May 22, 2026

[Lecture 13-16] supplementary by Prof. Kim

Prof. Kwantae Kim, Analog Integrated Circuits at Aalto University, recorded additional videos that cover walkthroughs of the CAD exercises in his Integrated Analog Systems course. These videos should provide useful guidance for ADC design simulation and verification practice! 

  • Integrated Analog Systems D - Lecture 13S CAD (Bootstrapped Sampling Switch)
    https://www.youtube.com/watch?v=VSDzmijax3c
  • Integrated Analog Systems D - Lecture 14S CAD (Linearity and FFT)
    https://www.youtube.com/watch?v=qwJ_tlZTaq8
  • Integrated Analog Systems D - Lecture 15S CAD (Transient Noise and VerilogA Modeling)
    https://www.youtube.com/watch?v=YW2nnI3DD_c
  • Integrated Analog Systems D - Lecture 16S CAD (ADC ENOB Verification)
    https://www.youtube.com/watch?v=BIFXidfTYxE
Visit also webpage: https://kwantaekim.github.io

May 21, 2026

[PDF Book] FreeCAD Manual

 

FreeCAD Manual - PDF Book by Yorik Van Harve
The Savvy Engineer Academy
May 9, 2026

Reading the FreeCAD Manual is one of the best ways to build a strong foundation in FreeCAD and improve your overall design skills. While video tutorials and quick guides can help with basic tasks, a complete manual provides structured knowledge that helps you understand the software more deeply and use it more effectively.

For students, hobbyists, and future engineers, the manual provides a solid learning path that supports long-term growth. Since FreeCAD is widely used for 3D printing, mechanical design, and open-source engineering projects, mastering it can also open new opportunities for creativity and technical development.

Overall, reading the FreeCAD Manual gives you the knowledge, efficiency, and confidence needed to create professional-quality designs successfully. CLICK HERE to Download this Book!

May 19, 2026

[QEMU 11.0] Brings New RISC-V Extensions, Fixes

QEMU 11.0 Brings New RISC-V Extensions and Fixes

The latest release of the QEMU emulator, version 11.0, is out and brings with it support for the RISC-V Zilsd, Zclsd, Zalasr, and Smpmpmt extensions, plus various compatibility and security fixes.

“We’d like to announce the availability of the QEMU 11.0.0 release. This release contains 2500+ commits from 237 authors,” the project maintainers write of the new release. “Thank you to everybody who contributed to this release, whether that was by writing code, reporting bugs, improving documentation, testing, or providing the project with CI resources. We couldn’t do these without you!”

The latest QEMU release brings with it support for four new extensions to the free and open RISC-V instruction set architecture: Zilsd and Zclsd, RV32-exclusive extensions to add register pair load and store instructions by reusing existing RV64-only instruction encodings; Zalasr, an atomic load-acquire store-release extension; and Smpmpmt, which provides a memory attribute control mechanism analogous to the RV64-only Rvpmt using PMP registers.

The full changelog is available on the QEMU wiki; releases are available on the project website, with full source code available on GitLab under the reciprocal GNU General Public Licence 2 or later.

Copyright © 2026 The Free and Open Source Silicon Foundation C.I.C., All rights reserved.
 
The Free and Open Source Silicon Foundation C.I.C.
Unit C5 Tenterfields Business Park
Halifax, HX2 6EQ
United Kingdom

May 15, 2026

[paper] FDSOI Based Cryogenic Circuit

Tapas Dutta, Fikru Adamu-Lema, Djamel Bensouiah, German Cherstvov, Plamen Asenov,
and Asen Asenov
FDSOI Based Cryogenic Circuit Performance Enhancement 
Using Back Biasing and Threshold Voltage Engineering
IEEE Journal of the Electron Devices Society (2026)
DOI 10.1109/JEDS.2026.3691285

Device  Modelling  Group,  University of Glasgow, UK
Pramana  Modelling  Labs,  Glasgow, UK
School of  Engineering,  University of Glasgow, UK
Semiwise  Ltd.,  Glasgow, UK
Synopsys,  Glasgow, UK

Abstract : In this work, we use predictive cryogenic spice based compact models derived using a process design kit re-centering approach for 22 nm FDSOI technology to analyze the impact of back-gate biasing on circuit performance. We focus on analysis of power-delay trade-offs while varying the supply voltage at room and cryogenic temperature (4K). We show that back-biasing is necessary to mitigate the effects of the higher threshold voltages observed at cryogenic temperature. We further show that simple “threshold voltage engineering” has the potential to provide much better performance, compared to room temperature.
Fig : IDS −VGS characteristics for different VBG going to much higher values 
than the previous sections (without applying anyVth shift).

Acknowledgement : We are grateful to GlobalFoundries for providing the 22FDX PDK and allowing us to customize it for cryogenic temperature operation. The device measurements were performed by Incize SRL, Belgium. This work was supported partially by Innovate UK funded project “Development of Cryo-CMOS to enable the next generation of scalable quantum computers” under the grant number of 10006017 and was also partially supported by Semiwise Ltd, UK.

May 13, 2026

[VACASK] device-level transient noise analysis

VACASK, a free and open-source analog circuit simulator, now does device-level transient noise analysis. As far as I know, this is a first among FOSS circuit simulators. Ngspice has had source-based transient noise for a while, but the user has to wire noise sources into the circuit by hand. In VACASK, every resistor, diode, and transistor contributes its own white (thermal and shot) and flicker (1/f) noise automatically during the transient run, the way Spectre and other commercial RF simulators do it.

Why it matters: this lets you actually see how noise shapes the behavior of oscillators, PLLs, mixers, and sampling circuits in the time domain, not just as an abstract spectral quantity.

Quick demo on an LC oscillator at fosc=245kHz:
Top: power spectral density of the output
Middle: single-sideband phase noise (SSB PSD)
Bottom: phase jitter accumulating over time

Having this in a FOSS tool opens the door for students, hobbyists, and researchers to run the same analyses that were previously gated behind five and six-figure licenses.

Árpád Bűrmen, the lead VACASK developer, would love to hear from anyone working on analog/RF simulation. 
What would you put it through first?
https://codeberg.org/arpadbuermen/VACASK

#OpenSource #AnalogDesign #CircuitSimulation #RFDesign #EDA


May 12, 2026

[seminar] OpenPDK - Global Scholar Platform

Radiofrequency, Microwave and Millimetre-Wave Lab (mmiRF)
ETSI Telecomunicación,  Universidad de Málaga, Andalusia
Wednesday, May 27th, at 12:00


The mmiRF Lab is pleased to invite you to our upcoming hybrid seminar, which will be available both in person and online:
  • OpenPDK - Global Scholar Platform
  • Wednesday, May 27th, at 12:00
  • mmiRF Lab, ETSI Telecomunicación, Universidad de Málaga
  • Join the meeting online (MS Teams)
The semiconductor industry is evolving. The emergence of OpenPDKs is creating a new platform for global collaboration and education. The seminar will explore:
  • The role of FOSS CAD/EDA tools in building a global talent ecosystem.
  • OpenPDK initiatives from SkyWater, GF, and IHP (the first in Europe).
  • Complete open IC design flows: Xschem, ngspice, Xyce, Magic, kLayout, and more.
  • Hands-on examples of analog, RF, and digital IC design
Don't miss this chance to learn from a leading expert in the field and explore the tools shaping the future of microelectronics! 

#mmiRF #OpenPDK #Semiconductors #ICDesign #FOSS #EDA #Microelectronics #Innovation #UMA #STEM #MOS-AK

Speaker Bio: Wladek Grabinski received his Ph.D. from the ITE Warsaw, in 1991. He worked at ETHZ on CMOS/BiCMOS characterization and at EPFL on compact EKV model development, later serving as a technical staff engineer at Motorola/FSL in Geneva. He is now a consultant specializing in OpenPDK, coordinating SPICE modeling, device characterization, and parameter extraction for analog/RF IC design, with particular interests in high-frequency measurement, compact modeling and its Verilog-A standardization. He co-edited the book Transistor Level Modeling for Analog/RF IC Design, contributed to the Compact/SPICE Modeling Chapter of the Springer Handbook of Semiconductor Devices, and authored 70+ papers. Furthermore, he also contributes to IEEE EDS, LAEDC, ESSDERC, and MIXDES and manages the MOS-AK association since 1999.

May 10, 2026

Seeing Transistor Scaling Up Close

 And What “tiny” Really Means - Comparing Modern Chips to the Machines of Life
BEHIND THE CHIP: Apr 17, 2026
<https://behindthechip.substack.com/p/seeing-transistor-scaling-up-close>

[repost] Modern transistors have gate lengths of around 8 nm. To put that in perspective: a red blood cell is 10,000 nm wide. A DNA strand is just 2 nm, and a transistor is sitting right between those two scales. We are literally engineering at the edge of atomic limits, silicon atoms themselves are only 0.2 nm wide.

That foundational brick of modern electronics keeps shrinking year after year, driven by companies like TSMC, Intel, Samsung, and ASML pushing the boundaries of what is physically possible.

Billions of these switches/transistors, smaller than a virus, packed into a chip you can hold between two fingers. That is what powers every microcontroller, every processor, every smart device you touch today.

May 6, 2026

Revolution EDA Mistral AI Experiments

Revolution EDA MistralAI Experiments

There was a recent article by Prof Razavi, where the problems of Large Language Models in identifying various analogue integrated circuit blocks were recounted.

Revolution EDA uses structured JSON data format to store design files. JSON also happens to be very easy for LLMs to parse and understand. In fact, Mistral AI has a JSON mode. Mistral AI is the latest addition to the growing number of LLMs that Revolution EDA is able to use.

We did ask a few questions to Mistral AI to test its understanding of designs in Revolution EDA and its potential to help designers. The results have been very encouraging. The future analogue integrated circuit designers will be able to use large language models like Mistral AI to quickly gain understanding of a circuit and improve on it.

The transcription below is taken exactly from the interaction with Mistral AI except for small formatting changes [read more...]

2nd Semiconductor Device Frontier Summit


Date: May 18, 2026; Time: 10:00AM ~ 05:00PM
Ewha Womans University Student Culture Center (Small Theater B101)

The Semiconductor Device Research Group of the Society of Semiconductor Engineers has been holding this event since 2025 to strengthen human networks among domestic researchers and share the latest research trends.

This year's summit, now in its second year, invited top-notch speakers from various fields to provide a broad view of the latest technologies in industry and academia. It will be a place for meaningful academic exchanges to grasp the latest semiconductor technology trends as well as to share in-depth opinions on international market trends. This event is co-organized by the Society of Semiconductor Engineers and the IEEE EDS Seoul Section Chapter and aims to become an international event representing the semiconductor device field in Korea in the future. We ask for your interest and participation so that the 'Semiconductor Device Frontier Summit', which will be the core pillar of the Korean researcher network, can become the cornerstone of the development of our semiconductor industry.

Pre-registration deadline: Until May 16, 2026 (Saturday)

Time Program
Opening Session
10:00 – 10:20 Welcome & Registration
10:20 – 10:30 Opening Remarks (Prof. Sung‑Jae Cho, Ewha Womans University)
Session 1 | Chair: Prof. Sung‑Jae Cho
10:30 – 11:15 Semiconductor Devices for the New Computing Era
Prof. Woo‑Young Choi, Seoul National University
11:15 – 12:00 Development Strategy for AI‑Oriented NAND Solutions
Prof. Ki‑Hwan Song, Yonsei University
12:00 – 13:30 Lunch
Session 2 | Chair: Prof. Myung‑Gon Kang
13:30 – 14:15 Trends and Outlook of eNVM Technology
Visiting Prof. Yong‑Gyu Lee, Seoul National University
14:15 – 15:00 Memcapacitor Technology for Charge‑Domain PIM Implementation
Prof. Tae‑Hyun Kim, Seoul National University of Science and Technology
15:00 – 15:10 Coffee Break
Session 3 | Chair: Prof. Il‑Hwan Cho
15:10 – 15:55 Atomically Thin 2D Semiconductor Electronics toward Beyond‑CMOS Technology
Prof. Chul‑Ho Lee, Seoul National University
15:55 – 16:40 Orders‑of‑Magnitude Faster TCAD Device Simulation of GAA MOSFETs without Additional Computational Training Cost
Prof. Sung‑Min Hong, GIST
16:40 – 17:00 Closing Ceremony | Prof. Il‑Hwan Cho, Myongji University

May 3, 2026

[chapter] Modeling of the MOSFETs

Jean-Marc Dienot, “A Review on Analytical and Electrical Modeling of the MOSFET Transistor”
Chapter 2 in "Field-Effect Transistors – Fundamentals, Technologies, and Future Applications"
Editor: Kenan Cicek
DOI: 10.5772/intechopen.1009040

ABSTRACT: Power semiconductor MOSFET and other MOS-controlled devices benefit from material and technology improvements to respond to high-level power features, high voltage, high current density, short switching times, and thermal constants, which optimize energy efficiency. These enhanced characteristics induce more electromagnetic noises and temperature-management constraints for the deployment of this technology. We describe synthetically modeling theory and technic, from basic-to-advanced, to derive predictive simulations for the power MOSFET challenging issues. Analytical and electrical circuit model of the MOSFET elementary cell at semiconductor level, time-domain simulation. Distributed and propagative model, including device packaging and power-printed circuit board (PPCB) PEEC and 3D model levels, signal integrity simulation, common mode emission simulation, and radiated field simulation. Electro-thermal model with thermal propagative network model coupled with electrical model at circuit level, time multi-domain simulation. Case studies on Power PCB with MOSFET Si et SiC illustrate modeling procedures.

FIG: Overeview of analytical equations of the MOSFETs
 


Apr 29, 2026

[Newsletter] Revolution EDA April 2026

Revolution EDA has two updates to share this month: 
  • a browser-based cloud trial environment is now live, and 
  • hierarchical Layout vs Schematic (LVS) verification has been added to the platform
Cloud Trial Environment

Apr 27, 2026

[paper] Open-Source SkyWater 130 nm MOSFETs at 77K

F. Beall1, A. Rimal1, O. Seidel1, Y. Mei1, A. D. McDonald3, I. Parmaksiz5,1 V. A. Chirayath1, J. Asaadi1, D. Braga2, J. B. R. Battat4
DC Cryogenic Modeling of Open-Source SkyWater 130 nm MOSFETs at 77K Using BSIM4
arXiv:2604.21625v1 [cond-mat.mes-hall] 23 Apr 2026

1 The University of Texas at Arlington, Physics Department, Arlington, TX 76019, USA
2 Fermi National Accelerator Laboratory, Microelectronics Department, Batavia, IL 60510, USA
3 Instrumentation Frontier Scientific, Arlington, TX 76019, USA
4 Wellesley College, Physics and Astronomy Department, Wellesley, MA 02481, USA
5 Rice University, Physics Department, Houston, TX 77005, USA


Abstract: Cryogenic applications in high-energy physics (HEP) demand reliable, low-power CMOS electronics capable of operating at liquid nitrogen temperatures (77K). The open-source SkyWater 130nm (SKY130) CMOS process has previously been shown to operate at temperatures as low as 4K making it a promising candidate for HEP applications. In this work, we characterize and model SKY130 low-threshold voltage transistors at 77K, which is a temperature commonly used in modeling applications for liquid argon detectors. DC characteristic measurements were performed at both room temperature and liquid nitrogen temperature. We created a cryogenic modeling approach to produce a SPICE-compatible, isothermal BSIM4-based model for select transistor sizes at 77K. The resulting model agrees with data at 77K with an average error on the order of 20% (relative RMS) and shows no dependence on drain voltage. Due to the open-source nature of SKY130, we have made our models publicly available on Github. We hope this work will continue the trend for democratizing circuit design at cryogenic temperatures in high-energy physics by enabling open access to accurate cryogenic CMOS device models at 77K.

Fig: Hardware setup used for I-V measurements: (a) Schematic of the I-V measurement
system (b) Wirebonded SKY130 chip mounted on PCB

Acknowledgments: The authors would like to thank various engineers in the microelectronics department at FNAL for their guidance and assistance on this project: Albert Dyer for help operating the cryo-cooler, and Louis Dal Monte and Pamela Klabbers for PCB design. The authors would also like to extend gratitude to Andy Pender from Synopsys for assistance with the modeling software, Mystic™. This material is also based upon work supported by U.S. Department of Energy, Office of Science, Office of High Energy Physics under Award Number DE-SC0022296 and DE-SC00253485 as well as support from the University of Texas at Arlington’s Center for Advanced Detector Technologies.

Apr 25, 2026

[paper] Multi-Agent Self-Evolved ABC

Cunxi Yu and Haoxing Ren
Autonomous Evolution of EDA Tools: Multi-Agent Self-Evolved ABC
In 63rd ACM/IEEE Design Automation Conference (DAC ’26)
July 26–29, 2026, Long Beach, CA
DOI: 10.1145/3770743.3804221

Abstract: This paper introduces the first self-evolving logic synthesis framework, which leverages Large Language Model (LLM) agents to autonomously improve the source code of ABC, the widely adopted logic synthesis system. Our framework operates on the entire integrated ABC codebase, and the output repository preserves its single-binary execution model and command interface. In the initial evolution cycle, we bootstrap the system using existing prior open-source synthesis components, covering flow tuning, logic minimization, and technology mapping, but without manually injecting new heuristics. On top of this foundation, a team of LLM-based agents iteratively rewrites and evolves specific sub-components of ABC following our “programming guidance“ prompts under a unified correctness and QoR-driven evaluation loop. Each evolution cycle proposes code modifications, compiles the integrated binary, validates correctness, and evaluates quality-of-results (QoR) on multi-suite benchmarks including ISCAS 85/89/99, VTR, EPFL, and IWLS 2005. Through continuous feedback, the system discovers optimizations beyond human-designed heuristics, effectively learning new synthesis strategies that enhance QoR. We detail the architecture of this self-improving system, its integration with ABC, and results demonstrating that the framework can autonomously and progressively improve EDA tool at full million-line scale.
Fig: Overview of the multi-agent self-evolving framework for ABC. Specialized LLM agents evolve distinct subsystems (flow optimization, core algorithms, and mapping), with each iteration undergoing compilation, formal CEC verification, and full QoR evaluation. A planning agent coordinates global decisions, a coding agent implements edits, and all agents follow a shared rulebase and unified evaluation pipeline to enable coordinated, correctness-preserving improvements.


Acknowledgment: The authors would like to thank Prof. Zhiru Zhang and his students for their valuable feedback and insightful discussions.

Apr 23, 2026

May 2026 Event "ISHI Kai 3rd Anniversary Event

May 2026 Event ISHI Kai 3rd Anniversary Event 
Gift to Students, Newcomers, and Semiconductor Beginners!
Tokyo Venue
image.png
Contents
The ISHI Association has finally celebrated its third anniversary!
This time, we have collected content for students, newcomers, and semiconductor beginners. What should university teachers and those who have done open source semiconductors do to step up for students and newcomers? And what means are there? This time, there are also on-site participation slots in Tokyo and Fukuoka, so please join us. This is only available for applications for the Tokyo venue.

Click here to apply for the Fukuoka venue >> https://ishikai.connpass.com/event/381975/

The activity is done on Discord. We hope you will join us!
(If it is disabled, please contact Noritsuna Atmark ishi-kai.org
https://discord.gg/Sj47dJk8x7

Participation fee >> Free

Apr 20, 2026

[papers] Charge-Based MOSFET Compact Models with ACM-2

IEEE 17th Latin America Symposium on Circuits and System 
LASCAS, Arequipa, Peru
24-27 February 2026

[1] R. Fiorelli, M. Miguez and J. Núñez, "Exploring Charge-Based Mosfet Compact Models with ACM-2 as a Design-Oriented Paradigm," 2026 IEEE 17th Latin America Symposium on Circuits and System (LASCAS), Arequipa, Peru, 2026, pp. 1-5, doi: 10.1109/LASCAS67804.2026.11457086.
Abstract: Charge-based MOSFET compact models provide a physically consistent framework to describe transistor charges and capacitances across operating regimes. Unlike current-based approaches, they enforce charge conservation and yield reliable predictions of dynamic and RF behavior. This paper reviews the main charge-based formulations, ranging from industrial standards (BSIM, PSP, HiSIM) to academic compact models such as EKV and the recent ACM-2 five-parameter approach. We contrast their philosophies, complexity, and accuracy, highlighting the trade-offs between highly parameterized industrial models and compact analytical formulations oriented to design and education. Representative applications in analog/RF design, digital timing and power estimation are discussed. Particular attention is given to the lightweight ACM-2 model as a paradigmatic example of simplicity and analytical clarity. We conclude by outlining current challenges-advanced device architectures, quantum effects, and automated parameter extraction-and perspectives for future compact modeling in deeply scaled technologies.

[2] C. A. Dobrin, D. G. A. Neto, D. Gaidioz, P. Cathelin, S. Bourdel and M. J. Barragan, "RF Design-Oriented ACM Model Generation Using Parametric Test and Machine Learning Regression in 28nm FD-SOI CMOS Technology," 2026 IEEE 17th Latin America Symposium on Circuits and System (LASCAS), Arequipa, Peru, 2026, pp. 1-5, doi: 10.1109/LASCAS67804.2026.11457152.
Abstract: This paper presents a methodology for extracting design-oriented MOS transistor models from wafer-level parametric test (PT) data, enabling accurate post-fabrication circuit characterization that inherently accounts for process variability. Leveraging an advanced compact MOSFET (ACM) model, the approach employs a neural network regressor to predict critical RF transistor parameters, including DC characteristics, parasitic capacitances, and excess noise factor, from standard PT measurements routinely collected during production. The regressed parameters are gathered into a Verilog-A component that faithfully represents the electrical behavior of fabricated transistors, facilitating variability-aware simulation and performance analysis of RF integrated circuits without requiring additional test structures or any measurement overhead. Validation on 28 nm FD-SOI technology shows high prediction accuracy for NMOS devices, confirming the effectiveness of the methodology as a tool for supporting post-fabrication circuit simulations and process variability management.

[3] D. G. A. Neto, M. C. Schneider, M. J. Barragan, S. Bourdel and C. Galup-Montoro, "Benchmarking the Symmetry of MOSFET Compact Models with Emphasis on ACM2," 2026 IEEE 17th Latin America Symposium on Circuits and System (LASCAS), Arequipa, Peru, 2026, pp. 1-5, doi: 10.1109/LASCAS67804.2026.11457119.
Abstract: The symmetrically built MOS transistors of integrated circuits exhibit symmetric electrical behavior if the source and drain terminals are interchanged. Additionally, a series association of transistors is electrically “equivalent” to a single transistor. However, some of the compact MOSFET models do not comply with the requirements of symmetry and transistor equivalence. This paper reports tests of symmetry and of series association of transistors of some compact models available in circuit simulators. We show that the ACM2, a chargebased model in which the terminal voltages are referred to the substrate, is fully compliant with the transistor symmetry, but that some popular models are not. To test the symmetry property, we show examples of transistor current-voltage characteristics and derivatives up to the fifth order, and capacitance-voltage characteristics, all tests around  VDS=0 . A MOSFET binary current divider is employed to test the consistency of the model applied to a series association of transistors.

Apr 19, 2026

[paper] ATMAD: Compact Modeling with Parameter Extraction

Yuhang Zhang, Qing Zhang, Yang Shen, Bingyi Ye, Xiaojin Li, Yabin Sun, Yanling Shi, Yong‑Fu Li
ATMAD: Agile Transistor Compact Modeling with Parameter Extraction 
Based on Automatic Differentiation
ACM 1084-4309/2026/04-ART103
DOI: 10.1145/3797484

1. School of Integrated Circuits, East China Normal University, Shanghai, China
2. Department of Micro‑Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
3. East China Normal University, Shanghai, China
4. Shanghai Jiao Tong University, Shanghai, China

Abstract: Compact models of transistors are essential for simulating and optimizing circuits with the use of SPICE simulation tool. Parameter extraction, which is calibrating these models, is essential to ensure their alignment with measured or simulated data. However, conventional parameter extraction methods are generally iterative and experience-dependent, requiring significant time and effort from modeling engineers. Moreover, as semiconductor devices and compact models become increasingly advanced, the need for a tailored extraction process for each model has become increasingly inefficient. To address the above challenges, this work proposes an agile transistor compact modeling framework, ATMAD. The proposed framework takes a compact model file and a set of electrical characteristic data as inputs, producing a calibrated model with minimal human intervention. ATMAD automatically retrieves the equations in the compact model and converts them into computational flow graphs, thus supporting different compact models with a generalized process. A graph unlooping technique is proposed to support automatic differentiation for compact models with implicit functions (e.g., series resistance and surface potential solving). Based on the computational flow graph, ATMAD adopts automatic differentiation technique to achieve automatic and parallel optimization of model parameters. The proposed ATMAD framework is validated on commonly-used compact models in academia and industry, showing its effectiveness for compact modeling for both 𝐼𝑉 and 𝐶𝑉 characteristics.

Fig. The overall flow of ATMAD framework

Acknowledgements: This work is supported in part by the Shanghai Explorer Program under Grant No. 25TS1410300 and 24TS1400200 and in part by the National Natural Science Foundation of China under Grants No. 62304133 and 62350610271.

Apr 18, 2026

[paper] CrOx/TiOy Memristive Devices

Phu-Quan Pham1,2, Ngoc-Lam Le Pham3,4, Thuy-Anh Tran1,2, Van-Son Dang4, Quang Nguyen2,5, Ngoc Kim Pham1,2, Thuat Tran Nguyen3,4
On-Pinched Hysteresis in CrOx/TiOy-based Memristive Devices: Modeling and Analysis
Appl. Phys. Lett. 128, 153502 (2026)
DOI: 10.1063/5.0332014

1 Faculty of Materials Science and Technology, University of Science, Vietnam National University – Ho Chi Minh City, Ho Chi Minh City, 72754, Vietnam
2 Vietnam National University – Ho Chi Minh City, Ho Chi Minh City, 71309, Vietnam
3 Semiconductor and Advanced Materials Institute, Technology and Innovation Park, Vietnam National University – Hanoi, Hoa Lac, Hanoi, 13151, Vietnam.
4 Faculty of Physics, University of Science, Vietnam National University – Hanoi, 334 Nguyen Trai, Thanh Xuan, Hanoi, 11406, Vietnam
5 Department of Physics, International University, Vietnam National University – Ho Chi Minh City, Ho Chi Minh City, 71309, Vietnam

Abstract: Transition-metal oxide memristors are promising for neuromorphic computing, yet most SPICE models overlook material-specific effects such as oxygen stoichiometry and non-pinched hysteresis. Here, we systematically study CrOx/TiOy memristors fabricated under controlled oxygen concentrations (10%–50%) and propose an improved SPICE-compatible model. The devices exhibit oxygen-dependent resistive switching, retention, and pulse-driven plasticity, with optimal performance at 40% oxygen. Our model explicitly reproduces the non-pinched hysteresis observed in I–V curves, consistent with behaviors such as ion immigration, charge trapping, and remnant polarization, and achieves close agreement with experiments across multiple stoichiometries. Validation includes endurance, retention, and synaptic functions such as long-term potentiation/depression and spike-number/amplitude-dependent plasticity. Finally, the model is extended from single devices to a 4 × 4 crossbar array, demonstrating its scalability for artificial neural network simulations. These results emphasize the critical role of oxygen stoichiometry in CrOx/TiOy memristors and introduce a modeling framework that bridges experimental device physics with circuit-level neuromorphic applications.

FIG
Fig. a. Fabricated single cell memristor devic and b. 4×4 crossbar array

Apr 17, 2026

[paper] Thermal Management SiGe HBT in ICs

Boulgheb, Abdelaaziz
"Enhanced thermal management of SiGe HBT integrated circuits 
using the Peltier effect and DBC metal tracks"
Microelectronics Reliability 174 (2025): 115896
DOI: 10.1016/j.microrel.2025.115896

1 Department of Electronics, University of Sciences and Technology Houari Boumediene, Bab Ezzouar 16111, Algeria.
2 Hyperfrequencies and Semiconductors Laboratory, Department of Electronics, Faculty of Sciences and Technology, University of Frères Mentouri Constantine 1, PO Box 25017, Constantine, Algeria.

Abstract: Effective thermal management remains a major challenge for SiGe heterojunction bipolar transistor (HBT) integrated circuits, particularly in BiCMOS9MW 0.13µm technology. This study proposes a novel two-stage heat dissipation strategy that combines active thermoelectric cooling with passive DBC-based conduction an approach not previously explored in this context to address this issue. First, the Peltier effect is leveraged in combination with conventional plastic packaging to regulate circuit thermal performance. Second, Direct Bonded Copper (DBC) metal tracks are implemented to establish an efficient thermal pathway between the internal circuit and external heat sinks. Experimental results indicate that standard plastic packaging alone results in excessive heating (Tmax = 467 K). The incorporation of the Peltier effect significantly reduces the peak temperature to 380 K, while the addition of DBC tracks further enhances cooling, lowering the temperature to 340 K. Unlike traditional cooling solutions that rely solely on packaging or external heatsinks, our method enables localized, controllable heat extraction directly at the chip level, ensuring better thermal regulation and improved electrical performance. This dual approach not only mitigates self-heating but also leads to notable improvements in DC and RF performance. Specifically, the maximum current gain (βmax) increases from 1913 to 2183, and the transit frequency (ft) rises from 265 GHz to 285.6 GHz. These findings underscore the effectiveness of the combined Peltier-based cooling and DBC thermal management in enabling next-generation high-frequency applications.

Fig. a) SiGe HBT device structure simulated with COMSOL, showing the log of electron and hole concentrations. b) SEM cross-sectional view of the SiGe HBT.


Apr 16, 2026

Lin Fujian Optoelectronic Device Modeling Laboratory

Yangtze River Delta Integrated Circuit Industrial Application Technology Innovation Center
Jiangsu Jicui Integrated Circuit Application Technology Innovation Center
Lin Fujian Optoelectronic Device Modeling Laboratory


Optoelectronic Device Modeling Laboratory Services
  • SPICE model development, characterization, and parameter extraction for silicon photonic waveguides and micro modulators and optical splitters/combiners
  • Compact modeling, characterization, and parameter extraction for other advanced photonic devices
  • GaN device characterization, EEHemt, ASM model and Angelov models
  • InP‑HEMT device characterization, EEHemt model
  • SiGe HBT device characterization, SPG/VBIC/HICUM model
  • Characterization of micro‑/nano‑devices, internal/external parameter consistency studies, and high‑quality enhancement of existing models
  • Ultra‑wideband SPICE models for electrical interconnects, packaging, and passive components
  • Modeling of 1/f noise, noise parameters, avalanche effects, self‑heating, channel temperature, and related physical effects
  • CNAS‑certified testing and final acceptance testing for major projects
  • Other practical modeling services based on customer requirements
Laboratory Contact Information
联系人:小葛,18334212431,邮箱:gemy@jitric.cn
地址:无锡市锡山区凤威路与春江东路交叉口,长三角工业芯谷 A 栋 4 楼
定位:轻资产、高专业、全流程建模验证平台
合作模式:仪器有偿使用、可靠提参、技术赋能

Apr 15, 2026

[MEAD] Low-Power Analog IC Design


MEAD Education
June 22-26, 2026
Registration deadline: May 22, 2026
Payment deadline: June 12, 2026

MONDAY, June 22

8:30-12:00 amMOS Transistor Modeling for Low-Voltage and Low-Power Circuit DesignChristian Enz
1:30-5:00 pmDesign of Low-Power Analog Circuits using the Inversion CoefficientChristian Enz

TUESDAY, June 23

8:30-10:00 amNoise Performance of Elementary CircuitsBoris Murmann
10:30-12:00 amNoise Performance of Filters, Feedback & SC CircuitsBoris Murmann
1:30-3:00 pmOpamp Topologies and Design: Single-Stage CircuitsBoris Murmann
3:30-5:00 pmOpamp Topologies: Cascoded and Two-Stage CircuitsBoris Murmann
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