[C4P] LAEDC 2024

CALL FOR PAPERS & POSTERS

LAEDC 2024 R&D topics of interest include, but are not limited to:

All electron-based devices Electron Devices for Quantum Computing RF-MMW-5G Semiconductor-, MEMS- and Nanotechnologies Packaging, 3D integration Sensors and actuators Display technology Modeling and simulation Reliability and yield Device characterization Reliability Agrivoltaics

Flexible electronics Biomedical Devices Circuit-device interaction Novel materials and process modules Technology roadmaps Electron device engineering education Electron device outreach Optoelectronics, photovoltaic and photonic devices and systems Humanitarian Projects STEM Initiatives Energy harvesting 2D Materials and Devices

IMPORTANT DATES:

• Paper submission deadline: January 15, February 19, 2024
• Author notification: April 1, 2024
• LAEDC Conference Dates: MAY 8-10 2024

SPECIAL SESSIONS:

• MOS-AK Workshop
• IEEE EDS MQ
• LAEDC Summer School
• IEEE WIE/YP Session
• Humanitarian Technology Session

ABOUT GUATEMALA:

Guatemala, country of Central America. The dominance of an Indigenous culture within its interior uplands distinguishes Guatemala from its Central American neighbours. The origin of the name Guatemala is Indigenous, but its derivation and meaning are undetermined. Some hold that the original form was Quauhtemallan (indicating an Aztec rather than a Mayan origin), meaning “land of trees,” and others hold that it is derived from Guhatezmalha, meaning “mountain of vomiting water” - referring no doubt to such volcanic eruptions as the one that destroyed Santiago de los Caballeros de Guatemala (now Antigua Guatemala), the first permanent Spanish capital of the region’s captaincy general. The country’s contemporary capital, Guatemala City, is a major metropolitan centre. Quetzaltenango, in the western highlands, is the nucleus of the Indigenous population.

[C4P] IEEE LAEDC 2023

On behalf of the Organizing Committee of  IEEE 2023 Latin American Electron Devices Conference (LAEDC) we want to invite you to the next edition of our conference. It will take place in Puebla, Mexico from July 3-5, 2023.

The conference is growing rapidly with worldwide participation and will cover key topics in the field of electronic devices. The main objective of LAEDC is to bring together specialists from all fields related to electronic devices, it will also be aimed at students and young researchers. This event is financially sponsored by IEEE Electron Devices Society (EDS). We are sure that thanks to your significant achievements and contributions, your attendance will significantly increase the value of our conference and motivate research groups and young generations in the field of electronic devices. Please note that discounted registration will be available until June 17, 2023.

Please consider submitting a full paper to our conference proceedings no later than March 31th and engage with our audience and participants while visiting one of the most lively and historic cities in Mexico. For more information, please visit our web site and do not hesitate to contact us 

Sincerely

[mos-ak] [2nd Announcement and C4P] 4th International MOS-AK/LAEDC Workshop July 3 Puebla (MX)

2nd Announcement and C4P

Together with local online host, the LAEDC Organizers as well as all the Extended MOS-AK TPC Committee, would like to invite you to the 4th International MOS-AK/LAEDC Workshop which will be organized as the virtual/online event on July 3  between 8:30am -  12:30pm (UTC/GMT -5 hours) as a hybrid event in Puebla (MX) providing an opportunity to meet with modeling engineers and researchers from Europe and Latin America.

Upcoming MOS-AK/LAEDC Workshop aims to strengthen a network and discussion forum among experts in the field, enhance an open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors, in particular using Free 130nm Skywater PDK.

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:

• Compact Modeling (CM) of the electron devices
• Advances in semiconductor technologies and processing
• Verilog-A language for CM standardization
• New CM techniques and extraction software
• Open Source (FOSS) TCAD/EDA modeling and simulation
• CM of passive, active, sensors and actuators
• Emerging Devices, Organic TFT, CMOS and SOI-based memory
• Microwave, RF device modeling, high voltage device modeling
• Nanoscale CMOS, BiCMOS, SiGe, GaN, InP devices and circuits
• Technology R&D, DFY, DFT and reliability/aging IC designs
• Foundry/Fabless Interface Strategies (eg: Skywater 130nm CMOS)

List of MOS-AK speakers (tentative in alphabetical order) :

• Sergio Bampi, UFRGS (BR)
• Juan Brito, IMPINJ (BR)
• Antonio Cerdeira, CINVESTAV (MX)
• Benjamin Iniguez, URV (SP)
• Roberto Murphy, INAOE (MX)
• Jean-Michel Sallese, EPFL (CH)
• Gilson I Wirth, UFRGS (BR)

Online Abstract Submission is open (any related enquiries can be sent to abstracts@mos-ak.org)

Online Event Registration is open (any related enquiries can be sent to registration@mos-ak.org)

Important Dates: 

• Call for Papers: Dec. 2021
• 2nd Announcement: May 2022
• Final Workshop Program: June 2022
• MOS-AK: July 3 2022, Puebla (MX)
• 8:30am - 12:30pm (UTC/GMT -5 hours) MOS-AK Workshop

W.Grabinski for Extended MOS-AK Committee

WG170522