Sep 3, 2026

[map] Poland: Emerging Semiconductor Hub

[Map photo] Karolina Falkenberg | Business Development Expert | Lodz Special Economic Zone

Mas illustrating Poland’s semiconductor ecosystem was presented at SEMICON Taiwan 2026 in Taipei. The Polish national stand was officially opened by Michał Jaros, Secretary of State at the Ministry of Development and Technology. The Lodz Special Economic Zone was represented together with Jacek Podgórski and Janusz Woźny from the Lodz University of Technology, highlighting the investment and research potential of Lodz and Central Poland.





Sep 2, 2026

[paper] a-IGZO Thin-Film Transistor Compact Model

Seunghyun Son, Taejun Ha, Taeyoung Nam, Yoonyoung Chung, Sunmean Kim
Bayesian Optimization–Reinforcement Learning Hybrid Framework for a-IGZO Thin-Film Transistor Compact Model Parameter Extraction in 2T0C Dynamic Random Access Memory Applications
Advanced Intelligent Systems (2026): e70525

1.) School of Electronic and Electrical Engineering, Kyungpook National University, Daegu, Republic of Korea
2.) Department of Electrical Engineering, POSTECH, Pohang, Republic of Korea

Abstract: In this work, we propose a two-stage BO–RL hybrid framework for compact model parameter extraction of a-IGZO TFTs. The strategy combines the complementary strengths of Bayesian optimization (BO) and reinforcement learning (RL): BO performs global exploration and provides an optimized starting point, and RL conducts local refinement within a reduced search domain. Experimental results demonstrate that the hybrid method substantially improves extraction efficiency while maintaining fitting accuracy statistically comparable to that of BO or RL alone. Across five independent random seeds under an equal 4000-simulation budget, the fitting quality of BO–RL is statistically comparable to that of BO, while RL alone remains an order of magnitude less sample-efficient; the RL refinement stage requires no surrogate refitting, so its per-simulation cost remains low and constant, and the framework attains comparable fitting quality without the growing optimization overhead of BO. We validate the framework using an a-IGZO TFT compact model, showing good agreement between SPICE-simulated and measured C–V/I–V curves with the extracted parameters. Circuit-level transient simulations of an a-IGZO 2T0C cell demonstrate write/hold operations with a retention time of 172 s.
FIG: Schematic of a-IGZO TFT structure and fabrication process;
SPICE (lines) simulation and experimental data (points) comparison

Acknowledgments: This paper was a result of the research project supported by SK Hynix Inc.
Funding MDUO004A

Aug 29, 2026

[C4P] SBCCI2027 Florianópolis


40th SYMPOSIUM ON INTEGRATED CIRCUITS AND SYSTEMS DESIGN
SBCCI2027
August 23 to 27, 2027, Florianópolis (BR)

General Chair
José Luís Güntzel, UFSC, Brazil
Ney Calazans, UFSC, Brazil

Program Chairs
Fernando Moraes, PUCRS, Brazil
Samuel Pagliarini, Carnegie Mellon, USA

Exhibition Chairs
Marcelo Lubaszewski, UFRGS, Brazil
Paulo Butzen, UFRGS, Brazil

Finance Chair
Fabian Cabrera Riaño, UFSC, Brazil

Panels Chair
Omar Paranaiba Vilela Neto, UFMG, Brazil

Local Arrangements Chairs
César Rodrigues, UFSC, Brazil
Walter Carpes Jr., UFSC, Brazil

Publicity Chair
Ricardo Reis, UFRGS, Brazil
SBCCI is an international forum dedicated to integrated circuits and systems design, test and electronic design automation (EDA), held annually in Brazil. The 40th SBCCI will take place in Florianópolis, State of Santa Catarina, Brazil. The symposium brings together researchers in EDA, IC design and test. It includes technical sessions, tutorials, panels, an exhibition and working group meetings. Proceedings will be published in IEEE Xplore. Best papers will be invited to submit extended versions to IEEE Design & Test, IEEE OJCAS, and JICS.

Call for Papers
www.sbcci.org.br

Important Dates
Paper Submission Deadline: April 5, 2027
Notification of Acceptance: May 14, 2027
Camera-Ready Deadline: June 4, 2027

Sponsored by
SBC – Brazilian Computer Society
SBMicro – Brazilian Microelectronics Society
IEEE Circuits & Systems Society
IEEE CEDA – Council on EDA
Co-Sponsored by
IFIP WG10.5 
International Federation for Information Processing

Organized by
UFSC – Federal University of Santa Catarina



Aug 25, 2026

[paper] Datasheet‑Driven Automated Device Modeling

Siddharth Mohan, Mike Engelhardt, Tim McCune, and Jeff Strang
Datasheet-Driven Automated Device Modeling
22nd IEEE SMACD (2026) Dresden, Germany
DOI: 10.1109/SMACD70206.2026.11647759

* Qorvo Inc., CA, USA

Abstract: Accurate device models are a prerequisite fortrustworthy SPICE simulations, yet generating compact models from vendor datasheets has traditionally been time‑consuming anderror‑prone. QSPICE adds a Model Generators that build MOSFET, JFET, and diode models from commonly available datasheet values in minutes, integrating directly with its mixed‑mode simulator. We formalize a datasheet‑drivenworkflow (digitization, automated parameter mapping, simulation), and report qualitative validation across ID–VDS, ID–VGS, Coss, Qg, and IS–VSD characteristics using overlays from an industrial case study. We discuss adoption guidance, limitations, and opportunities for further quantitative benchmarking.

Fig: Automated model-generation workflow diagram.

AOB414 datasheet Available: https://www.designing-electronics.com/the-qspice-model-generator/


[book] The FET Centennial: Celebrating the Field-Effect Transistor

The FET Centennial: Celebrating the Field-Effect Transistor

Cary Y. Yang (Editor), Cor Claeys (Editor), 
Arokia Nathan (Editor), Bin Zhao (Editor)

ISBN: 978-1-394-40648-7 Sept. 2026 Wiley-IEEE Press 976pp
 







Abstract: Presents a landmark volume documenting 100 years of field-effect transistor innovation and applications. 
The invention of the field-effect transistor (FET) in 1925 transformed the trajectory of modern civilization, enabling virtually every electronic device in existence today. From the earliest integrated circuits to the most advanced computers and smartphones, the FET has served as the indispensable foundation of contemporary information technology. The FET Centennial: Celebrating the Field-Effect Transistor commemorates this milestone by gathering a distinguished group of contributors to provide a comprehensive account of the device’s history, global development, diverse applications, and potential future directions. 

History and Evolution of FET Technology Table of Contents
  • About the Editors xxi
  • About the Contributors xxiv
  • A Special Tribute in Memory of Chih-Tang Sah [1932–2025] xxxv
  • Foreword xxxvii
  • Preface xxxix
  • 1 The Miraculous Evolution of the Field-Effect Transistor (FET)
    Hiroshi Iwai
    • 1.1 Introduction
    • 1.2 1925–1960: Early Concepts and Challenges in MOSFET Development
    • 1.3 1960–1970: The MOSFET Instability Problem
    • 1.4 From MOS ICs to MOS LSIs: 1965–1969
    • 1.5 Technologies for MOS Integrated Circuits Developed Between 1965 and 1970
    • 1.6 First-Generation LSIs—Al- or Si-Gate PMOS LSIs
    • 1.7 Second-Generation LSI
    • 1.8 First Generation of VLSI
    • 1.9 Transition from NMOS to CMOS
    • 1.10 Advances in Scaling Technologies
    • 1.11 Challenges in Sub-50 nm Scaling
    • 1.12 Development of RF CMOS Device Technology
    • 1.13 Post-2000: Limits of Miniaturization
    • 1.14 Future Prospects
    • 1.15 Summary and Concluding Remarks
  • 2 MOSFET Device Structures and Physical Models
    Yuan Taur
    • 2.1 MOSFET Device Structures
    • 2.2 MOSFET Physical Models
    • 2.3 Conclusion
  • 3 Field-Effect Transistor R&D in the United States
    Robert Chau, Suman Datta
    • 3.1 Introduction
    • 3.2 Early US FET R&D
    • 3.3 Birth of the MOSFET at Bell Labs
    • 3.4 Advent of CMOS
    • 3.5 Moore's Law: Classical Scaling
    • 3.6 Moore's Law: Equivalent Scaling
    • 3.7 Inflection Point for FETs
    • 3.8 Zetta-Scale Computing
    • 3.9 Conclusion
  • 4 Asia's FET R&D Innovations
    Carlos H. Diaz, Akira Toriumi
    • 4.1 Introduction
    • 4.2 Asia's Rise in the Semiconductor Industry
    • 4.3 Logic Technology
    • 4.4 Memory Technology
    • 4.5 Thin Film Transistors
    • 4.6 III–V FETs
    • 4.7 Power FETs
    • 4.8 Concluding Remarks
  • 5 Fully Depleted SOI Technology
    Thomas Skotnicki, Stephane Monfray
    • 5.1 Prologue
    • 5.2 Introduction
    • 5.3 From Equation to Demonstration
    • 5.4 From Lab to Fab
    • 5.5 Technology Expansion and Scaling
    • 5.6 Summary and Perspective
  • 6 MOS-Based RAM
    Jeonghoon Oh, Sangyeop Baeck
    • 6.1 DRAM Transistor Technology
    • 6.2 SRAM Transistor Technology
    • 6.3 Conclusion
  • 7 Floating Gate FETs as Nonvolatile Memories
    Stefan K. Lai, Koji Sakui, Riichiro Shirota
    • 7.1 Introduction
    • 7.2 EPROM and EEPROM
    • 7.3 NOR Flash
    • 7.4 NAND Flash
    • 7.5 Summary and Acknowledgment
  • 8 FET-Based Logic Devices and Systems
    Ghavam G. Shahidi
    • 8.1 Introduction
    • 8.2 From Dash-Dots to FETs
    • 8.3 First Commercial FET Microprocessor
    • 8.4 Personal Computer
    • 8.5 Microprocessors
    • 8.6 DSP and Communications
    • 8.7 The iPhone
    • 8.8 Data Centers
    • 8.9 GPUs and AI
    • 8.10 Energy Per Switch
  • 9 SiC FETs
    Tsunenobu Kimoto
    • 9.1 Introduction
    • 9.2 Interface Properties
    • 9.3 SiC Power MOSFETs
    • 9.4 SiC Power JFETs
    • 9.5 SiC CMOS ICs
    • 9.6 SiC JFET ICs
    • 9.7 Applications and Outlook
  • 10 III–V and III-N FETs
    Giovanni Ghione, Matteo Meneghini
    • 10.1 III–V FETs and ICs
    • 10.2 III-N FETs
    • 10.3 Conclusions
  • 11 CMOS Image Sensors
    Yusuke Oike
    • 11.1 Introduction
    • 11.2 Historical Background
    • 11.3 Technological Advancements
    • 11.4 Stacked Device Technologies
    • 11.5 Pixel Performance Metrics
    • 11.6 Sensing Extensions
    • 11.7 Emerging Technologies
  • 12 Thin-Film Transistor
    Yue Kuo, Arokia Nathan
    • 12.1 TFT Development History
    • 12.2 Market Size
    • 12.3 Structures and Processes
    • 12.4 Figures of Merit
    • 12.5 Material–Process–Device Relationship
    • 12.6 Applications
    • 12.7 Emerging Challenges
    • 12.8 Summary
  • 13 Process Integration for Hyper-Scaled MOSFETs
    Kelin J. Kuhn
    • 13.1 Introduction
    • 13.2 Self-Alignment
    • 13.3 Replacement Gate
    • 13.4 Fully Depleted Channels
    • 13.5 What Happens Next?
  • 14 50 Years of RF CMOS Design
    Behzad Razavi
    • 14.1 RF CMOS Is Born
    • 14.2 SPICE Is Born
    • 14.3 Direct-Conversion RX
    • 14.4 Analog Designers
    • 14.5 RF CMOS Again
    • 14.6 High Integration
    • 14.7 ΔΣ Synthesizer
    • 14.8 Direct Conversion
    • 14.9 Noise Simulator
    • 14.10 Direct Conversion Matures
    • 14.11 Scaling Effects
    • 14.12 UWB, Cognitive, WiGig, 5G
    • 14.13 Multiband Radios
    • 14.14 Phased-Array Transceivers
    • 14.15 Conclusion
  • 15 Compact FET-Based Device Modeling
    Mitiko Miura-Mattausch, Hans Jürgen Mattausch
    • 15.1 Introduction
    • 15.2 Transistor Operations
    • 15.3 MOSFET Equations
    • 15.4 Modeling Approaches
    • 15.5 Model Standardization
    • 15.6 Advanced Compact Modeling
    • 15.7 MOSFET-Descendant Models
    • 15.8 Advanced FET Generations
    • 15.9 Future Trends
    • 15.10 Circuit Design Perspectives
    • 15.11 Conclusion
  • 16 Evolution of Photolithography
    Anthony Yen, Winfried Kaiser, Akiyoshi Suzuki
    • 16.1 Introduction
    • 16.2 Contact/Proximity Printing
    • 16.3 1× Projection Imaging
    • 16.4 Step-and-Repeat Lithography
    • 16.5 Deep UV Lithography
    • 16.6 193nm and 157nm Lithography
    • 16.7 Immersion Lithography
    • 16.8 EUV Lithography
    • 16.9 Summary and Outlook
  • 17 Back-End-of-Line Interconnect Technology
    Takayuki Ohba, Takashi Yoda
    • 17.1 Introduction
    • 17.2 Interconnect Module Evolution
    • 17.3 3D Integration
    • 17.4 Variation and Beyond
    • 17.5 2.5D and 3D Damascene Processes
    • 17.6 Conclusion
  • 18 Three-Dimensional FET
    Digh Hisamoto, Samar K. Saha
    • 18.1 Introduction
    • 18.2 Dawn of Devices and Computers
    • 18.3 Transistor Computer
    • 18.4 Golden Age of Planar MOSFETs
    • 18.5 FinFET Era
    • 18.6 Conclusions
  • 19 GAAFET Technologies
    Dong-Won Kim
    • 19.1 Introduction
    • 19.2 GAAFET Candidates
    • 19.3 Operation
    • 19.4 Design Considerations
    • 19.5 Reliability Challenges
    • 19.6 DTCO for GAAFET
    • 19.7 3D Scaling
    • 19.8 Conclusion
  • 20 2D-FET Contact Engineering
    Chandan Biswas, Deji Akinwande
    • 20.1 Introduction
    • 20.2 Electronic Property Challenges
    • 20.3 Contact Engineering
    • 20.4 Quantum Limit of Contact Resistance
    • 20.5 Summary
  • 21 Carrier Transport in MOSFETs
    Mark Lundstrom
    • 21.1 Introduction
    • 21.2 A Focus on the Source
    • 21.3 Drift-Diffusion Transport
    • 21.4 Velocity-Saturated MOSFET
    • 21.5 Non-Local Transport
    • 21.6 Ballistic MOSFET
    • 21.7 Quasi-Ballistic MOSFET
    • 21.8 Quantum Transport
    • 21.9 Discussion
    • 21.10 Conclusions
  • 22 What Is Next for FET?
    Tsu-Jae K. Liu, Tahir Ghani, Carolyn Duran
    • 22.1 Introduction
    • 22.2 Tunnel FET
    • 22.3 Negative Capacitance FET
    • 22.4 High-Mobility Channel Transistors
    • 22.5 NEMS Switch
    • 22.6 Sustainability
    • 22.7 Summary
<https://books.google.ch/books?id=wnUEEgAAQBAJ>