Showing posts with label device modelling. Show all posts
Showing posts with label device modelling. Show all posts

Sep 5, 2023

[paper] VNWFET-based technology

VNWFET-based technology: from device modelling to standard cell library
Sara Mannaa, Cedric Marchand, Damien Deleruyelle, Bastien Deveautour, 
Ian O’Connor, Alberto Bosio
2023 IEEE 23rd International Conference on Nanotechnology (NANO),
Jeju City, S.Korea, 2023, pp. 576-581
DOI: 10.1109/NANO58406.2023.10231288

Univ Lyon, ECL, INSA Lyon, CNRS, UCBL, CPE Lyon, INL, UMR5270, 69130 Ecully, France

Abstract: Vertical Nanowire Field Effect Transistors (VNWFETs) are an emerging technology with significant potential to reduce footprint and consequently interconnect capacitance, thereby achieving improved energy-efficiency and being naturally compatible with advanced 3D integration approaches. However, while initial estimations have focused on projections and estimations, no work has so far used a detailed compact model to attempt accurate transistor-level simulations for standard cell library characterization, thus enabling logic synthesis. In this paper, we propose a design flow to make the link from an existing (laboratory-scale) VNWFET technology and the associated compact model, to standard static logic cell design and characterization, and ultimately logic synthesis. To the best of our knowledge, this is the first work to prove the possibility of such a realistic design flow tailored to VNWFET technologies.

Fig: Through actual VNWFET fabrication setting up a design-technology co-optimization (DTCO) approach, the FVLLMONTI vision is to develop regular 3D stacked hardware layers of NNs empowering the most efficient machine translation thanks to fine-grain hardware / software co-optimisation.

Acknowledgment: This work has been founded by FVLLMONTI European Union’s Horizon 2020 research and innovation programme under grant agreement No 101016776.

Jan 18, 2014

[Final Program] EUROSOI 2014, Tarragona, Catalonia, Spain; January 27-29, 2014

The 10th Workshop of the Thematic Network
on Silicon on Insulator Technology, Devices and Circuits 
(EUROSOI 2014
Tarragona, Catalonia, Spain 
January 27-29, 2014 

The EUROSOI Workshop is an international forum to promote interaction and exchangesbetween research groups and industrial partners involved in SOI activities all over the world. Following the lively experience of the previous meetings in Granada (2005), Grenoble (2006), Leuven (2007), Cork (2008), Gšteborg (2009), Grenoble (2010), Granada (2011), Montpellier (2012), Paris (2013), EUROSOI 2014 will be held in Tarragona, Catalonia, Spain, and will include a short course program, oral and poster sessions, outstanding key-note presentations, as well as ample rooms for informal discussions. EUROSOI covers recent progress in SOI technologies and will be of interest to materials and device scientists, as well as to process, circuits and applications oriented engineers.

Monday, January 27, 2014

8:30 REGISTRATION
9:05-9:20 SHORT COURSE OPENING
9:20-11:00 PART 1 - EDS MINI-COLLOQUIUM ON SOI TECHNOLOGY 
9:20-10:10 "Process Challenges for Advanced Ge CMOS Technologies" Cor Claeys (IMEC, Leuven, Belgium)
10:10-11.00 "From Floating-Body Memory to Unified Memory on SOI" Sorin Cristoloveanu (INPG, Grenoble, France)
11:00-11:30 COFFEE BREAK
11:30-12:20 "Fabrication Challenges for sub-10 nm Technology nodes" Michael Ostling (KTH, Stockholm, Sweden)
12:20-13:00 "ESD protection of FD and MuG SOI CMOS Chips" Dimitris Ioannou (George Mason University, Fairfax, VA, USA)
13:00-14:30 LUNCH
14:30-15:50 Part 2 -EUROSOI TUTORIAL 
14:30-15:20 "Advanced SOI MOSFET architectures" Jason Woo (UCLA, CA, USA)
15:20-16:00 "SOI CMOS sensors, transistors and circuits for ultra-low-power and harsh environment applications" Denis Flandre (UCL, Louvain-la-Neuve, Belgium)
16:00-16:30 COFFEE BREAK
16:30-18:00 SOI MOSFET CHARACTERIZATION 
16:30-17:20 "On the threshold voltage and interface coupling in advanced SOI MOSFETs" Tamara Rudenko (ISP, Kyiv, Ukraine)
17:20-18:00 "From SOI MOSFET to Spin MOSFET: a modeling approach" Viktor Sverdlov (Tu-Wien, Austria)
20:30 EUROSOI RECEPTION

Tuesday January 28, 2014 

8:15 REGISTRATION
8:45-9:00 OPENING
9:00-11:00 PLENARY SESSIONS 
9:00-9:40 "Taking the next step on advanced HKMG SOI technologies -from 32 nm PD SOIvolume production to 20/28 FD SOI and beyond" Manfred Horstmann (Globalfoundries, Dresden, Germany) invited talk
9:40-10:20 INVITED TALK 
Heike Riel (IBM Research, Zurich) -invited talk
10:20-11:00 "Beyond Si CMOS: Benefits and Challenges " Rafael Rios (Intel, Portland OR, USA) -invited talk
11:00-11:20 COFFEE BREAK
11:20-13:00 SOI MATERIALS TECHNOLOGY AND CHARACTERIZATION 
11:20-11:40 Process and performance of Copper TSVs Lado Filipovic et al.
11:40-12:00 Increasing mobility and spin lifetime with shear strain in thin silicon films Dmitri Osintsev et al.
12:00-12:20 A Comparative Study of Variability of RTN Power Spectral Densities in Bulk and SOIMOSFETs  Louis Gerrer et al.
12:20-12:40 Low temperature noise spectroscopy of p-channel SOI FinFETs Bogdan Cretu et al.
12:40-13:00 Channel Length Influence on the Low-Frequency Noise of Strained 45o Rotated Triple Gate SOI nFinFETs Marcio Alves Sodre de Souza et al.
13:20-14:10 LUNCH
14:10-15:50 SOI MOSFET TECHNOLOGY 
14:10-14:30 Impact of S/D doping profile into electrical properties in nanoscaled UTB2SOI  devices Carlos Sampdero et al.
14:30-14:50 TCAD investigation on a formal Neuron device in 28nm UTBB FDSOI technology Philippe Galy et al.
14:50-15-10 Dual ground plane for high-voltage MOSFET in UTBB FDSOI Technology Antoine Litty et al.
15:10-15:30 Trigate NanoWire MOSFETs Analog Figures of Merit Kilchytska, Valeriya et al.
15:30-15:50 Electrostatically-doped SL FET optimized to meet all the ITRS power targetsat V_DD=0.4 V Elena Gnani et al.
15:50-16:00 COFFEE BREAK
16:00-17:20 SOI MOSFET CHARACTERIZATION 
16:00-16:20 Enhanced Dynamic Threshold Voltage UTBB SOI nMOSFETs Katia Sasaki et al.
16:20-16:40 Parasitic bipolar effect in advanced FD SOI MOSFETs: experimental evidence andgain extraction Fanyu Liu et al.
16:40-17:00 Impact of Lateral Fin-Width Non-Uniformity of FinFETs Clarissa Prawoto et al.
17:00-17:20 Surface effects on split C-V measurements on SOI wafers Luca Pirro et al.
17:20-17:40 Impact of Self-Heating on UTB MOSFET ParametersS ergej Makovejev at al.
17:40-18:00 POSTER BRIEFING (3 MIN EACH) 
18:00-19:40 POSTER SESSION 
Subthreshold Behavior of the PD SOI NMOS Device Considering BJT and DIBL Effects James Kuo et al.
Investigation of Statistical Effects on Reliability of SOI FinFETs Including Sidewall Crystal Orientation Salvatore Amoroso et al.
Powering the More than Moore Electronics with i-MOSLining Zhang et al.
Analysis of Short-Channel Effect in SOTB-MOSFET for Ultra-Low Power Applications Hidenori Miyamoto et al.
2D Analytical Modeling of the Trap-Assisted-Tunneling Current in Double-GateTunnel-FETs Michael Graef et al.
Improved Compact Current Model for FinFETs Based in a New Geometric Approach Arianne Pereira et al.
Capability of the IDS Analytical Model on Predicting the Diamond Variability by Usingthe F-Test Statistic Evaluation Salvador Gimenez et al.
An appraise of the sources of electrical parameters variation in DGMOS Rodrigo Picos et al.
An analytical model for the inversion charge distribution in GAA MOSFETs with rounded corners Francisco Ruiz et al.
The Negative World-line Holding Bias Effect on the Retention Time in FBRAMs Sara Santos et al.
20:30 GALA DINNER

Wednesday January 29, 2014 

8:30-10:30 SOI MOSFET MODELLING 
8:30-8:50 Comprehensive Low-Field Mobility Modeling in Nano-Scaled SOI Channels Zlatan Stanojevic et al.
8:50-9:10 A comprehensive DC current model to describe FinFET self-heating effects Benito Gonz‡lez et al.
9:10-9:30 Channel-Length Impact on Supercoupling Effect in FD-MOSFETs Carlos Navarro et al.
9:30-9:50 Substrate Effect on Threshold Voltage of long and short channel UTBB SOI nMOSFETs Joao Martino et al.
9:50-10:10 In depth characterization of electron transport in 14nm FD-SOI nMOS devices Minju Shin et al.
10:10-10:30 Role of the gate in ballistic nanowire SOI MOSFET Anurag Mangla et al.
10:30-10:50 COFFEE BREAK
10:50-13:10 CIRCUITS, MEMORIES AND SENSORS 
10:50-11:30 "Future of Multi-gate CMOS Technology" Hiroshi Iwai (University of Tokyo, Japan)
11:30-11:50 Impact of SEU on Bulk and FDSOI CMOS SRAM Walter Enrique Calienes Bartra et al.
11:50-12:10 Mechanical Characterization and Modelling of Lorentz Force Based MEMS Magnetic Field Sensors Petros Gkotsis et al.
12:10-12:30 Performance of Source-Follower Buffers Implemented with Junctionless Nanowire nMOS Transistors Michelly Souza et al.
12:30-12.50 PMOSFET-based Pressure Sensors in FD SOI Technology Benoit Olbrechts et al.
12:50-13:10 Performance of Common-Source current mirrors with asymmetric self-cascode SOInMOSFETs  Rafael Assalti et al.
13:10-14:20 LUNCH
14:20-16:10 BEYOND CMOS: NANOWIRES AND JUNCTIONLESS TRANSISTORS 
14:20-15:00 "2D semiconductor channels for ultimate thickness scaling and other versatile applications" Athanasios Dimoulas (IMS, Demokritos, Athens, Greece)
15:00-15:20 A way to solve Poisson equation en cylindrical coordinates to obtain a compact model for Junctionless Gate All Around MOSFET Franois Lime et al.
15:20-15:40 Explicit analytical charge and capacitance models for Junctionless Surrounding GateTransistors  Oana Moldovan et al.
15:40-16:00 Performance Evaluation of Stacked Gate-All-Around MOSFETs Meng-Hsueh Chiang et al.
16:00-16:20 Modeling of Quantization Effects in Nanoscale DG Junctionless MOSFETs Thomas Holtij et al.
16:20-16:30 COFFEE BREAK
16:30-16:50 BEYOND CMOS (TFETs) 
16:30-16:50 Heterojunction TFET inverters providing better performance than multi-gate CMOS at sub 0.3V Vdd Elena Gnani et al.
16:50-17:10 Transport mechanism influence on Vertical Nanowire-TFET analog performance as a function of temperature Paula Agopian et al.
17:10-17:30 3D Modeling of Direct Band-to-Band Tunneling in Nanowire TFETs. Lidija Filipovic et al.
17:30-17:50 Influence of the gate oxide thickness on the Analog Performance of vertical Nanowire-Tunnel FETs with Ge Source Felipe Neves et al.
17:50-18:10 Influence of a precisely positioned channel dopant on the performance of gate-allaround Si nanowire transistor: a full 3D NEGF simulation study Vihar Georgiev et al.
18:10-18:20 CONCLUSIONS AND ANNOUNCEMENTS 



Jan 9, 2013

10th IWCM Workshop Program

10th International Workshop on Compact Modeling 

January 22 (Tue), 2013 

Pacifico Yokohama, Room 419

Yokohama, Japan

Time
#
Title
Authors
Affiliation
9:00-9:10

Opening: H. J.  Mattausch (Workshop Chair)




Power Devices   Chair: D. Navarro


9:10-9:30
1
HiSIM_HV Temperature Modeling for Multi-Geometry LDMOS: Comparison of the Temperature Flag Options
Y. Iino
Silvaco Japan
9:30-9:50
2
Analysis and Further Improvements of the Drain-Resistance Modeling in HiSIM_HV
T. Umeda et al.
Hiroshima University
9:50-10:10
3
Floating-Base Effect Modeling for IGBT Structure using Potential Modification
T. Yamamoto
et al.
Denso
10:10-10:30

- Break -




Novel FET Structures Chair: T. Nakagawa


10:30-10:50
4
Study on Dynamic Threshold Nanowire Tunnel FET
A. Zhang et al.
Peking University
Shenzhen
10:50-11:10
5
A DC Model of TFETs for SPICE Simulations
L. Zhang and M. Chan
HK UST 
11:10-11:30
6
A Surface Potential Based Compact Model of Organic Thin-Film Transistor for Circuit Simulation
T.K. Maiti et al.
Hiroshima University
11:30-11:40

-  Break -




Optical and Wireless Chair: J. He


11:40-12:00
7
An Embedded Modulation of Silicon Germanium FIN-LED - A simulation study
J. Kwon et al.
Seoul National
University
12:00-12:20
8
Predicting Key Parameters of Inductive Power Links
S. Raju et al.
HK UST 
12:20-14:00

- Lunch Break -




Aging and Degradation Chair: M. Miura-Mattausch


14:00-14:40
9
Invited Keynote: Interaction of Bloch Carrier and Bound State in the Reliability Modeling
Y.J. Park and
S. Choi
Seoul National
University
14:40-15:00
10
Development of Unified Predictive NBTI Model and its Application for Circuit Aging Simulation
C. Ma et al.
Hiroshima University, STARC
15:00-15:20
11
Effects of Nonlocal Concentration of Carriers in the Oxide for NBTI Simulation
S. Rhee et al.
Seoul National
University
15:20-15:40

-  Break -




Fabrication Variation Chair: Y. J. Park


15:40-16:00
12
Parameter Extraction for Statistical Variation of HV-MOSFETs
Y. Ueda et al.
Ricoh, STARC
16:00-16:20
13
Analysis of Gate-Length Dependence of MOSFET Random Variation by Using HiSIM-RP
S. Kumashiro
et al.
Renesas Electronics
16:20-16:40
14
Random Dopant Fluctuation Effects on Double Gate Tunneling FET Performance
Y. Zhu et al.
Peking University
Shenzhen
16:40-16:50

Closing: H.J. Mattausch (Workshop Chair)



Mar 5, 2012

NDES 2012 July 11 – 13, 2012, Wolfenbüttel, Germany

The conference aims at stimulating and enabling scientists from all over the world to exchange know-ledge and ideas in the field of nonlinear dynamics and its applications in a friendly atmosphere. Nonlinear phenomena are observed in diverse areas such as physics, biology, economics, electronics and computer science. The conference will cover cutting-edge research in these highly active fields and explore new perspectives of nonlinear dynamics in interdisciplinary applications. The scope of interest includes, but it is not limited to:
  • Theory, analysis, modelling, implementations and applications of nonlinear circuits and systems in science, technology and biology
  • Nonlinear network analysis
  • Neural networks, neurodynamics, robots 
  • Nonlinear signal processing: Time-series analysis, communication, coding
  • Nonlinear devices: Sensors, lasers
  • Bifurcation and chaos, control and synchronisation
  • Geodynamics
Wolfgang Mathis (Conference Chair, Organizing Committee)
Ruedi Stoop (Conference Co-Chair, Organizing Committee)

Feb 26, 2010

Lots of Foundries and Fabless Companies do exist - what about standards for their interface?

DATE 2010 ET-P3 PANEL SESSION

Date: Thu, 2010-03-11; Time: 12:45-13:45
Room: Exhibition Theatre, Ground Floor

Organizers: Manfred Dietrich, Fraunhofer IIS/EAS, and Rene Schueffny, TU Dresden

Companies like Broadcom and Nvidia have shown that the Fabless model conquers the semiconductor market. Today all IDM’s use foundries as second source or use it as part of their volume production Because of the high cost of new manufacturing facilities IDM’s become Fablight and concentrate with their production on highly sophisticated processes. How is it possible to handle even more complex circuits if their processes cannot any more be deeply influenced by the internal design team? Today the value chain of the semiconductor market isolates and dominates more and more the vertical companies like EDA, Design house, Fabless, IP provider, Foundry Test & Packaging. Do we have already enough standards or do we need more and where do we need more standards and how can we make it happen? Who will be the driver or who should be the driver? This panel should offer some answers or even create more questions! It is fact - Fabless companies will have more and more impact in the whole IC logic market and Foundries increase their market share every year! Is it time for standards? [more]

Download DATE 2010 Conference Programme (PDF - 3 MB)

May 22, 2009

An interesting discussion in LinkedIn

There is an interesting thread in LinkedIn, started by Antonio Irvin Aquino:

Is there a market for outsourced device modelling/simulation??

By the moment, I've seen no comments, but I should think that, at least, there is a market for outsourced device models courses...