[paper] Compact Modeling of GaN HEMTs

Y. Chen et al., "Compact Modeling of THZ Photomixer Made from GaN HEMT," 2020 IEEE International Conference on Advances in Electrical Engineering and Computer Applications (AEECA), Dalian, China, 2020, pp. 484-489, doi: 10.1109/AEECA49918.2020.9213681.

Y. Chen et al., "A Surface Potential Based Compact Model for GaN HEMT I-V and CV Simulation," 2020 IEEE International Conference on Advances in Electrical Engineering and Computer Applications (AEECA), Dalian, China, 2020, pp. 490-495, doi: 10.1109/AEECA49918.2020.9213674.

A. Zhang et al., "Compact Modeling of Capacitance Components for GaN HEMTs," 2020 IEEE International Conference on Advances in Electrical Engineering and Computer Applications (AEECA), Dalian, China, 2020, pp. 505-511, doi: 10.1109/AEECA49918.2020.9213571.

FIG: Simplified GaN HEMT Structure

[C4P] Advanced FETs: Design, Fabrication and Applications

Call for Papers: Special MDPI  Issue 

"Advanced Field Effect Transistors: Design, Fabrication and Applications"

Deadline for manuscript submissions: 31 July 2021.

Dear Colleagues,

Planar MOS Field Effect Transistors (MOSFETs) were invented by Atalla and Kahng in 1959. After a decade, the MOSFETs entered mass production, as basic building blocks of P-, N-, and CMOS integrated circuits (ICs). Until the end of the twentieth century, MOSFET performance was largely improved by the implementation of so-called scaling rules. An exponential growth in the time of the transistor number per chip (observation formulated as Moore law) was achieved. This, together with advantageous characteristics and a nice feature of the planar MOSFETs allowing one to design the ICs by defining a width/length ratio, led to the great success of the CMOS technology on Si and SOI substrates.

However, starting from the 90 nm node, it has been observed that the standard scaling does not sufficiently translate into MOSFET performance improvement. Moreover, some device characteristics become degraded, e.g. gate leakage, channel leakage, variability and reliability. This has led to the development of preventative measures (e.g. high-k dielectrics) or performance boosters (e.g. channel strain engineering and channel materials). Furthermore, 2D and 3D multi-gate FETs were introduced to improve gate control over the channel and increase the channel aspect ratio. Multi-gate FETs are the only option for the 5nm node, which is expected soon, whereas they will have to be replaced by surrounding gate FETs for the 3nm node. For the past few years, the attention of researchers has been attracted by steep-subthreshold slope devices, enabling the reduction of supply voltage. A need for devices for quantum computing has appeared. FETs and HEMTs, for very high frequency applications, GaN, SiC and FETs for high voltage, high power, high temperature applications, and many other FET types, are in use or under development as a micro- and nanoelectronics reply to electronics needs in different domains.

There are many issues regarding the design, fabrication and applications of advanced field effect transistors. It is my pleasure to invite you to share your expertise in this Special Issue. Full papers, communications and reviews are all welcome.

Dr. Daniel Tomaszewski, ITE, Warsaw (PL)
Special Issue Guest Editor

[read more...]

Mini-Colloquium (MQ) on Nanoelectronics

AGENDA
DATE: Saturday Aug. 26, 2016

VENUE: IIT Kanpur L16

This Mini-Colloquium (MQ) on Nanoelectronics is being hosted by the IEEE Electron Device Society UP Chapter in collaboration with the Department of Electrical Engineering at IIT Kanpur. Distinguished speakers from renowned universities will be presenting on wide range of topics in Nanoelectronics. The MQ will be organized into 1 hour talks by the speakers. The agenda would be as follows:

Time	Topic	Speaker
9:00 - 9:15	Inauguration
9:15 - 9:30	High Tea
9:30 - 10:30	Nanotransistors with 2D materials: Opportunities and Challenges	Prof. Navkanta Bhat IISc
10:30 - 11:30	Revisiting gate C-V characterization for high mobility semiconductor MOS devices	Prof. Anisul Haque East West Univ.
11:30 - 11:45	Tea
11:45 - 12:45		Prof. V. Ramgopal Rao IIT Delhi
12:45 - 14:15	Lunch
14:15 - 15:15	ASM-HEMT - First Industry Standard Compact Model for GaN HEMTs	Prof. Yogesh Singh Chauhan IIT Kanpur
15:15 - 16:15	Spintronics - Perspectives and Challenges	Prof. Brajesh Kumar Kaushik IIT Roorkee
16:15 - 16:30	Tea
16:30 - 17:30	Advanced Hetero structure based Nano Scale MOSFETs	Prof. Chandan Kumar Sarkar Jadavpur Univ.

Coordinator: Dr. Yogesh S.Chauhan IIT Kanpur, India
Website: http://www.iitk.ac.in/nanolab/MQ/index.html

[paper] A surface potential large signal model for AlGaN/GaN HEMTs

A surface potential large signal model for AlGaN/GaN HEMTs

Q. Wu, Y. Xu, Z. Wen, Y. Wang and R. Xu

2016 11th EuMIC, London, UK, 2016, pp. 349-352

doi: 10.1109/EuMIC.2016.7777562

Abstract: This paper presents an accurate analytical surface-potential-based compact model for AlGaN/GaN HEMTs for SPICE-like circuit simulation. Considering the important energy level E₀, an easy-implemented analytical continuous expression for the fermi level position E_f was deduced to obtain the surface potential (SP) φ_s. Then analytical core models for intrinsic charge and drain current are derived based on φ_s. The model has been implemented in Agilent ADS by using symbolic defined device. Excellent agreement of DC I-V, fundamental output power, power added efficiency and gain is obtained for the first time compared with measurement results. Moreover, the effect of physical parameter such as the barrier thickness d on device characteristic is researched on the basic of this model. The results show that the proposed physical based model can be useful for technological parameters analysis and optimization of process.

[read more: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7777562&isnumber=7777458]