Aug 3, 2026

[C4P] EDTM 2027 Fukuoka, Japan

11th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference
Theme: “Empowering the AI Era: 
The Role of Innovation in Semiconductor Devices and Manufacturing”
March 8–11, 2027 Fukuoka, Japan
https://attend.ieee.org/edtm-2027/


General Information

Important Dates

Paper submission deadline: October 15, 2026
Notification of acceptance: Late December 2026

Conference Overview

The 11th EDTM conference is a four-day meeting fully sponsored by the IEEE Electron Devices Society (EDS). It serves as a forum for the electron devices community to collaborate on devices, materials, tools, and innovative technologies across the semiconductor ecosystem.

Technical Areas

  • Materials
  • Processes, Tools, Yield, and Manufacturing
  • Advanced Logic Devices
  • Memory Technologies
  • Photonics, Imaging and Display
  • Power, RF, and Energy Devices
  • Modeling and Simulation
  • Reliability and Testing
  • Packaging and Heterogeneous Integration
  • Sensors, MEMS, BioElectronics
  • Flexible and Wearable Electronics
  • Nanotechnologies
  • Disruptive Technologies

Oral and Poster Sessions

EDTM 2027 will feature parallel oral and poster technical sessions. Best Paper, Best Student Paper, and Best Poster Awards will be selected.

Publications

Accepted and presented papers will be published in the EDTM 2027 Proceedings (IEEE Xplore). Selected high-impact papers may be invited to submit extended versions to J-EDS.

Short Courses & Tutorials

Held on March 8, 2027. Tutorials cover fundamentals to state of‑the‑art; short courses focus on advanced topics aligned with the conference theme.

Exhibition

Vendors will showcase new products and technologies, enabling attendees to learn about tools and techniques supporting their work.

Secretariat

EDTM 2027 Committees

General Chair

  • Masumi Saitoh (Kioxia)

TPC Chair

  • Kensuke Ota (Sony Semiconductor Solutions)

Steering Committee

  • Shuji Ikeda (Chair, tei Solutions)
  • Masumi Saitoh (Kioxia)
  • Arokia Nathan (Uni. Cambridge)
  • Bin Zhao (Iotelligent)
  • Ravi M. Tody (Synopsys)
  • John Dallesasse (UIUC)
  • Murty Polararapu (Space Electronics Solutions)
  • Meikei Ieong (Simbury Limited)
  • Subramaniam Iyer (UCLA)
  • P. Susthitha Menon (UKM)
  • Chen Yang (Analog Devices)
  • Merlyne de Souza (Univ. of Sheffield)
  • Bernard Lim (Appscard)
  • Yang Chai (Poly Univ.)
  • Yogesh Chauhan (IIT Kanpur)
  • Changrock Song (SK Hynix)
  • Kazunari Ishimaru (Rapidus)
  • Hitoshi Wakabayashi (Science Tokyo)

Executive Committee

  • Shuji Ikeda (tei Solutions)
  • Hitoshi Wakabayashi (Science Tokyo)
  • Kazunari Ishimaru (Rapidus)
  • Masumi Saitoh (Kioxia)
  • Chen Jiang (Tsinghua University)
  • Kensuke Ota (Sony Semiconductor Solutions)
  • Yuichiro Ando (Osaka Metropolitan Univ.)
  • Kimihiko Kato (AIST)
  • Kazuaki Iwasawa (TEL)
  • Shoichi Kabuyanagi (Kioxia)
  • Tadashi Yamaguchi (Renesas)
  • Takuya Maeda (Univ. Tokyo)
  • Bich-Yen Nguyen (Soitec)
  • Phuc Le Hoang (VSAP Lab)

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