The 9th IEEE
Electron Devices Technology and Manufacturing Hong Kong, China, March 9th – 12th, 2025 Theme: Shaping the Future with Innovations in Devices and Manufacturing Call for Papers Three-page camera-ready paper submission starts: August 15, 2024 Paper submission deadline: Notification for Acceptance: December 15, 2024 https://edtm2025.com/ Technical Areas EDTM 2025 solicits papers in all areas of electronic devices, including
materials, processes, modeling, device/circuit/system design,
reliability, packaging, manufacturing, testing, and yield. EDTM 2025
will include parallel technical sessions of oral and poster
presentations.
Publication Opportunities The accepted and presented papers will be published in the EDTM 2025
Proceedings, included in IEEE Xplore. The authors of a selected number
of high-impact papers will be invited to submit extended versions for
publication in the special issue of IEEE Journal of Electron Devices
Society (J-EDS) or IEEE Transactions on Electron Devices, subjected to
J-EDS and TED policy.
Short Courses and Tutorials EDTM 2025 will start with a set of short courses and tutorials on March
9, 2025. Tutorials will cover selected topics from the basics to the
state-of-the-art. The Short Courses will discuss the latest research
and challenges on emerging and advanced topics.
Exhibition EDTM 2025 offers vendors to showcase their newest products and
technologies, allowing attendees to learn about new tools and
techniques. Award Opportunities EDTM 2025 offers one Best Paper Award
in each sub-technical area. |
General Chair: Yang Chai (HK PolyU) General Co-Chair: Tim Cheng (HKUST) TPC Chair: Mansun Chan (HKUST) TPC Co-Chair: Yansong Yang (HKUST) Steering Committee: Shuji Ikeda (TEI Solutions) – Chair Bin Zhao (CTI) Arokia Nathan (Cambridge U.) Ravi Todi (Synopsys) Murty Polavarapu (BAE) Roger Booth (Qualcomm) Samar Saha (Prospicient Devices) Albert Wang (UC Riverside) Kazunari Ishimaru (Rapidus) Yogesh Chauhan (IIT Kanpur) Executive Committee: Yang Chai (HK PolyU) Roger Booth (Qualcomm) Mansun Chan (HKUST) Yansong Yang (HKUST) Ru Huang (Southeast) Qiming Shao (HKUST) Merlyne De Souza (U Sheffield) Pei-Wen Li (NCTU) Can Li (HKU) Masumi Saito (Kioxia) Zhongrui Wang (HKU) Meiki Ieong (Simbury) Carmen Fung (HKSTP) Man Hoi Wong (HKUST) Roger Booth (Qualcomm) Huaqiang Wu (Tsinghua) Rino Choi (Inha U.) Bernard Lim (Appscard) Shinichi Yoshida (SONY) Bill Nehrer (Atomera) Bich-Yen Nguyen (SOITEC) Benjamin Iniguez (URV) Edmundo Gutierrez (INAOE) Ming Yang (HK PolyU) |
Sep 4, 2024
[C4P] EDTM 2025 in Hong Kong, China
Apr 18, 2024
[IEEE SSCS] “PICO” Open-Source Chipathon
The IEEE Solid-State Circuits Society is pleased to announce its fourth open-source integrated circuit (IC) design contest under the umbrella of its PICO Program (Platform for IC Design Outreach). While this contest is open to anyone (no restrictions), we encourage the participation of pre-college students, undergraduates, and geographical regions that are underrepresented within the IC design community.
The goal of this year’s event is to advance the automatic generation and open sharing of analog circuit layout cells to increase our community’s design productivity and to catch up with other fields where sharing and automation is a key enabler of progress (e.g., in machine learning).
Die photo in background courtesy of IBM
Contest Outline
- Interested individuals sign up using this form by May 10, 2024.
- Phase 1 (~June): Through a series of weekly meet-ups and training sessions, the participants learn to create basic one- or two-transistor layout generators using Python and open-source CMOS PDKs. Using Jupyter Notebooks hosted on Google Colab allows anyone with an internet connection to participate - no downloads or installations required! Relevant circuit examples can be found in [1], [2]. We will leverage code modules available with the OpenFASoC [3] environment.
- Phase 2 (~July): Interested participants define larger layout building blocks that they wish to automate (examples: comparator, bandgap, phase interpolator, OTA). Teaming among participants is encouraged to maximize collaboration and learning).
- Phase 3 (~August-September): Participants implement their generators and submit sample layouts and test structures for potential tape-out to an open-source MPW (tentatively SKY130).
- Phase 4 (~October-November): A jury evaluates the created generators/layouts and selects the test structures that will be taped out. The teams work together to assemble a shared database with all the designs and to complete the tapeout. Ideally, this phase will involve automated verification through CACE [4] or a similar tool.
- Phase 5 (TBD): The designs will be tested using lab measurements by a subset of participants and SSCS volunteers with access to lab facilities. Some of the test setups may be available for remote characterization. The obtained measurement data will be added to the repositories containing the layout generators.
References
[1] H. Pretl, “Fifty Nifty Variations of Two-Transistor Circuits,” MOS-AK Workshop Spring 2022, URL: https://www.mos-ak.org/spring_2022/presentations/Pretl_Spring_MOS-AK_2022.pdf.[2] H. Pretl and M. Eberlein, "Fifty Nifty Variations of Two-Transistor Circuits: A tribute to the versatility of MOSFETs," in IEEE Solid-State Circuits Magazine, vol. 13, no. 3, pp. 38-46, Summer 2021, URL: https://ieeexplore.ieee.org/document/9523464.
[3] OpenFASoC: Fully Open-Source Autonomous SoC Synthesis using Customizable Cell-Based Synthesizable Analog Circuits, https://github.com/idea-fasoc/OpenFASOC/.
[4] Circuit Automatic Characterization Engine, URL: https://github.com/efabless/cace.
Apr 14, 2024
GDR SOC2 IEEE CASS
Re-Energizing Analog Design using the Open-Source Ecosystem.
The French platform supporting open hardware
IHP Open Source PDK - sharing experience after one year of development.
Why joining IEEE CAS Society?
Coriolis, The European Open Hardware Project
The first 60 GHz circuit designed with open hardware platform
ACM, a design-oriented model for open tools
Inscription Gratuite: à laurence.ben-tito@univ-grenoble-alpes.fr
Mar 19, 2024
IEEE 5NANO2024 Conference 25-26th April, 2024
Nanomaterials, Nanobioscience & Nanotechnology
VISAT Engineering College,
Elanji, Ernakulam, Kerala, India - 686 665
Tel: +91 9447691397, +91 9486881397.
E-mail: deanresearch@visat.ac.in, tdsubash2007@gmail.com, 5nano2k24@gmail.com
Website: https://www.5nano2024.com
Mar 5, 2024
[Open PDK] IEEE EDS DL at IISc Banglare
DATE AND TIME | LOCATION | HOSTS |
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Date: 07 Mar 2024
Time: 04:00 PM to 05:00 PM All times are (UTC+05:30) Chennai Add Event to Calendar iCal Google Calendar |
Auditorium, Dept. of ESE,
IISc Bangalore Karnataka India 560012 |
Bangalore Section
Jt. Chapter ED15/SSC37 |
Mar 4, 2024
[EDTM] Inauguration Session
The 8th Electron Devices Technology and Manufacturing Conference (IEEE EDTM 2024) will be held for the first time in India at Bangalore; the Silicon Valley of India and the hub of semiconductor companies. IEEE EDTM 2024 will be a full four-day conference to be held during March 3-6, 2024. IEEE EDTM 2024 aims to be a premier global forum for researchers and engineers from around the world coming to share new discoveries and discuss any device/manufacturing-related topics, including but not limited to, materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies, as well as workforce training.
Plenary Talk by Prof. Chenming Hu "Semiconductor – the Next 75 Years?"
Oct 17, 2023
[webinar] IEEE SCV-EDS: Investigating quantum speed limits with superconducting qubits
When: Friday, Oct. 20, 2023 – 9am to 10am (PDT)
Where: This is an online event and attendees can participate via Zoom.
Registration or Send an email to hiuyung.wong at ieee.org to get the zoom link indicating if you are IEEE member, IEEE EDS member, IEEE Student member
Oct 2, 2023
[C4P] LASCAS 2024
● Analog and Digital Signal Processing● Biomedical Circuits and Systems● Intelligent Sensor Systems and Internet of Things● Artificial Intelligence and Smart Systems● Nanoelectronics and Gigascale Systems● Electronic Design Automation● Circuits and Systems for Communications● RF Circuits and Systems● Smart Systems and Smart Manufacturing● Power Systems and Power Electronic Circuits● Multimedia Systems and Applications● Life Science Systems and Applications● Electronic Testing● Fault Tolerant Circuits● Nonlinear Circuits and Systems● Cognitive Computing and Deep Learning● Computing and Big Data Applications
Dr. Matías Miguez – UCU, Uruguay.Dr. Pablo Pérez-Nicoli – Udelar, Uruguay.
Dr. Maysam Ghovanloo –Silicon Creations, USADr. José Lipovetzky – IB-CNA, Argentina
Sep 5, 2023
[C4P] EDTM Conference 2024, Bangalore
Advances in modeling/simulation of devices, packages and processes; Technology CAD and benchmarking; Atomistic process and device simulation; Compact models for DTCO and STCO; AI/ML-augmented modelling; Material and interconnect modeling; Models for photonic devices.
- Three-page camera-ready paper submission starts: August 1,2023
- Paper submission deadline:
October 15, 2023October 30, 2023 - Notification for Acceptance: December 15, 2023
Accepted IEEE EDTM 2024 papers will be considered for competition for the Best Paper Award, Best Student Paper Awards and Best Poster Awards.
More details on paper submission can be found at the Paper Submission webpage.
May 8, 2023
[EDS MQ/DL] The Transistor Turns 75
DATE AND TIME | LOCATION | HOSTS | REGISTRATION |
Date: 02 Jun 2023 Time: 08:30 AM to 05:30 PM All times are (UTC+00:00) Edinburgh |
Moller Institute Cambridge, England UK CB3 ODE Click here for Map |
UK and Ireland
Section Chapter, ED15 Contact Host |
Starts 19 April
2023 06:00 AM Ends 30 May 2023 06:30 PM All times are (UTC+00:00) Edinburgh |
- Benjamin Iniguez: Modeling 2D Semiconductor Devices
- Lluis Marsal: Organic Photovoltaics: Opportunities and Challenges
- Arokia Nathan:
- Fernando Guarin: 75th Anniversary of the Transistor Semiconductor Industry Perspective
- Edmundo A. Gutierrez-D.: DC and RF reliability of advanced bulk and SOI CMOS technologies
- Merlyne De Souza: Challenges to Edge computing: an era beyond silicon CMOS
- Samar Saha:
- MK Radhakrishnan: Birth and Evolution of Transistor and Its Impact on Humanity
- Xiaojun Guo: Transistor Technologies for Hybrid Integration at Micro- and Macro-scales
- Hiroshi Iwai: Present status and future of the nanoelectronics technology
Mar 21, 2023
Commemorative and Networking Event: 75th anniversary of the transistor
Three IEEE Distinguished Lecturers will talk about the transistor history and its properties. It will be followed by short presentations about semiconductor industry activities in Switzerland, with the following networking apéro.
Attendance is free and open to all: mention it and forward to your friends and colleagues.
Please register for logistics reasons.
Date and Time |
Location |
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Agenda
13:00 – 13:30 Welcome Coffee
13:30 – 14:15 Tom Lee: From Rocks to Chips: Stories of the Transistor
14:15 – 15:15 Chris Mangelsdorf: Don't try this with CMOS
15:15 – 15:45 Coffee break
15:45 – 16:30 Christian Enz: The Design of Low-power Analog CMOS Circuits Using the Inversion Coefficient
16:30 – 17:30 Semiconductor industry in Switzerland, sharing experiences
(W.Grabinski, Panel Moderator):
- Bipolar transistor manufacturing in Switzerland – Hugo Wyss
- Integrated Circuits – Eric Vittoz
- Semiconductor design in the 21st century – Alain-Serge Poret
- Micro-electronics for Swiss made products – Evert Dijkstra
- Semiconductor manufacturing equipment – André Gerde
17:30 – 19:00 Apéro riche
Hosts
Switzerland Section Chapter, SSC37 : https://sscs.ieee.chSwitzerland Section : https://ieee.ch/
Feb 9, 2023
[Hisayo Momose] My Journey as a Researcher in the Semiconductor Field
Read Hisayo Momose's article from the IEEE EDS January Newsletter, "My Journey as a Researcher in the Semiconductor Field."
Dr. Momose has more than 30 years of experience in research and development at Toshiba Corporation, Japan. She is a recipient of several awards and honors, and has authored or co-authored nearly 200 papers published in technical journals and conference proceedings [read more...]
#IEEE #EDS #ElectronDevices #WiEDS #womeinengineering #semiconductors
Feb 8, 2023
[C4P] IEEE LAEDC 2023
On behalf of the Organizing Committee of IEEE 2023 Latin American Electron Devices Conference (LAEDC) we want to invite you to the next edition of our conference. It will take place in Puebla, Mexico from July 3-5, 2023.
The conference is growing rapidly with worldwide participation and will cover key topics in the field of electronic devices. The main objective of LAEDC is to bring together specialists from all fields related to electronic devices, it will also be aimed at students and young researchers. This event is financially sponsored by IEEE Electron Devices Society (EDS). We are sure that thanks to your significant achievements and contributions, your attendance will significantly increase the value of our conference and motivate research groups and young generations in the field of electronic devices. Please note that discounted registration will be available until June 17, 2023.
Please consider submitting a full paper to our conference proceedings no later than March 31th and engage with our audience and participants while visiting one of the most lively and historic cities in Mexico. For more information, please visit our web site and do not hesitate to contact us
Sincerely
Jan 19, 2023
IEEE EDS MQ at NIT Silchar Silchar, Assam (IN)
DATES | LOCATION | HOST | REGISTER |
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Date: 29 Jan 2023
Time:10:00AM to 06:00PM (UTC+05:30) Add Event to Calendar iCal Google Calendar | National Institute of Technology Silchar
Dept of ECE, NIT Silchar Silchar, Assam India 788010 Building: ECE/CSE Building | National Inst of Technology - Silchar, ED15 Kolkata Section Chapter NANO42 Co-sponsored by Dr. Trupti R. Lenka | Starts Dec.1, 2022 Ends Jan.28,2023 No Admission Charge Register NOW |
- Anil Kottantharayil (anilkg@ieee.org)
- Gananath Dash (gndash@ieee.org)
- Ajit Kumar Panda (akpanda62@hotmail.com)
- Manoj Saxena (msaxena@ieee.org)
- Brajesh Kumar Kaushik (bkkaushik23@gmail.com)
- Samar Saha (samar@ieee.org)
- Hiroshi Iwai (h.iwai@ieee.org)
- Taiichi Otsuji (taiichi.otsuji.e8@tohoku.ac.jp)
- Pei-Wen Li (pwli@nycu.edu.tw)
- Zhou Xing (EXZHOU@ntu.edu.sg)
- Albert Chin (albert_achin@hotmail.com)
- Mansun Chan (mchan@ust.hk)
- Chao-Sung LAI (cslai@mail.cgu.edu.tw)
- Wladek Grabinski, MOS-AK, EU (wladek@grabinski.ch)
Jun 9, 2022
[Program] MINI-COLLOQUIUM ON CAD/EDA MODELING
Chairperson:
Benjamin Iñiguez, EDS BoG Member and Chair of the ED Spain Chapter
Tuesday, June 28 2022
8:30-9:30 “Characterization and TCAD modeling based design assessment of ultra-high voltage SiC devices,” Muhammad Nawaz (Hitachi Energy, Sweden)
9:30-10:30 “Nanoscale InGaAs FinFETs: Band-to-Band Tunneling and Ballistic Transport,” Jesús del Alamo (MIT, USA)
10:30-11:00 Coffee break
11:00-12:00 “Physics-Based Parameter Extraction for Thin Film Transistors,” Arokia Nathan (Darwin College, University of Cambridge, UK)
12:00-13:00; “Characterization and modeling of organic solar cells,” Lluís F. Marsal (University Rovira I Virgili, Tarragona, Spain)
13:00-15:00 Lunch
15:00-19:00 Meeting of the EDS SRC Region 8 Executive Committee
Wednesday, June 29 2022
11:00-12:00 “Trends and challenges in Nanoelectronics for the next decade,” Elena Gnani (University of Bologna, Italy)
12:00-13:00,“SPICE and Verilog-A Modelling Using FOSS TCAD/EDA Tools: Technology - Devices – Applications” (virtual), Wladek Grabinski (GMC, Switzerland)
13:00-14:20 Lunch
Joint Session
- MQ on CAD Modeling
- Graduate Student Meeting on Electronic Engineering
14:30-15:30 “Compact modeling of memristive devices for neuromorphic computing,” (virtual) Enrique Miranda (Autonomous University of Barcelona, Spain)
15:30-16:30 Physical Principles to Formulate Thin Film Transistor Models for Circuit Design (virtual), Samar Saha (Prospicient Devices, USA)
16:30-16:35 Closing remarks, B. Iñiguez
Feb 1, 2022
IEEE SSCS PICO Contestants Cross the Finish Line
Function | Team | Chip URL | |
1 | 5G bidirectional amplifier | Pakistan 3 (National University of Computer and Emerging Sciences) | https://efabless.com/projects/560 |
2 | Wireless power transfer unit | Pakistan 2 (National University of Computer and Emerging Sciences) | |
3 | Variable precision fused multiply–add unit | Pakistan 1 (National University of Computer and Emerging Sciences) | |
4 | Oscillator-based LVDT readout | India 2 (Anna University) | https://efabless.com/projects/474 |
5 | Temperature sensor | India 1 (Anna University) | |
6 | GPS baseband engine | India 3 (Anna University) | |
7 | Ultralow-power analog front end for bio signals | Brazil 2 (Universidade Federal de Santa Catarina) | https://efabless.com/projects/476 |
8 | TIA for quantum photonics interface | USA 4 (University of Virginia) | https://efabless.com/projects/470 |
9 | Bandgap reference | Egypt (Cairo University) | https://efabless.com/projects/473 |
10 | Neural network for sleep apnea detection | USA 2 (University of Missouri) | |
11 | Sonar processing unit | Chile (University of the Bío-Bío) | https://efabless.com/projects/54 |
Mar 31, 2021
[webinar] "More Moore Roadmap" by IRDS and SINANO
IEEE EDS France, IRDS and the SINANO Institute will organize a Webinar
Other Webinars of the IRDS Chapters will be announced in the EDS Newsletters
Mar 5, 2021
[C4P] IEEE-NANO 2021 (Virtual) Montreal, Canada
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