Jul 21, 2026

[program] ICMC2026


INTERNATIONAL COMPACT MODELING CONFERENCE PROGRAM
2026.si2-icmc.org

The 2026 conference continues under the theme “Enhancing Collaboration in Modeling with the Semiconductor Industry.” This year, ICMC especially encourages contributions in several timely and important areas, including electrostatic discharge (ESD) modeling for protection design, reliability and aging-aware compact models and simulation techniques, and the use of AI or machine learning for model development, parameter extraction, and circuit simulation efficiency. The conference also covers a broad range of topics in compact modeling, including the application of device models, device model development, model enhancements and implementations, and emerging devices.

This year’s technical program includes 3 keynote speakers, 7 invited speakers, 28 technical talks, 12 posters and a panel session. The program reflects both the depth and diversity of current modeling research and practice, ranging from model calibration and validation methodologies to reliability, RF, high-voltage, cryogenic, and emerging device applications.

Speaker Title
Keynote Presentations
Chenming Hu BSIM, FinFET, and Open Innovation
Yuan Taur Physical Insights Beyond the Textbook Modeling of MOSFETs and pn-junctions
Elyse Rosenbaum Measurement Challenges Impeding the Verification of ESD Compact Model Accuracy and Generalizability
Invited Presentations
James Victory Modeling and Simulation Challenges in Modern Power Discrete Semiconductor Technologies
Gilson Wirth Modeling of Low-Frequency Noise and BTI in Electron Devices
Chien-Ting Tung Application of AI and ML in the Compact Modeling Domain
Michael Stockinger On-Chip ESD Protection Design Optimization Using ESD Device Compact Models
Darsen Lu Ferroelectric Memory Devices Compact Modeling and Applications
Meng-Lin Lu Applications of Machine Learning Techniques in the Compact Modeling Platform
Lorenzo Peri Compact Quantum Dot Models for Hybrid Microwave Circuits and Quantum Information Processing

Program Grid – Friday, July 30
Time Session
8:30 - 8:45 Day 1 Welcome (Queens Salon)
8:45 - 9:25 [Keynote] BSIM, FinFET, and Open Innovation by Prof. Chenming Hu
9:25 - 10:25 Advances in Compact Modeling (Queens Salon)
10:25 - 10:45 Coffee Break (Royal Salon & Kings View Room)
10:45 - 12:10 Ferroelectric and other Nonvolatile Memories (Queens Salon)
12:10 - 13:20 Lunch Served (Royal Salon & Kings View Room)
13:20 - 14:00 [Keynote] Physical Insights Beyond the Textbook Modeling of MOSFETs and p-n Junctions by Prof. Yuan Taur
14:00 - 15:05 Emerging Devices and Technologies (Queens Salon)
15:05 - 15:25 Coffee Break (Royal Salon & Kings View Room)
15:25 - 16:30 Wide Bandgap Material Device Models (Queens Salon)
16:30 - 17:00 Poster Introductions (Queens Salon)
17:00 Poster Session & Reception (Verandah Grill/Deck)

Program Grid – Friday, July 31
Time Session
8:30 - 8:40 Day 2 Welcome (Queens Salon)
8:40 - 9:20 [Keynote] Measurement Challenges Impeding the Verification of ESD Compact Model Accuracy and Generalizability by Prof. Elyse Rosenbaum
9:20 - 10:05 ESD Protections Modeling (Queens Salon)
10:05 - 10:25 Coffee Break (Royal Salon & Kings View Room)
10:25 - 11:55 Machine Learning and Artificial Intelligence in Compact Modeling (Queens Salon)
11:55 - 12:55 Lunch Served (Royal Salon & Kings View Room)
12:55 - 13:55 Panel Session: Machine Learning for Compact Modeling – Promises, Pitfalls, and Paths to Industry Adoption
13:55 - 14:40 Modeling of Noise and Traps (Queens Salon)
14:40 - 15:00 Coffee Break (Royal Salon & Kings View Room)
15:00 - 16:20 Devices at Cryogenic Temperatures (Queens Salon)
16:20 - 17:00 Closing Ceremony & Awards (Queens Salon)

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