models for Analog, RFand High Voltage Applications” |
|
11:15-12:00 Manoj Saxena Department of Electronics, University of Delhi (India) “Modeling and Simulation of Robust Ultrasensitive Tunnel Field Effect Transistor Design for Biosensing Applications” |
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12·00-12:45 Wladek Grabinski GMC, Commugny (Switzerland) “FOSS TCAD/EDA Tools for Semiconductor Device Modeling” |
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12:45-13:30 Arokia Nathan Darwin College, University of Cambridge (UK) “Physics-Based Parameter Extraction for TFTs” |
|
13:30-15:00 Break |
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15:00-15:45 Marcelo Pavanello Department of Electrical Engineering, Centro Universitario FEI, Sao Bernardo do Campo (Brazil) "Quantum Effects on the Mobility of SOI Nanowire MOSFETs Induced by the Active Substrate Bias" |
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15:45-16:30 Michael S. Shur Department of Electrical, Systems and Computer Engineering, Rensselaer Polytechnic Institute, Troy NY (USA) “THz Compact SPICE/ADS model” |
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16:30-17:15 Edmundo Gutiérrez Department of Electronics, INAOE, Puebla (Mexico) "RF MOSFET degradation modeling up to 67 GHz” |
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End of EDS MQ |
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Dec 2, 2020
IEEE EDS Golden List of Reviewers
Stat Data
Country | Reviewers |
USA | 559 |
China | 286 |
India | 159 |
Japan | 151 |
S.Korea | 121 |
Taiwan | 111 |
Italy | 102 |
Germany | 90 |
United Kingdom | 79 |
France | 64 |
Belgium | 63 |
Singapore | 35 |
Switzerland | 29 |
Austria | 28 |
Spain | 27 |
Hong Kong | 25 |
Russia | 22 |
Canada | 22 |
Netherlands | 19 |
Iran | 14 |
Brazil | 14 |
Turkey | 12 |
Australia | 12 |
Sweden | 10 |
Poland | 10 |
Greece | 10 |
Saudi Arabia | 8 |
Mexico | 8 |
Israel | 5 |
Ukraine | 4 |
Slovakia | 3 |
Portugal | 3 |
Malaysia | 3 |
Kazakhstan | 3 |
Egypt | 3 |
Algeria | 2 |
Bulgaria | 2 |
Denmark | 2 |
Finland | 2 |
Latvia | 2 |
Lithuania | 2 |
Qatar | 2 |
Romania | 2 |
Venezuela | 2 |
Bangladesh | 1 |
Belarus | 1 |
Croatia | 1 |
Czechia | 1 |
Ireland | 1 |
Kuwait | 1 |
Lebanon | 1 |
Macedonia | 1 |
Slovenia | 1 |
Tunisia | 1 |
UAE | 1 |
Nov 17, 2020
[paper] Editorial Special Section on ESSDERC
We hope you will enjoy reading these high-quality papers. Stay safe
FRANCOIS ANDRIEU, TPC Chair
CEA-Leti
Université Grenoble Alpes
38054 Grenoble, France
GIOVANNI GHIONE, Editor-in-Chief
Dipartimento di Elettronica e Telecomunicazioni
Politecnico di Torino
10129 Torino, Italy
- Generalized Constant Current Method for Determining MOSFET Threshold Voltage M. Bucher, N. Makris, and L. Chevas pp.4559
- Performance and Low-Frequency Noise of 22-nm FDSOI Down to 4.2 K for Cryogenic Applications (Invited Paper) B. Cardoso Paz, M. Cassé, C. Theodorou, G. Ghibaudo, T. Kammler, L. Pirro, M. Vinet, S. de Franceschi, T. Meunier, and F. Gaillard pp.4563
- A Method for Series-Resistance-Immune Extraction of Low-Frequency Noise Parameters in Nanoscale MOSFETs A. Tataridou, G. Ghibaudo, and C. Theodorou pp.4568
- Analytical Model for Interface Traps-Dependent Back Bias Capability and Variability in Ultrathin Body and Box FDSOI MOSFETs W. Chen, L. Cai, X. Liu, and G. Du pp.4573
- Polarization Independent Band Gaps in CMOS Back-End-of-Line for Monolithic High-Q MEMS Resonator Confinement R. Hudeczek and P. Baumgartner pp.4578
- Out-of-Equilibrium Body Potential Measurement on Silicon-on-Insulator With Deposited Metal Contacts M. Alepidis, A. Bouchard, C. Delacour, M. Bawedin, and I. Ionica pp.4582
- Evaluation of High-Temperature High-Frequency GaN-Based LC-Oscillator Components A. Ottaviani, P. Palacios, T. Zweipfennig, M. Alomari, C. Beckmann, D. Bierbüsse, J. Wieben, J. Ehrler, H. Kalisch, R. Negra, A. Vescan, and J. N. Burghartz pp.4587
- Analysis of Gate-Metal Resistance in CMOS-Compatible RF GaN HEMTs R. Y. ElKashlan, R. Rodriguez, S. Yadav, A. Khaled, U. Peralagu, A. Alian, N. Waldron, M. Zhao, P. Wambacq, B. Parvais, and N. Collaert pp.4592
- Characterization and TCAD Modeling of Mixed-Mode Stress Induced by Impact Ionization in Scaled SiGe HBTs N. Zagni, F. M. Puglisi, G. Verzellesi, and P. Pavan pp.4597
- Hot-Electron Effects in AlGaN/GaN HEMTs Under Semi-ON DC Stress A. Minetto, B. Deutschmann, N. Modolo, A. Nardo, M. Meneghini, E. Zanoni, L. Sayadi, G. Prechtl, S. Sicre, and O. Häberlen pp.4602
- Vertically Replaceable Memory Block Architecture for Stacked DRAM Systems by Wafer-on-Wafer (WOW) Technology S. Sugatani, N. Chujo, K. Sakui, H. Ryoson, T. Nakamura, and T. Ohba pp.4606
- Reliability of Logic-in-Memory Circuits in Resistive Memory Arrays T. Zanotti, C. Zambelli, F. M. Puglisi, V. Milo, E. Pérez, M. K. Mahadevaiah, O. G. Ossorio, C. Wenger, P. Pavan, P. Olivo, and D. Ielmini pp.4611
- IGZO-Based Compute Cell for Analog In-Memory Computing—DTCO Analysis to Enable Ultralow-Power AI at Edge D. Saito, J. Doevenspeck, S. Cosemans, H. Oh, M. Perumkunnil, I. A. Papistas, A. Belmonte, N. Rassoul, R. Delhougne, G. Kar, P. Debacker, A. Mallik, D. Verkest, and M. H. Na pp.4616
- Array-Level Programming of 3-Bit per Cell Resistive Memory and Its Application for Deep Neural Network Inference Y. Luo, X. Han, Z. Ye, H. Barnaby, J.-s. Seo, and S. Yu pp.4621
- Ultrahigh-Density 3-D Vertical RRAM With Stacked Junctionless Nanowires for In-Memory-Computing Applications M. Ezzadeen, D. Bosch, B. Giraud, S. Barraud, J.-P. Noël, D. Lattard, J. Lacord, J. M. Portal, and F. Andrieu pp.4626
- Thermal Stress-Aware CMOS–SRAM Partitioning in Sequential 3-D Technology S. M. Salahuddin, E. Dentoni Litta, A. Gupta, R. Ritzenthaler, M. Schaekers, J.-L. Everaert, H. Yu, A. Vandooren, J. Ryckaert, M.-H. Na, and A. Spessot pp.4631
- Cryogenic Operation of Thin-Film FDSOI nMOS Transistors: The Effect of Back Bias on Drain Current and Transconductance M. Cassé, B. Cardoso Paz, G. Ghibaudo, T. Poiroux, S. Barraud, M. Vinet, S. de Franceschi, T. Meunier, and F. Gaillard pp.4636
- Enhanced Ultraviolet Avalanche Photodiode With 640-nm-Thin Silicon Body Based on SOI Technology I. Sabri Alirezaei, N. Andre, and D. Flandre pp.4641
- TCAD Study of VLD Termination in Large-Area Power Devices Featuring a DLC Passivation L. Balestra, S. Reggiani, A. Gnudi, E. Gnani, J. Dobrzynska, and J. Vobecký pp.4645
- Analysis of MIS-HEMT Device Edge Behavior for GaN Technology Using New Differential Method R. Kom Kammeugne, C. Leroux, J. Cluzel, L. Vauche, C. Le Royer, R. Gwoziecki, J. Biscarrat, F. Gaillard, M. Charles, E. Bano, and G. Ghibaudo pp.4649
- Influence of Substrate Resistivity on Porous Silicon Small-Signal RF Properties G. Godet, E. Augendre, J. Lugo-Alvarez, H. Jacquinot, F. X. Gaillard, T. Lorne, E. Rolland, T. Taris, and F. Servant pp.4654
- Free Carrier Mobility, Series Resistance, and Threshold Voltage Extraction in Junction FETs N. Makris, M. Bucher, L. Chevas, F. Jazaeri, and J.-M. Sallese pp.4658
- Local Variability Evaluation on Effective Channel Length Extracted With Shift-and-Ratio Method J. P. Martinez Brito and S. Bampi pp.4662
- Charge-Based Model for the Drain-Current Variability in Organic Thin-Film Transistors Due to Carrier-Number and Correlated-Mobility Fluctuation A. Nikolaou, G. Darbandy, J. Leise, J. Pruefer, J. W. Borchert, M. Geiger, H. Klauk, B. Iniguez, and A. Kloes pp.4667
- Macromodel for AC and Transient Simulations of Organic Thin-Film Transistor Circuits Including Nonquasistatic Effects J. Leise, J. Pruefer, A. Nikolaou, G. Darbandy, H. Klauk, B. Iniguez, and A. Kloes pp.4672
- Compact Modeling and Behavioral Simulation of an Optomechanical Sensor in Verilog-A H. Elmi Dawale, L. Sibeud, S. Regord, G. Jourdan, S. Hentz, and F. Badets pp.4677
- TCAD Simulation Framework of Gas Desorption in CNT FET NO2 Sensors S. Carapezzi, S. Reggiani, E. Gnani, and A. Gnudi pp.4682
- Conductance in a Nanoribbon of Topologically Insulating MoS2 in the 1T Phase V. Sverdlov, A.-M. B. El-Sayed, H. Kosina, and S. Selberherr pp.4687
- Vt Extraction Methodologies Influence Process Induced Vt Variability: Does This Fact Still Hold for Advanced Technology Nodes? M. S. Bhoir, T. Chiarella, J. Mitard, N. Horiguchi, and N. R. Mohapatra pp.4691
- Multidomain Negative Capacitance Effect in P(VDF-TrFE) Ferroelectric Capacitor and Passive Voltage Amplification K. J. Singh, A. Bulusu, and S. Dasgupta pp.4696
- Monte Carlo Comparison of n-Type and p-Type Nanosheets With FinFETs: Effect of the Number of Sheets F. M. Bufler, D. Jang, G. Hellings, G. Eneman, P. Matagne, A. Spessot, and M. H. Na pp.4701
- Impact of Width Scaling and Parasitic Series Resistance on the Performance of Silicene Nanoribbon MOSFETs M. Poljak pp.4705
Nov 4, 2020
IEEE Germany EDS Chapter Elections
The new ExCom:
- Chair: Mike Schwarz (TH Mittelhessen)
- Vice Chair: Joachim Burghartz (Universität Stuttgart, IMS Chips)
- Treasurer: Manfred Berroth (Universität Stuttgart)
- Secretary: Sevda Abadpour (Karlsruhe Institute of Technology)
Nov 3, 2020
Congratulations to Prof. Robert W. Dutton
The 2020 IEEE EDS Celebrated Member and Esteemed EDS Alumni
Jun 22, 2020
[virtual] IEEE EDS DL Mini-Colloquium at MIXDES Wroclaw
10.00-10.45
|
Arokia
Nathan "Ultralow Power,
High-Resolution Sensor Interfaces"
EDS
Distinguished Lecturer, Cambridge Touch Technologies, UK; E-mail: an299@cam.ac.uk
|
10.45-11.30
|
Mike
Schwarz "Sensor Design –
From Prototype to Series"
Robert
Bosch GmbH, 72703 Reutlingen,Germany; E-mail: Mike.Schwarz@de.bosch.com
|
12.00-12.45
|
Benjamin
IñÃguez "Compact Modeling and
Parameter Extraction for Oxide and Organic Thin Film Transistors (TFTs) from
150K to 350K"
EDS
Distinguished Lecturer, Department of Electrical, Electronics Engineering and
Automatic Control Engineering, Universitat Rovira i Virgili, 43007 Tarragona,
Spain; E-mail: benjamin.iniguez@urv.cat
|
12.45-13.30
|
Teoder
Gotszalk " Microsystem
Electronics and Photonics "
Faculty
of Microsystem Electronics and Photonics, Wroclaw University of Technology,
Poland; E-mail: teodor.gotszalk@pwr.edu.pl
|
13.30-14.15
|
Mina
Rais-Zadeh "Phase change electro-optical devices for space applications" (recorded)
EDS
Distinguished Lecturer, NASA Jet Propulsion Lab., California Institute of
Techn., USA; E-mail: minar@umich.edu
|
Jun 8, 2020
2020 IEEE ED Poland Chapter MQ
- Date
- 2020-06-26
- Location
- Virtual
- Region
- IEEE Region 8 (Europe, Middle East and Africa)
- Contact
- Krzysztof Górecki – k.gorecki@we.am.gdynia.pl
- Description
- Distinguished LecturerArokia Nathan - Oxide Electronics Univ. Cambridge (UK)Mina Rais-Zadeh - MEMS development at JPL (US)Benjamin Iniguez - Universitat Rovira i Virgili, Tarragona (SP)Teodor Gotszalk - TU Wrocław (PL)Mike Schwarz - MEMS Design & Simulation, Bosch (D)
https://eds.ieee.org/education/distinguished-lecturer-mini-colloquia-program/upcoming-dl-and-mq-events?eid=731&m=10e18da593444dc0cb20a2f377717f95
May 6, 2020
IEEE EDS DL Series by the EDS Delhi Chapter
IEEE Electron Device Society (EDS) Delhi Chapter – India
&
Department of Electronic Science
University of Delhi South Campus, New Delhi, India
| ||
Jointly Organizes
|
April 30, 2020 at 10:30 am (past event)
High-k Dielectric and Interface Engineering for High Performance Si/Ge MOS and FinFETs
|
Kuei-Shu Chang-Liao
Department of Engineering and System Science
National Tsing Hua University, Hsinchu, Taiwan
|
May 01, 2020 at 10:30 am (past event)
Two-dimensional Layered Materials for Nanoelectronics
|
Yang Chai
Associate Professor, Department of Applied Physics
The Hong Kong Polytechnic University
|
May 05, 2020 at 01:30 pm (past event)
Introducing two-dimensional layered dielectrics in solid-state micro-electronic devices
|
Mario Lanza
Institute of Functional Nano & Soft Materials, Soochow University, Collaborative Innovation Center of Suzhou Nano Science & Technology, China
|
May 06, 2020 at 06:30 pm (past event)
Field Effect Transistors: From MOSFET to Tunnel-FET
|
Joao Antonio Martino
Professor at University of Sao Paulo, Brazil
|
May 08,2020 at 06:30 pm IST
Junctionless Nanowire Transistors: Electrical Characteristics and Compact Modeling
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Marcelo Antonio Pavanello Centro Universitario FEI, Department of Electrical Engineering Av. Humberto de Alencar Castelo Branco, Sao Bernardo do Campo, Brazil
|
May 11, 2020 at 01:30 pm IST
From CMOS to Neuromorphic Computing - A peek into the future
|
Maria Merlyne De Souza
Department of Electronic and Electrical Engineering
The University of Sheffield, United Kingdom
|
May 12, 2020 at 10:30 am IST
Phase change electro-optical devices for space applications
|
Mina Rais-Zadeh
Group Supervisor, Advanced Optical and Electromechanical Microsystems Group, Micro Device Laboratory, NASA JPL, Pasadena, CA
|
May 15, 2020 at 08:30 pm IST
State-of-the-Art Silicon Very Large Scale Integrated Circuits: Industrial Face of Nanotechnology
|
Michael S. Shur
Electrical, Computer and Systems Engineering and Physics, Applied Physics, and Astronomy
Rensselaer Polytechnic Institute
|
May 16, 2020 at 02:00 pm IST
Transparent and Flexible Large Area Electronics
|
Arokia Nathan
Cambridge Touch Technologies,
University of Cambridge, United Kingdom (UK)
|
May 20, 2020 at 02:30 pm IST
Trends and challenges in Nanoelectronics for the next decade
|
Elena Gnani
Department of Electrical, Electronic and Information Engineering, University of Bologna, Italy
|
May 22, 2020 at 07:30 pm IST
Accelerating commercialization of SiC power electronics
|
Victor Veliadis
Executive Director and CTO, Power America
Professor of Electrical and Computer Engineering,
North Carolina State University
|
May 27, 2020 at 07:30 pm IST
Advanced III-N Devices for 5G and Beyond
|
Patrick Fay
Department of Electrical Engineering,
University of Notre Dame
|
Dr. Manoj Saxena, SMIEEE, FIETE, MNASc (India)
EDS BoG Member (2018-2020) & EDS DL
Regional Editor for South Asia, IEEE EDS Newsletter
Associate Professor, Department of Electronics
Deen Dayal Upadhyaya College, University of Delhi
Dwarka Sector-3, New Delhi, India; Email: msaxena@ieee.org |
Professor Mridula Gupta, SMIEEE, FIETE
Chairperson-IEEE EDS Delhi Chapter
Head, Department of Electronic Science
University of Delhi South Campus
New Delhi 110021, India
|