Showing posts with label MIXDES. Show all posts
Showing posts with label MIXDES. Show all posts

Jan 15, 2024

[C4P] MIXDES 2024

The MIXDES conference series started in Dębe near Warsaw in 1994 and has been organized yearly in the most interesting Polish cities. In 2024 we would like to continue the tradition of inviting you to the most attractive places in Poland and the conference will take place in Gdańsk between June 27-29, 2024
In short period of time the conference has become an important event in the Central Europe allowing to discuss the recent research progress in the field of design, modelling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices as well as their interdisciplinary applications.

The topics of the MIXDES 2024 Conference include:
  • Design of Integrated Circuits and Microsystems
    Design methodologies. Digital and analog synthesis. Hardware-software co-design. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
  • Thermal Issues in Microelectronics
    Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits. 
  • Analysis and Modelling of ICs and Microsystems
    Simulation methods and algorithms. Behavioral modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
  • Microelectronics Technology and Packaging
    New microelectronic technologies. Packaging. Sensors and actuators.
  • Testing and Reliability
    Design for testability and manufacturability. Measurement instruments and techniques. 
  • Power Electronics
    Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
  • Signal Processing
    Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
  • Embedded Systems
    Design, verification and applications.
  • Medical Applications
    Medical and biotechnology applications. Biometrics. Thermography in medicine
Call for Papers and Contributions
A call is made for papers, contributions and other conference activities on the topics mentioned above. Full papers should be submitted till March 1, 2024 - only in electronic form (MS Word, RTF, Open Office Writer, LaTeX, together with a generated PDF file).

The paper submission form and required format is available on our Web page. Authors are asked to indicate the topic into which their papers fall. The papers will be reviewed by at least two referees from the International Programme Committee. The papers will be published in the proceedings from the author's electronic submission.

Tutorials and Special Sessions - Call for Proposals
Several tutorials/special sessions will be held prior to the conference. Authors willing to propose a tutorial at MIXDES 2024 are invited to send a proposal to the Organizing Committee. The proposal should consist of a three-page summary including tutorial title, name and affiliation of the lecturer(s), tutorial objectives and audience, topical outline and provisional schedule of the tutorial.

Feb 8, 2021

[C4P] MIXDES 2021 Paper Submission Deadline: 15 March 2021


MIXDES 2021 regular paper submission deadline is upcoming . As current COVID pandemic situation is still uncertain, the conference will be organized in hybrid mode or fully online. To help you with preparation of excellent papers, we have decided to move the submission deadline to 15 March 2021. As in previous year we are going to give you an opportunity to publish extended versions of your conference papers in Energies Journal. The information about the postMIXDES publication will be provided soon at the conference site (www.mixdes.org).

Important dates:
Conference days: 24-26 June 2021
Paper submission deadline: 15 March 2021
Notification of acceptance: 26 April 2021
Final paper versions: 17 May 2021

Mariusz Orlikowski - MIXDES 2021 Conference Secretary








Jun 22, 2020

[virtual] IEEE EDS DL Mini-Colloquium at MIXDES Wroclaw


EDS Distinguished Lecturer Mini-Colloquium 
"Semiconductor-based sensors - technology, modeling, applications" 
(virtual at MIXDES), June 27, 2020
Chairs: Wladek Grabinski, Daniel Tomaszewski

10.00-10.45
Arokia Nathan "Ultralow Power, High-Resolution Sensor Interfaces"
EDS Distinguished Lecturer, Cambridge Touch Technologies, UK; E-mail: an299@cam.ac.uk
10.45-11.30
Mike Schwarz "Sensor Design – From Prototype to Series"
Robert Bosch GmbH, 72703 Reutlingen,Germany; E-mail: Mike.Schwarz@de.bosch.com
12.00-12.45
Benjamin Iñíguez "Compact Modeling and Parameter Extraction for Oxide and Organic Thin Film Transistors (TFTs) from 150K to 350K"
EDS Distinguished Lecturer, Department of Electrical, Electronics Engineering and Automatic Control Engineering, Universitat Rovira i Virgili, 43007 Tarragona, Spain; E-mail: benjamin.iniguez@urv.cat
12.45-13.30
Teoder Gotszalk " Microsystem Electronics and Photonics "
Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Poland; E-mail: teodor.gotszalk@pwr.edu.pl
13.30-14.15
Mina Rais-Zadeh "Phase change electro-optical devices for space applications" (recorded)
EDS Distinguished Lecturer, NASA Jet Propulsion Lab., California Institute of Techn., USA; E-mail: minar@umich.edu

Jun 8, 2020

2020 IEEE ED Poland Chapter MQ

Date
2020-06-26
Location
Virtual
Region
IEEE Region 8 (Europe, Middle East and Africa)
Contact
Krzysztof Górecki – k.gorecki@we.am.gdynia.pl
Description
Distinguished Lecturer
Arokia Nathan - Oxide Electronics Univ. Cambridge (UK)
Mina Rais-Zadeh - MEMS development at JPL (US)
Benjamin Iniguez - Universitat Rovira i Virgili, Tarragona (SP)
Teodor Gotszalk - TU Wrocław (PL)
Mike Schwarz - MEMS Design & Simulation, Bosch (D)

REGISTER at the MQ site
https://eds.ieee.org/education/distinguished-lecturer-mini-colloquia-program/upcoming-dl-and-mq-events?eid=731&m=10e18da593444dc0cb20a2f377717f95

Oct 3, 2019

[IEEE EDS Update] MIXDES 2019, Rzeszów (PL)

26th International Conference “Mixed Design of Integrated Circuits and Systems"'
MIXDES 2019 
By Marcin Janicki

On June 27–29, 2019, Rzeszów, Poland, the International Conference MIXDES 2019 took place. The event was organized by the Lodz University of Technology together with the Warsaw University of Technology. The conference was co-sponsored by Poland Section IEEE ED & CAS Societies, Polish Academy of Sciences (Section of Microelectronics and Electron Technology), and Commission of Electronics and Photonics of Polish National Committee of International Union of Radio Science—URSI. The 3-day conference program included 97 presentations from 28 countries. The following six general invited talks were presented during the conference plenary sessions:
  • Advanced MOS Device Technology for Low Power Logic LSI Shinichi Takagi (The University of Tokyo, Japan)
  • Quantum Bits and Quantum Computing Architecture Farzan Jazaeri (EPFL, Switzerland)
  • Towards Energy-Autonomous Integrated Systems Through Ultra-low Voltage Analog IC Design Viera Stopjaková (Slovak University of Technology in Bratislava, Slovakia)
  • THz Technologies and Applications Thomas Skotnicki (Institute of High Pressure Physics PAS, Poland)
  • What is Killing Moore’s Law? Challenges in Advanced FinFET Technology Integration Arkadiusz Malinowski (GLOBALFOUNDRIES, USA)
  • Yield and Reliability Challenges at 7nm and Below Andrzej Strojwąs (Carnegie Mellon University, USA)
The sessions also included presentations in the frame of four special sessions:
  • Compact Modeling for Nanoelectronics organized by D. Tomaszewski (Institute of Electron Technology, Poland) and W. Grabiński (GMC, Switzerland)
  • Intelligent Distributed Systems organized by M. Drozd (LTC Sp. z o.o., Poland), R. Sztoch, P. Sztoch (FINN Sp. z o.o., Poland), B. Sakowicz and D. Makowski (Lodz University of Technology, Poland)
  • Large Scale Research Facilities organized by A. Napieralski, W. Cichalewski (Lodz University of Technology, Poland)
  • Thermonuclear Fusion Projects organized by S. Simrock (ITER, France), D. Makowski (Lodz University of Technology, Poland), D. Bocian and M. Scholz (Institute of Nuclear Physics, Poland
The next MIXDES 2020 Conference will take place in Wrocław, Poland. The Preliminary Call for Papers is available at http://www.mixdes.org/downloads/call2020.pdf. More information about the past and next MIXDES Conferences can be found at http://www.mixdes.org.
Edited by Mariusz Orlikowski
MIXDES 2019 Conference Secretary

Feb 9, 2016

MIXDES 2016 Paper Submission Deadline

MIXDES Paper Submission Deadline
(March 1st, 2016)

---------- Forwarded message ----------
From: MIXDES 2016 Organizing Committee

Dear Colleagues,

I would like to kindly remind you that paper submission for MIXDES 2016 Conference has been already opened. The deadline for regular paper submission is March 1st, 2016, so I encourage you to register your papers. The instruction for paper preparation is available online. Please note that the paper format and content may be still updated up to Final Paper Version deadline (May 31st, 2016).

This year the MIXDES 2016 Conference will take place in Lodz, Poland, June 23-25, 2016. For more information regarding the conference please visit the MIXDES 2016 Conference web site at
www.mixdes.org.

If you have any questions please do not hesitate to contact me.

Hoping to see you in Lodz,

Mariusz Orlikowski
Secretary of the 23rd International Conference
"Mixed Design of Integrated Circuits and Systems"
MIXDES 2016
http://www.mixdes.org

Jun 17, 2015

3rd Training Course on Compact Modeling

 3rd TCCM, 
 organized as IEEE EDS Mini-Colloquium 
 (http://eds.ieee.org/lectures.html?eid=136)

Co-organizer: Institute of Electron Technology, Warsaw, Poland
Technical Program Promoter: DMCS, Lodz University of Technology, Łódź, Poland

Date: June 24, 2015.
Place: Hotel Bulwar (Lejda room) ul. Bulwar Filadelfijski 18, 87-100 Toruń, Poland
www: http://www.hotelbulwar.pl

Final schedule of TCCM:
9:00 Wladek Grabinski, Opening
9:10 Henryk Przewłocki, "Weaknesses and corrections of the classical theory of photoelectric phenomena in the MOS system"
10:00 Juin J.Liou, "Compact Modeling of Junction Failure in Semiconductor Devices Subject to Electrostatic Discharge Stresses"
10:50 Coffee break
11:10 Jean-Michel Sallese, "Modeling Junctionless Field Effect Transistors"
12:00 Mike Brinson, "A unified approach to compact device modelling with the open source packages Qucs/ADMS and MAPP/Octave"
13:00 Lunch
14:30 Benjamin Iniguez, "Physically-Based Compact Modeling of GaN HEMT"
15:20 Wladek Grabinski, "Verilog-A Compact Model Standardization"
16:10 Daniel Tomaszewski, "Compact modeling and statistical modeling for parametric yield improvement"
17:00 Wladek Grabinski, Closing

Feb 17, 2015

MIXDES 2015, June 25-27, 2015; Torun, Poland

 22nd International Conference "Mixed Design of Integrated Circuits and Systems"
 MIXDES 2015, June 25-27, 2015; Torun, Poland

The deadline for regular paper submission is approaching (March 2nd, 2015). If you are going to contribute, I encourage you to register your papers as soon as possible. You will be able to update the paper details and the document file at any time till the final paper version deadline (May 15th, 2015). The early submission will allow us to take care of your paper just now, especially start the reviewer assignments and begin the formatting verification process.

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