[C4P] MIXDES 2024

The MIXDES conference series started in Dębe near Warsaw in 1994 and has been organized yearly in the most interesting Polish cities. In 2024 we would like to continue the tradition of inviting you to the most attractive places in Poland and the conference will take place in Gdańsk between June 27-29, 2024

In short period of time the conference has become an important event in the Central Europe allowing to discuss the recent research progress in the field of design, modelling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices as well as their interdisciplinary applications.

The topics of the MIXDES 2024 Conference include:

• Design of Integrated Circuits and Microsystems
  Design methodologies. Digital and analog synthesis. Hardware-software co-design. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
• Thermal Issues in Microelectronics
  Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits. 
• Analysis and Modelling of ICs and Microsystems
  Simulation methods and algorithms. Behavioral modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
• Microelectronics Technology and Packaging
  New microelectronic technologies. Packaging. Sensors and actuators.
• Testing and Reliability
  Design for testability and manufacturability. Measurement instruments and techniques. 
• Power Electronics
  Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
• Signal Processing
  Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
• Embedded Systems
  Design, verification and applications.
• Medical Applications
  Medical and biotechnology applications. Biometrics. Thermography in medicine

Call for Papers and Contributions

A call is made for papers, contributions and other conference activities on the topics mentioned above. Full papers should be submitted till March 1, 2024 - only in electronic form (MS Word, RTF, Open Office Writer, LaTeX, together with a generated PDF file).

The paper submission form and required format is available on our Web page. Authors are asked to indicate the topic into which their papers fall. The papers will be reviewed by at least two referees from the International Programme Committee. The papers will be published in the proceedings from the author's electronic submission.

Tutorials and Special Sessions - Call for Proposals

Several tutorials/special sessions will be held prior to the conference. Authors willing to propose a tutorial at MIXDES 2024 are invited to send a proposal to the Organizing Committee. The proposal should consist of a three-page summary including tutorial title, name and affiliation of the lecturer(s), tutorial objectives and audience, topical outline and provisional schedule of the tutorial.

[paper] Neural Compact Modeling Framework

Eom, Seungjoon, Hyeok Yun, Hyundong Jang, Kyeongrae Cho, Seunghwan Lee, Jinsu Jeong, and Rock‐Hyun Baek

Neural Compact Modeling Framework for Flexible Model Parameter Selection with High Accuracy and Fast SPICE Simulation

Advanced Intelligent Systems (2023): 2300435

DOI: 10.1002/aisy.202300435

Department of Electrical Engineering, Pohang University of Science and Technology, Pohang 37673 (KR)

Abstract: Neural compact models are proposed to simplify device-modeling processes without requiring domain expertise. However, the existing models have certain limitations. Specifically, some models are not parameterized, while others compromise accuracy and speed, which limits their usefulness in multi-device applications and reduces the quality of circuit simulations. To address these drawbacks, a neural compact modeling framework with a flexible selection of technology-based model parameters using a two-stage neural network (NN) architecture is proposed. The proposed neural compact model comprises two NN components: one utilizes model parameters to program the other, which can then describe the current–voltage (IV) characteristics of the device. Unlike previous neural compact models, this two-stage network structure enables high accuracy and fast simulation program with integrated circuit emphasis (SPICE) simulation without any trade-off. The IV characteristics of 1000 amorphous indium–gallium–zinc-oxide thin-film transistor devices with different properties obtained through fully calibrated technology computer-aided design simulations are utilized to train and test the model and a highly precise neural compact model with an average IDS error of 0.27% and R2 DC characteristic values above 0.995 is acquired. Moreover, the proposed framework outperforms the previous neural compact modeling methods in terms of SPICE simulation speed, training speed, and accuracy.

Fig: a) The structure of a-IGZO TFT structure simulated with TCAD

b) Calibrated a-IGZO sub-gap DOS

Acknowledgements: This work was supported in part by the LG Display Company, in part by the Brain Korea 21 Fostering Outstanding Universities for Research (BK21 FOUR) program, in part by Institute of Information and Communications Technology Planning and Evaluation (IITP) grant funded by the Korea government (MSIT) (grant no. 2019-0-01906, Artificial Intelligence Graduate School Program [POSTECH]), in part by the Ministry of Trade, Industry and Energy (MOTIE) under grant no. 20020265, in part by Korea Semiconductor Research Consortium (KSRC) support program for the development of the future semiconductor device, and in part by the Technology Innovation Program (grant no. RS2023-00231985) funded by the Ministry of Trade, Industry and Energy (MOTIE, Korea) (grant no. 1415187390).

[github] new RevEDA Release

Revolution EDA Schematic/Symbol/Layout Editors

https://github.com/eskiyerli/revedaRelease

A new release of Revolution EDA is almost here, including a brand-new hierarchical layout editor with GDS export capability, revamped schematic, and symbol editors. Layout editor can use python-based parametric layout cells. The editor can also create vias and via arrays, paths (Manhattan, diagonal and free-angle), rectangles, polygons, pins and texts. Schematic editor can now import Spice subcircuits and create symbols for inclusion in the schematic editor. A cell can have more than one cellview such as SPICE, Verilog-A or symbol that can be used in the netlisting. The netlisting process can be controlled by a switch-view list or by a separate config view. Unlike leading commercial EDA systems, netlisting and GDS export process are running as separate threads and do not block the user's work.

Any interested parties are kindly invited to get in touch with Murat Eskiyerli, the lead RevEDA developer

[C4P] 82nd DRC

DRC 2024 

The 82nd Device Research Conference

The University of Maryland, College Park

2024.DEVICERESEARCHCONFERENCE.ORG

DRC will be held in coordination with the Electronic Materials Conference (EMC), which will occur the same week, from June 26-28. This recognizes the strong interaction between device and electronic materials research and provides fruitful exchanges of information between attendees of both Conferences.

The 2024 Conference will feature:

• An informative, timely short course in rapidly developing fields
• Oral and poster presentations on electronic/photonic device experiments 
• and simulations
• Plenary and invited presentations given by worldwide leaders
• Evening rump sessions
• Strong student participation and Student Paper Awards
• Focus Sessions on Devices for Neuromorphic Computing
• More than 50 invited speakers covering a wide spectrum of devices

Topics to be presented include:

Devices for Biological and Healthcare Applications Emerging Devices Devices for Extreme Conditions Spintronic and Magnetic Devices Memory Devices Modeling and Simulation of Devices Nanoscale and Vacuum Devices Optoelectronic and Optical Devices

Power Devices Quantum Devices Heterogeneously Integrated Devices Thin-Film and Flexible Devices RF and Terahertz Devices Wide-bandgap Device 2D Materials and Devices Neuromorphic Computing Devices

Important Dates

• Feb. 16, 2024 Abstract Submission Deadline
• April 5, 2024 Acceptance Notification
• April 10, 2024 Registration Opens
• May 15, 2024 Early Bird Registration Deadline

[paper] OTA using the Open Sky130 PDK

Carolina Vieira Souza, Edmar Philipe Ribeiro

and Estêvao Coelho Teixeira

Design of a Linear Transconductance OTA using the Open Sky130 Process Design Kit

Sociedade Brasileira De Microeletrônica

(2023) sbmicro.org.br

Faculdade de Engenharia, Universidade Federal de Juiz de Fora, Brazil

Abstract: This paper describes the design, layout and simulation of a linear transconductance Operational Transconductance Amplifier (OTA) using the SkyWater 130nm open Process Design Kit (PDK). By using a known source degeneration technique, it is possible to either decrease and linearize the transconductance of the OTA for a wider range of input voltages, making it proper for use on Gm-C filters. Only open source tools, suited for the Sky130 PDK, were used in this design, showing the applicability to analog designs.

Fig: Linear OTA Structure: (a) Complete circuit, with source degeneration resistors;
(b) Alternative source degeneration triode MOSFETs; and its GDSII layout, with identification of some relevant parts: (A) differential pair; (B) source-degeneration resistors; (C) biasing transistors.

Acknowledgment: This work is result from a scientific initiation project covered by the VI VIC 2022/2023 Program, by PROPP/UFJF.