Showing posts with label FeFET. Show all posts
Showing posts with label FeFET. Show all posts

Mar 18, 2024

[paper] in-memory computing using FeFET

Taha Soliman, Swetaki Chatterjee, Nellie Laleni, Franz Müller, Tobias Kirchner, Norbert Wehn, Thomas Kämpfe, Yogesh Singh Chauhan and Hussam Amrouch
First demonstration of in-memory computing crossbar using multi-level Cell FeFET
Nat Commun 14, 6348 (2023)
DOI: 10.1038/s41467-023-42110-y

1 Robert Bosch GmbH, Renningen, Germany
2 Semiconducture Test and Reliability, University of Stuttgart, Stuttgart, Germany
3 Department of Electrical Engineering, IIK, Kanpur, India
4 Fraunhofer IPMS, Dresden, Germany
5 RPTU Kaiserslautern-Landau, Kaiserslautern, Germany
6 MIRMI; Technical University of Munich, Germany

Abstract: Advancements in AI led to the emergence of in-memory-computing architectures as a promising solution for the associated computing and memory challenges. This study introduces a novel in-memory-computing (IMC) crossbar macro utilizing a multi-level ferroelectric field-effect transistor (FeFET) cell for multi-bit multiply and accumulate (MAC) operations. The proposed 1FeFET-1R cell design stores multi-bit information while minimizing device variability effects on accuracy. Experimental validation was performed using 28 nm HKMG technology-based FeFET devices. Unlike traditional resistive memory-based analog computing, our approach leverages the electrical characteristics of stored data within the memory cell to derive MAC operation results encoded in activation time and accumulated current. Remarkably, our design achieves 96.6% accuracy for handwriting recognition and 91.5% accuracy for image classification without extra training. Furthermore, it demonstrates exceptional performance, achieving 885.4 TOPS/W–nearly double that of existing designs. This study represents the first successful implementation of an in-memory macro using a multi-state FeFET cell for complete MAC operations, preserving crossbar density without additional structural overhead.

FIG: a.) The material stack of FeFETs. 
b.) The multi-bit FeFET can be programmed to different states
to store the weight of the synapse

Acknowledgements: This work has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826655 and No 876925. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, France, Germany, Portugal, Spain, The Netherlands, Switzerland. Open Access funding enabled and organized by Projekt DEAL.


Jul 1, 2021

[papers] Compact/SPICE Modeling

[1] M. S. Tarkov; Two-Gate FeFET SPICE Model and Its Application to Construction of Adaptive Adder; 2021 Ural Symposium on Biomedical Engineering, Radioelectronics and Information Technology (USBEREIT), 2021, pp. 0206-0209,
DOI: 10.1109/USBEREIT51232.2021.9455091.

[2] L. Liu, Y. Tian and W. Huang, "A Bio-IA with Fast Recovery and Constant Bandwidth for Wearable Bio-Sensors," in IEEE Sensors Journal,
DOI: 10.1109/JSEN.2021.3092001.

[3] C. -T. Tung, H. -Y. Lin, S. -W. Chang and C. -H. Wu, "Analytical modeling of tunnel-junction transistor lasers," in IEEE Journal of Selected Topics in Quantum Electronics,
DOI: 10.1109/JSTQE.2021.3090527.

[4] Subir Kumar Maity, Soumya Pandit; A SPICE compatible physics-based intrinsic charge and capacitance model of InAs-OI-Si MOS transistor, Superlattices and Microstructures, Volume 156, 2021, 106975, ISSN 0749-6036,
DOI: 10.1016/j.spmi.2021.106975

Fig:  Strucutre of InAs-OI-Si MOS transistor






Mar 31, 2021

[webinar] "More Moore Roadmap" by IRDS and SINANO


IEEE EDS France, IRDS and the SINANO Institute will organize a Webinar 

"More Moore Roadmap"
by Mustafa Badaroglu 
IRDS-IFT More Moore Leader

The webinar will be held on 8th April 2021 at 16:00 Paris time. Interest participants please register via IEEE vTools by the following link: https://events.vtools.ieee.org/event/register/267103

Other Webinars of the IRDS Chapters will be announced in the EDS Newsletters