[paper] Compact Modeling of Flicker Noise in HV MOSFETs

Ravi Goel (Student Member, IEEE), Yogesh Singh Chauhan (Fellow, IEEE) 

Compact Modeling of Flicker Noise in High Voltage MOSFETs and Experimental Validation 

In 2021 IEEE Latin America Electron Devices Conference (LAEDC), pp. 1-4. IEEE, 2021 

DOI: 10.1109/LAEDC51812.2021.9437922

*Department of Electrical Engineering, Indian Institute of Technology Kanpur, India

Abstract: An analytical model of flicker noise (also called 1/f or low frequency noise) for the drift region is developed to formulate a 1/f model for high voltage MOSFETs using the subcircuit approach in this work. For halo doped drain extended MOSFET (DEMOS), the contribution factors of halo, channel and drift regions are obtained to capture anomalous behavior of 1/f noise. Similar to Halo doped DEMOS, for LDMOS, the contribution factors for channel and the drift region are obtained to capture the SID for different drain biases and channel lengths. The proposed model is validated with measurement data of 50V LDMOS and DEMOS.

Fig: Halo doped DEMOS and its sub-circuit equivalent. In halo doped DEMOS, the channel is divided into halo region and channel region, followed by drift region. In LDMOS, the channel is followed by the drift region. CFsh, CFch, and CFdrift are the contribution factors and are calculated using small-signal analysis.

Acknowledgments: The authors thank Sarvesh S. Chauhan for his valuable feedback. This work was partially supported by the Swarna Jayanti Fellowship (Grant No. – DST/SJF/ETA-02/2017- 18) and FIST Scheme (Grant No. – SR/FST/ETII-072/2016) of the Department of Science and Technology, India and Berkeley Device Modeling Center (BDMC).

[paper] Compact Model for SiC Power MOSFETs

Cristino Salcines¹, Sourabh Khandelwal² and Ingmar Kallfass¹ 

A Compact Model for SiC Power MOSFETs 

for Large Current and High Voltage Operation Conditions 

(2021) arXiv-2104. 

1 University of Stuttgart Stuttgart, Germany

2 Macquarie University Sydney, Australia  

Abstract: This work presents a physics based compact model for SiC power MOSFETs that accurately describes the I-V characteristics up to large voltages and currents. Charge-based formulations accounting for the different physics of SiC power MOSFETs are presented. The formulations account for the effect of the large SiC/SiO2 interface traps density characteristic of SiC MOSFETs and its dependence with temperature. The modeling of interface charge density is found to be necessary to describe the electrostatics of SiC power MOSFETs when operating at simultaneous high current and high voltage regions. The proposed compact model accurately fits the measurement data extracted of a 160 milli ohms, 1200V SiC power MOSFET in the complete IV plane from drain-voltage Vd = 5mV up to 800 V and current ranges from few mA to 30 A.

Fig: Output characteristics up to high current and high voltage in logarithmic scale for VGS = 6V to 20V in steps of 0.5V. Symbols are measurements and solid lines simulations of the proposed model. The logarithmic scale eases the visualization of both low and high VDS voltages in a single graph.

[C4P] Advanced FETs: Design, Fabrication and Applications

Call for Papers: Special MDPI  Issue 

"Advanced Field Effect Transistors: Design, Fabrication and Applications"

Deadline for manuscript submissions: 31 July 2021.

Dear Colleagues,

Planar MOS Field Effect Transistors (MOSFETs) were invented by Atalla and Kahng in 1959. After a decade, the MOSFETs entered mass production, as basic building blocks of P-, N-, and CMOS integrated circuits (ICs). Until the end of the twentieth century, MOSFET performance was largely improved by the implementation of so-called scaling rules. An exponential growth in the time of the transistor number per chip (observation formulated as Moore law) was achieved. This, together with advantageous characteristics and a nice feature of the planar MOSFETs allowing one to design the ICs by defining a width/length ratio, led to the great success of the CMOS technology on Si and SOI substrates.

However, starting from the 90 nm node, it has been observed that the standard scaling does not sufficiently translate into MOSFET performance improvement. Moreover, some device characteristics become degraded, e.g. gate leakage, channel leakage, variability and reliability. This has led to the development of preventative measures (e.g. high-k dielectrics) or performance boosters (e.g. channel strain engineering and channel materials). Furthermore, 2D and 3D multi-gate FETs were introduced to improve gate control over the channel and increase the channel aspect ratio. Multi-gate FETs are the only option for the 5nm node, which is expected soon, whereas they will have to be replaced by surrounding gate FETs for the 3nm node. For the past few years, the attention of researchers has been attracted by steep-subthreshold slope devices, enabling the reduction of supply voltage. A need for devices for quantum computing has appeared. FETs and HEMTs, for very high frequency applications, GaN, SiC and FETs for high voltage, high power, high temperature applications, and many other FET types, are in use or under development as a micro- and nanoelectronics reply to electronics needs in different domains.

There are many issues regarding the design, fabrication and applications of advanced field effect transistors. It is my pleasure to invite you to share your expertise in this Special Issue. Full papers, communications and reviews are all welcome.

Dr. Daniel Tomaszewski, ITE, Warsaw (PL)
Special Issue Guest Editor

[read more...]

[paper] Accurate diode behavioral model with reverse recovery

Stanislav Banáš^a,b, Jan Divína^b, Josef Dobeš^b, Václav Paňko^a

^aON Semiconductor, SCG Czech Design Center, Department of Design System Technology, 1. maje 2594, 756 61 Roznov pod Radhostem, Czech Republic

^bCzech Technical University in Prague, Faculty of Electrical Engineering, Department of Radioelectronics, Technicka 2, 166 27 Prague 6, Czech Republic

Solid-State Electronics

Volume 139, January 2018, Pages 31–38

https://doi.org/10.1016/j.sse.2017.10.034

Highlights:

• The complex robust time and area scalable Verilog-A model of diode containing reverse recovery effect has been developed.
• Due to implemented reverse recovery effect the model is useful especially for high-speed or high-voltage power devices.
• The model can be used as stand-alone 2-terminal diode or as a parasitic p-n junction of more complex lumped macro-model.
• Two methods of model parameter extraction or model validation have been demonstrated.

ABSTRACT: This paper deals with the comprehensive behavioral model of p-n junction diode containing reverse recovery effect, applicable to all standard SPICE simulators supporting Verilog-A language. The model has been successfully used in several production designs, which require its full complexity, robustness and set of tuning parameters comparable with standard compact SPICE diode model. The model is like standard compact model scalable with area and temperature and can be used as a stand-alone diode or as a part of more complex device macro-model, e.g. LDMOS, JFET, bipolar transistor. The paper briefly presents the state of the art followed by the chapter describing the model development and achieved solutions. During precise model verification some of them were found non-robust or poorly converging and replaced by more robust solutions, demonstrated in the paper. The measurement results of different technologies and different devices compared with a simulation using the new behavioral model are presented as the model validation. The comparison of model validation in time and frequency domains demonstrates that the implemented reverse recovery effect with correctly extracted parameters improves the model simulation results not only in switching from ON to OFF state, which is often published, but also its impedance/admittance frequency dependency in GHz range. Finally the model parameter extraction and the comparison with SPICE compact models containing reverse recovery effect is presented [read more...]

FIG: Solving the recursive calculation of reverse recovery charge