Oct 17, 2026

[paper] ACM3 Compact MOSFET Model

Deni Germano Alves Neto; Márcio Cherem Schneider; Manuel J. Barragan; 
Sylvain Bourdel; Carlos Galup-Montoro,
ACM3 - An Advanced Compact MOSFET Model for Analog IC Design and Simulation
in IEEE Access, DOI: 10.1109/ACCESS.2026.3742180

1.) Federal University of Santa Catarina, 88040-900 Florianópolis (BR)
2.) Univ. Grenoble Alpes, CNRS, Grenoble INP, TIMA F-38000 Grenoble (F)

Abstract: This paper presents ACM3, an advanced compact MOSFET model that extends the designoriented ACM2 formulation by introducing gate-voltage dependencies for the slope factor n, the draininduced barrier lowering (DIBL) coefficient σ, and inversion charge dependence for the specific current IS. ACM3 preserves a single-piece, charge-based description of the drain current, valid from weak to strong inversion and from the linear to the saturation regions, while relying on an efficient analytical approximation of the Lambert W -function suitable for Verilog-A implementation. A robust yet straightforward parameterextraction flow is proposed, in which all eight DC parameters (VT 0, IS0, Φ, γ, θ, σWI , σSI and ζ) are obtained directly from ID–VGB and ID–VDS curves through a differential evolution (DE) algorithm that minimizes the root-mean-square percentage error between the reference and the modeled drain current. A distinctive feature of this flow is that the reference curves may originate either from silicon measurements or from another compact model, making the extraction equally applicable to measured and simulated data. At the device level, the parameters are extracted from silicon measurements of an open-source 130 nm BiCMOS technology, yielding agreement with the measured data for both short- and long-channel transistors across all regions of operation. At the circuit level, ACM3 is validated through simulations of a common-source amplifier, a self-biased current source, and a CMOS latch in a 180 nm CMOS technology, where the ACM3 parameters are extracted from BSIM4-generated characteristics and the results are compared against the foundry BSIM4 model. Representative process, voltage, and temperature (PVT) robustness is also evaluated against BSIM4. The ACM3 model has been implemented in Verilog-A and integrated into open-source circuit simulators, via OpenVAF, enabling accurate and intuitive analog IC design within fully open design flows.

TAB: Comparison of ACM3 with representative industrial 
and design-oriented compact MOSFET models

Aknowlegements: This study was financed in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior, (BRAZIL), Conselho Nacional de Desenvolvimento Científico e Tecnológico, (BRAZIL), and TIMA laboratory, Grenoble (FRANCE).

Oct 15, 2026

eSim 2.6 Release

A Big Milestone for FOSSEE eSim - eSim 2.6 IS HERE!


The release of eSim 2.6 is bringing exciting improvements, enhanced workflows, and new capabilities to our open-source Electronic Design Automation (EDA) tool developed by the FOSSEE Project, IIT Bombay.

Download eSim 2.6: https://esim.fossee.in/downloads
Explore eSim 2.6 Release Notes: https://github.com/FOSSEE/eSim/releases/tag/v2.6

What's New in eSim 2.6?
  • Refreshed User Interface
  • Enhanced Simulation and Waveform Analysis
  • Improved HDL Workflows and Icarus Verilog Support
  • Compatibility with Newer KiCad Versions
  • IHP OpenPDK Support
  • Native Windows Installer
  • Reduced Installer Size
  • OpenROAD Integration (Work in Progress)
Celebrating the Team Behind the Release:

A special shout-out to Varadha RS, Akshat Sharma, and more than 100 hardworking interns for their dedication and contributions to eSim 2.6. From implementing new features and resolving issues to testing workflows and improving usability, their efforts have helped bring this release to life.

A heartfelt thank you to all eSim and FOSSEE team members for their invaluable contributions, technical expertise, guidance, and continued support. Every contribution matter, and milestones like this are the result of collaboration, persistence, and teamwork.
Acknowledging Our Supporters

Our sincere gratitude goes to the FOSSEE Project, Indian Institute of Technology Bombay, National Mission on Education Through ICT (NMEICT), and the Ministry of Education, Government of India, New Delhi, for their continued support in advancing open-source engineering tools and education.
Building the Future of Open-Source EDA

At FOSSEE, IIT Bombay, we are committed to making circuit design, simulation, PCB design, and semiconductor design more accessible through open-source technologies.

Thank you to everyone who has been part of this journey. Special thanks to our collaborators and the wider open-source community:
  • Wladek Grabinski, 
  • Steve Hoover, 
  • Indira Iyer Almeida
  • OpenPDK IHP - Leibniz Institute for High-Performance Microelectronics
  • The OpenROAD Project

Oct 13, 2026

[paper] Self-Heating Effects in 55-nm SiGe HBTs

Abdelaaziz Boulgheb1, Billel Smaani2, Taha Housseyn Nouibat1
Physics-Based Electro-Thermal Modeling and Analysis 
of Self-Heating Effects in 55-nm SiGe HBTs
physica status solidi (a), 2026; 223:e70563 
https://doi.org/10.1002/pssa.70563

1. USTHB, Bab Ezzouar, Algeria 
2. University of Mila, Mila, Algeria

Abstract: This work investigates spatially resolved electrothermal behavior in scaled SiGe HBTs under self-heating conditions, emphasizing its impact on temperature distribution and RF performance. Unlike conventional lumped thermal resistance approaches assum- ing uniform temperature rise, the present analysis resolves the internal temperature field to capture nonuniform heat propagation effects. A physics-based electrothermal framework combining drift–diffusion transport, temperature-dependent semiconductor properties, and heat conduction equations is used to study hotspot formation and thermal confinement in a 55 nm SiGe HBT structure. Three operating conditions are considered: nominal operation at 300 K, self-heating at 300 K ambient temperature, and elevated ambient temperature of 320 K. The results reveal localized hotspot formation near the base–collector junction due to current crowding and geometrical confinement, leading to RF performance degradation. The cutoff frequency decreases from 320 to 285 GHz, while the maximum oscillation frequency reduces from 486 to 458.5 GHz. The current gain decreases from 2000 to 1500, and the maximum junction temperature reaches 417 K under the highest thermal stress condition. These findings highlight the importance of spatial thermal effects in governing RF limitations of SiGe HBTs and provide insight into the coupling between heat propagation and electrical performance in BiCMOS technologies.
FIG: Device structure of 55 nm SiGe HBT simulated with multiphysics TCAD: (a) log of electron and hole concentration highlighting emitter/base/SIC pedestal (b) TEM cross section of a fabricated BiCMOS 55nm HBT. Impact of self-heating on high-frequency performance of the 55-nm SiGe HBT under three thermal conditions: (c) parasitic delay parasitic (d) forward transit time τF , (e) cutoff frequency fT, and (f) maximum oscillation frequency fmax.

Oct 12, 2026

[paper] BSIM4 CryoModel-4K

Mohammed Saleh Alshaikh
CryoModel-4K: physics-based BSIM4 extension for28 nm bulk CMOS compact modeling at 4K
Nature Scientific Reports (Article in Press) DOI: 10.1038/s41598-026-69962-w

* Device Simulation Laboratory, Department of Electrical Engineering, College of Engineering and Architecture, Umm Al-Qura University, Makkah (SA)

Abstract: Accurate compact transistor models for 28nm bulk CMOS at cryogenic temperatures are essential for reli-able quantum computing interface circuit design. Existing room-temperature BSIM4 models fail to capture carrier mobility freeze-out, subthreshold swing saturation, current kink effects, and threshold voltage shifts at 4K. These failures produce post-fabrication performance deviations exceeding 300% in cryo-CMOS circuits designed using room-temperature models. This paper presents CryoModel-4K, a physics-based compact model that extends BSIM4 to accurately capture 28nm bulk CMOS behavior from 300 to 4K through three integrated correction modules. The Phonon Freeze-Out Mobility Enhancement Module (PFMEM) models the 3 to 8× car-rier mobility enhancement at liquid helium temperatures through a Matthiessen’s-rule combination of phonon, impurity, and surface roughness scattering. It is validated against published 4 K Hall effect measurements. The Cryogenic Subthreshold Swing Saturation Model (CSSM) replaces the classical kT/q thermal voltage with aband-tail tunneling-corrected expression. It accurately reproduces the observed 15 to 25 mV/dec subthreshold swing plateau below 30K. The Impurity Band Transport Kink Model (IBTK) captures the characteristic drain current kink arising from impact ionization triggered floating body effects in the partially frozen bulk substrate. Validation against published wafer-level characterization data for TSMC 28 nm bulk CMOS spanning 300 to 4K across 380 devices on three wafer splits demonstrates less than 5% RMS prediction error for all DC char-acteristics and less than 8% for RF S-parameters up to 10 GHz. Ring oscillator frequency is predicted within6.2% of measured values at 4K, compared to 312.5% error for standard BSIM4. The total SPICE simulation overhead relative to standard BSIM4 is approximately 25%.

FIG: a) Fig. 5 Complete small-signal equivalent circuit of CryoModel-4K for RF simulation, showing the intrinsic MOSFET withPFMEM-modified transconductance, CSSM-corrected output conductance, IBTK kink current source, temperature-depen-dent gate and substrate resistances, and parasitic interconnect elements. Small-signal equivalent circuit valid for operation from 100 MHz to 10 GHz at temperatures from 300 to 4 K. All substrate network elements are temperature-dependent 
b) Output characteristics (𝐼𝐷𝑉D) of a 28 nm NMOS device at 4 K for multiple 𝑉𝐺 values: measured data (symbols) ,CryoModel-4K with IBTK (solid lines), and BSIM4 without kink correction (dashed lines). Device: NMOS Lg = 28 nm, W =  um at T = 4K. VGS stepped from Vth to Vth + 0.5V in 0.1V increments. VDS swept from 0 V to 1.0 V in 25 mV steps. The IBTK captures the characteristic current kink at 𝑉𝐷≈0.5–0.7V

Acknowledgements: The author extends his sincere gratitude to the Umm Al-Qura University, for the invaluable resources and sup-portive environment that made this research possible.

Open Access: This article is licensed under a Creative Commons Attribution 4.0 International License

APCI Program: SBMicro Projects

APCI Program
Support for SBMicro Integrated Circuit Projects



TAB: Universities Involved in IC Design and EDA/CAD Tool Development

University #Profs #PhDs #MSCs
CEFET-MG - Centro Federal de Educação Tecnológica de Minas Gerais803
CEFET-RJ - Federal Center for Technological Education Celso Suckow da Fonseca210
FEI - Centro Universitário da FEI203
FURG - Universidade Federal do Rio Grande311
IFSP - Instituto Federal de São Paulo500
ITA - Instituto Tecnológico de Aeronáutica1005
PUCRS - Pontifícia Universidade Católica do Rio Grande Do Sul8159
UCPEL - Universidade Católica de Pelotas306
UEA - Universidade do Estado do Amazonas100
UERGS - State University of Rio Grande do Sul500
UFABC - Federal University of ABC602
UFAM - Universidade Federal de Manaus440
UFBA - Universidade Federal da Bahia5138
UFC - Universidade Federal do Ceará353
UFERSA - Mossoró104
UFERSA - Pau dos Ferros513
UFG - Federal University of Goiás810
UFMG - Universidade Federal de Minas Gerais639
UFPB - Universidade Federal da Paraíba112
UFPEL - Universidade Federal de Pelotas13132
UFPR - Universidade Federal do Paraná725
UFRGS - Universidade Federal do Rio Grande do Sul173245
UFRJ - Federal University of Rio de Janeiro624
UFRN - Federal University of Rio Grande do Norte432
UFS - Universidade Federal do Sergipe301
UFSC - Universidade Federal de Santa Catarina111211
UFSM - Universidade Federal de Santa Maria805
UFV - Universidade Federal de Viçosa233
UNB - Universidade de Brasília939
UNESP - Universidade Estadual Paulista401
UNICAMP - Universidade Estadual de Campinas81621
UNIFEI - Universidade Federal de Itajubá723
UNIFEI - Itabira303
UNIPAMPA - Universidade Federal do Pampa402
UNISANTOS - Universidade Católica de Santos100
UNISINOS - Universidade do Vale do Rio dos Sinos303
UNIVALI - Universidade do Vale do Itajaí303
USP - Universidade de São Paulo8112
USP-EESC - Escola de Engenharia de São Carlos312
UTFPR - Universidade Tecnológica Federal do Paraná100

Oct 11, 2026

[OpenSUSI] First Tyepout

J. I. Okamura
New Semiconductor Design Programs with Japan’s Open Source Ecosystem
[Society News] in IEEE Solid-State Circuits Magazine, vol. 18, no. 3, pp. 87-88, Summer 2026, 
doi: 10.1109/MSSC.2026.3708432

Abstract: Open Source Utilized Silicon Initiatives (OpenSUSI), founded in April 2024 as a nonprofit organization, has been working closely with two Japanese legacy foundries to foster an open source silicon ecosystem in Japan. On 19 September 2025, TOKAI RIKA Co., Ltd., a 6-inch legacy foundry in Japan, announced the release of a non-disclosure-free process design kit (PDK) as an open source platform [1]. This new open source PDK, called TR-1um [2], was released via the OpenSUSI GitHub repository, and, since last October, we have been cleaning up and maintaining it alongside our collaborators.


Fig. First Tapeout application form on the OpenSUSI homepage.


Oct 10, 2026

[OpenPDK] GT2N

This the initial release for the GT2N PDK with 72 standard cells: <https://github.com/azadnaeemi/GT2N>.
It is based on 2nm GAAFET with BSPDN. All the device models are based on 3-stack nanosheets


Standard cell layouts can also be imported using the .gds file: GT2N/gds/gt2_6t_std_cells.gdsLVS and DRC rulesets for icvalidator are present in "GT2N/icv_runset".
Libraries are composed of 3 process corners (under development), 2 nanosheet width (W) flavors, and 5 threshold voltage (VT) flavors. (In the order of decreasing VT, HVT > SVT > LVT > ULVT > ELVT)

The collaterals required for synthesis and PnR are (depending on the process corner and W/VT flavor):
LIB: GT2N/lib/tt/gt2_6t_w31_lvt_tt_0p7v25c.lib
LEF: GT2N/lef/tt/gt2_6t_w31_lvt.lef
Techlef: GT2N/techlib/gt2_tech.lef
ICT: GT2N/qrc/GT2.ict
QRCTech: GT2N/qrc/GT2_qrc.tch
ITF: GT2N/nxtgrd/GT2.itf
NXTGRD: GT2N/nxtgrd/GT2.nxtgrd

The thermal-calibrated GAAFET (3-stack nanosheet) model card is (depending on the process corner and W/VT flavor):
GT2N/device/tt/gt2_w31_lvt_tt.sp

[ref] D. Jang, P. Kumar, M. N. H. Shazon, S. J. Ram, A. Svizhenko, V. Moroz, A. Ceyhan, N. A. Radhakrishn, and A. Naeemi, "GT2N: An Open-Source 2nm Nanosheet PDK Enabling Multi-Width/VT Benchmarking" in IEEE International Symposium on Circuits and Systems (ISCAS) 2026  








Oct 9, 2026

[ICTA2026 ] Special OpenPDK Session

IEEE International Conference on Integrated Circuits, Technologies & Applications
ICTA 2026 Special Session “OpenPDK - Global FOSS Scholar Platform"
21st - 24th (Wed - Sat) October 2026
Grand Copthorne Waterfront Hotel, Singapore


The OpenPDK initiative delivers a global FOSS Scholar Platform supporting analog/RF, mixed‑signal, and digital IC design. Central to this effort are accurate SPICE models for low‑power sensing MOSFETs, RF HBTs, and emerging RRAM devices, validated across cryogenic temperatures for space and quantum‑computing applications. The initiative also advances Verilog‑A compact‑model standardization, ensuring result reproducibility and seamless integration into open‑source design flows. Supported by the EU Chips JU, OpenPDK fosters collaboration among academia, startups, and industry, while providing FOSS IC‑design tools covering schematic capture, simulation, layout, and verification up to tape‑out. Similar to the EU Chips JU program, Zhejiang CoreXin in China offers an open‑source PDK together with tape‑out services for its 55nm CMOS process. To accelerate the semiconductor‑industry development across the Asia‑Pacific and Southeast‑Asia regions, semiconductor model development and parameter extraction techniques should be pursued in a more focused manner. This special session brings together experts to present and discuss advances in device characterization, compact modeling, simulation methodologies, and validation techniques for a broad range of solid‑state devices, including Si, III/V semiconductors, power devices, nanoscale structures, and emerging 2.5D/3D advanced packaging technologies [ read more...]

ICTA 2026 Special OpenPDK Session Presenters
  • SPICE/Verilog-A standard models and OpenPDK practice
    Wladek Grabinski, GMC Consulting, Switzerland
  • Open-Source Ecosystem Updates and Semiconductor Design Development Programs in Japan
    Jun-ichi Okamura, AIST Solutions, OpenSUSI, Japan
  • Open-Source EDA Meets Industrial IC Design
    Ehrenfried Seebacher, ams-OSRAM AG, Austria
  • Building an Open-Source Process Platform, Empowering VLSI Innovation and Development
    Da Zhang, Zhejiang University/CTO, Zhejiang Chuangxin Integrated Process Platform, China
  • From Silicon to Design: Intelligent Measurement and Modeling for DTCO
    Yutao Ma, VP of R&D, Primarius Technologies. Ltd. China
  • Beyond Moore, Application-Driven IC Innovation International Cooperation Opportunities at NICE
    Alex Gu, National Innovation Center Par Excellence (NICE), China
  • 2.5D/3D IC: AI+EDA Reshaping the System-Design-Technology Co0ptimization (STCO) Paradigm for Advanced Packaging
    Alex Zhao, Founder/CEO Zhuhai SiChip Technology Co., Ltd., China
  • Modelling of semiconductor devices: the heart of innovation bridging academia and industrial applications
    Fujiang Lin, University of Science and Technology of China (USTC), China
Special OpenPDK Session progeam include the panel discussion: 
How to have a close loop for PDK, EDA, PDA and ICS simulation?


[conference] ELECTRONICS 2026 at KTU Kaunas

International Conference ELECTRONICS 2026
From SMT to Advanced Packaging – Manufacturing Meets Microinterconnects
KTU Kaunas, Lithuania
12–13 November 2026



Conference Vision : A joint platform connecting SMT engineers, advanced packaging researchers, reliability specialists, and industry to build a shared technical language, bridge research and manufacturing, and grow German-Baltic collaboration around heterogeneous integration and microinterconnects. Organized by Kaunas University of Technology, the conference serves as a platform for collaboration and discussion among representatives from academy, industry, and business.

Partners:
TUD IAFT (Dresden University of Technology, Institute of Electronic Packaging Technology)
IHP (IHP GmbH, Leibniz Institute for High Performance Microelectronics)
Industry Partners: FINETECH, TELTONIKA, etc.

Conference Program Online <https://eef.ktu.edu/events/electronics2026/>

Conference Organzation Committee:

General Chair
Prof., Dr. Mindaugas ŽILYS, KTU Kaunas

Executive Chair
Dr. Agata ROMANOVA, KTU Kaunas

Co-Chairs
Prof., Dr. Algimantas VALINEVIČIUS, KTU Kaunas
Prof., Dr. Darius ANDRIUKAITIS, KTU Kaunas
Prof., Dr. Dangirutis NAVIKAS, KTU Kaunas

Oct 8, 2026

Schematic to Silicon with Mini MOSbius

Zero To ASIC Course and Tiny Tapeout by Matt Venn
Schematic to Silicon with Mini MOSbius 
https://www.youtube.com/watch?v=NM5cLWYWqG0

MOSbius

Take Matt Venn TT course: 
https://www.zerotoasiccourse.com/
Buy a copy of Mini MOSbius, part of the TT IP library, here: 
https://store.tinytapeout.com/products/TTSKY25b-Development-Kit-p849160072
Check the configurator: 
https://github.com/mattvenn/mini-mosbius-configurator

Mini MOSbius is available on these chips
  • [OK] TTSKY25a - delivered July 2026 - available in the store
  • [OK] TTSKY25b - delivered August 2026 - available in the store
  • TTSKY26b - tapeout May 2026
  • TTSKY26c - tapeout September 2026
  • GF180 - will be taped out December 2026
and finally check out the original MOSBius: https://mosbius.org/ If you are interested to acquire MOSbius kits, review the express license and email Peter Kinget for kit availability before placing an order.


[poster] Active Cantilever with Dual Actuator

Bartosz Pruchnik1, Fabian Dietrich2, Richard Subianto2, Katerina Ivanova2, Athulya K. Muraleedharan Bindu2, Hans-Georg Pietscher2, Javad Basseri2, Muralikrishnan Brajesh Kaimal2, Władysław Kopczyński1, Wojciech Godlewski1, Dominik Badura1, Piotr Putek1, Krzysztof Kwoka1, Piotr Smagowski1, Andrew Yacoot3, Tomasz Piasecki1, Fangzhou Xia4, Ivo W. Rangelow2 
Active Cantilever with Dual Actuator
52nd International Micro and Nano Engineering Conference
Sep. 21-24, 2026 Interlaken (CH)
MEN2026 Poster S05A-T2-P-5

1. Wrocław University of Science and Technology,
2. nano analytik GmbH, 
3. National Physical Laboratory
4. University of Texas at Austin

Abstract: Atomic Force Microscopy (AFM) is often limited by the speed and bandwidth of three main components: the cantilever, the scanner, and the controller. Recent microelectromechanical systems (MEMS) have improved the performance of the cantilever and scanner by combining high-speed active cantilevers with low-latency scanners. In this work, we present a standardized active cantilever design. The system combines a large cantilever that acts as a Z-axis actuator with a smaller active cantilever sensor that provides a bandwidth greater than 400kHz. The smaller cantilever is integrated into the larger structure, creating a compact and highly responsive device. We introduce a new active cantilever architecture that uses two integrated electrothermal actuators. One actuator is used for cantilever operation, while the second provides vertical (Z-axis) movement for surface tracking. This design allows AFM measurements to be performed without the need for an external piezoelectric z-actuator.


Acknowledgements: This work was supported by the European Union's Horizon Europe research and innovation program under the Marie Sklodowska-Curie grant agreement No 101072775, and by the National Science Centre, Poland (grant No. 2021/41/B/ST7/03144).

Oct 6, 2026

[paper] Open Source EZ130 8T standard cell library

Oscar Castaneda, Lavinia Recchioni, Tobias Senti, Flurin Cahenzli, Marco Ferroni, Thorben Heekenjann, Robert Kenter, Stefan Odermatt, Daniel Richner, Gabriel Altendorfer, Davide Cannone, Miguel Correa, Ivan Herger, Lars Kroger, Nicolas Nanzer, Darja Nonaca, Christopher Reinwardt, Lukas Winklhofer, Enrico Zelioli, Yiheng Zhang, Yingxue Zhang, Domenic Keller, Seyed Hadi Mirfarshbafan, Zerun Jiang, Beat Muheim, Arianna Rubino, Jeremy Guichemerre, Frank K. Gurkaynak, and Christoph Studer
An Open-Source Standard-Cell Library for IHP 130 nm Developed by Students
arXiv:2609.29965v1 [cs.AR] 24 Sep 2026

1. Department of Information Technology and Electrical Engineering, ETH Zurich, Switzerland
* The open-source EZ130 8T standard-cell library is available at https://ez.ethz.ch

Abstract: Standard-cell libraries form the critical interface between transistor-level circuit design and automated digital design flows, yet their design and characterization are rarely covered in depth in digital VLSI courses. This paper presents VLSI 5, a graduate-level course at ETH Zurich in which students design, lay out, characterize, and integrate their own standard cells using IHP’s open-source 130 nm SG13G2 process design kit. In the first course offering, 19 students developed EZ130 8T, an open-source eight-track standard-cell library comprising 220 cells. We evaluate successive library versions using eight synthesis benchmarks, across which EZ130 8T achieves significant area reduction compared to the SG13G2 library at competitive timing. For a postlayout 8×8 matrix-vector multiplier, EZ130 8T reduces cell area by 35% and energy by 39% while maintaining virtually the same clock period. The library has already been adopted in other ETH Zurich VLSI courses, enabling the creation of chips entirely designed by students down to the transistor level.
FIG: a.) ETH Zurich course series on digital VLSI design. By teaching students to create a standard-cell library, the new VLSI 5 course closes the gap between transistor-level and HDL-level IC design;
b.) and c.) Layout of two example standard cells from the EZ130 8T library.

Aknowlegements: This work has received funding from the Swiss State Secretariat for Education, Research, and Innovation (SERI) under the SwissChips initiative. The authors thank Cadence for their support by providing licenses to design and characterize the EZ library. The authors also thank H. Pretl, T. Benz, and P. Sauter for their feedback on preliminary versions of the EZ library.

[paper] n-MOS pseudo-resistor nA current reference

Bruni, Italo, Mariane Petraglia, and Fabián Olivera
Area-efficient nanoampere current reference employing
a temperature-controlled n-MOS pseudo-resistor
AEU IJ EC (2026): 156642.
DOI: 10.1016/j.aeue.2026.156642

Abstract: This paper presents a CMOS current reference topology that avoids the use of large-area resistors by using a temperature-controlled pseudo-resistor. The proposed technique for achieving a reference current consists of applying proportional to absolute temperature (PTAT) and complementary to absolute temperature (CTAT) voltages to the drain and gate of an n-MOS EKV-based pseudo-resistor, respectively, thereby stabilizing its current against temperature variations. Two current reference design versions, namely D01 and D02, were implemented using a 180 nm technology. Extensive post-layout simulation results for design D01 show a typical reference current of 6.30 nA, an average temperature coefficient (TC) of 414 ppm/C (nominal 219 ppm/C) across a range from −40C to 120C, and a line regulation (LR) of 11.76 %/V. To improve LR, design D02 was developed, achieving a significantly optimized LR of 0.33 %/V while maintaining a typical current of 6.22 nA and an average TC of 401 ppm/C (nominal 191 ppm/C) over the same temperature range. The area-efficient technique enables compact silicon areas of 0.0018 mm2 and 0.0020 mm2 for D01 and D02, respectively.

FIG: Schematics of the CTAT voltage generator topologies: .a) 3T; b.) 6T
and its layout implementation of the current reference designs: c.) D01; d.) D02.

Acknowledgment: This work was supported in part by the Brazilian research funding agencies CNPq, FAPERJ, and Coordenação de Aperfeiçoamento de Pessoal de Nível Superior - Brasil (CAPES) Finance Code 001; by grant 307092/2025-9, funded by CNPq/MCTI/FNDCT N∘18/2024; and by grant E-26/204.222/2025 (SEI-260003/020616/2025), founded by FAPERJ JCNE .

Oct 4, 2026

[webinar] Colombia in OpenSilicon Age

IEEE SSCS: Colombia in OpenSilicon Age

  • Date: Thursday, October 8, 2026
  • Time: 1:00 PM – 2:30 PM (Colombia, GMT-5)
  • Platform: Cisco Webex
  • Access: Free/Open access

This open online event is the first IEEE SSCS Colombia session. It shares a vision for creating a strong microelectronics ecosystem in Colombia by bringing universities and industry together and helping develop highly skilled engineers. The event will review the current state of microelectronics in Colombia, discuss the future of integrated circuit (IC) design, present recent semiconductor policy initiatives, and explain the goals of the IEEE SSCS Colombia chapter. Speakers from Colombia and abroad will share their experience in IC design, open-source silicon, semiconductor education, and industry development. The session aims to encourage collaboration between academia, industry, and government to support the growth of the semiconductor sector in Colombia.

Featured Panelists and Keynote Speakers

  • Made in Colombia: Review of Colombian Microelectronics
    Javier Ardila, Onsilicon, UIS and President, IEEE SSCS
  • ColombiaThe Global Map of CI Design: Tools, Foundry and Methodology
    Hugo Hernández, Teradar, Boston, MA
  • OpenSilicon Opportunities
    Fernando Guarín IEEE Division 1
  • Bill for the promotion of the electronics and semiconductor industry
    Lorena García Founder, Colombian Network of Electronics and Semiconductors


Oct 1, 2026

IEEE LA & Caribbean Semi Summit

IEEE Latin America & the Caribbean
Semiconductor Summit

LACSS 2026 will bring together leaders from industry, government, academia, research institutions and the investment community to explore Latin America and the Caribbean’s role in the rapidly evolving global semiconductor ecosystem.

The two-day (Oct. 1-2) program will examine regional capabilities and opportunities across semiconductor design, talent development, advanced manufacturing, packaging and testing, supply chains, investment, public policy, research, critical technologies and international cooperation. The IEEE EDS/CASS MQ Semiconductors in Latin America will follow on the third day (Oct.3)

DAY 1 — Academia and Industry: Building Talent, Research and Innovation
Thursday, October 1st, 2026

Opening

08:30–09:00

Opening Ceremony

Ivan Armuelles, Chair IEEE LACSS 2026

Juan Pimiento, SENACYT, Panama

09:00–09:30

Overview of the Semiconductor Industry Today and Opportunities for Latin America through the IEEE Open Silicon Initiative
Fernando Guarin, IEEE Division I, Director - GlobalFoundries (Retired) / IBM (Retired), USA

Building Semiconductor Talent: National Experiences from Latin America

Moderator: Fernando Guarín, IEEE

09:30–09:50

Building Panama's National Semiconductor Talent Pipeline
Zoila De Castillo, C-TASC, Panama

09:50–10:10

Brazil´s Semiconductor Industry and Design House Ecosystem
Jacobus Swart, University of Campinas (UNICAMP) / INCT NAMITEC, Brazil

10:10–10:30

The Kutsari initiative and strategy for the future (virtual)
Edmundo Gutierrez, Kutsari (National Center for Semiconductor Design in Mexico), Mexico

10:30–11:00

Networking Coffee Break

Electronic Design Automation

Moderator: Ricardo Reis, UFRGS, Brazil

11:00–12:30

Panel: EDA Innovation and Latin America’s Role in the Global Semiconductor Ecosystem

Antonio de la Serna, Siemens EDA

Victor Grimblatt, Synopsys

Marcelo Da Silva, Cadence

12:30–14:00

Lunch

Talent Development and Industrial Capabilities

Moderator: Carlos Silva, PUCP, Peru

14:00–14:30

Talent: the keyword for the development of semiconductors

Ricardo Reis, Institute of Informatics, Federal University of Rio Grande do Sul (UFRGS), Brazil

14:30–15:45

Panel: Preparing Semiconductor Talent–Industry and University Experiences

Rodrigo Jaramillo, Circuify Semiconductors, Mexico

Alfredo Arnaud, Universidad Católica del Uruguay, Uruguay

Victor Grimblatt, Synopsys, Chile

Amílcar Josué Véliz Solares, Universidad Galileo, Guatemala

Javier Marte Michelen, Pontificia Universidad Católica Madre y Maestra, Dominican Republic

15:45–16:15

Networking Coffee Break

16:15–16:45

Assembly, Testing and Packaging: Opportunities for Latin America

Joel Molina, INAOE, Mexico

Day 1 Wrap-up

16:45–17:00

Day 1 Wrap-Up

Ivan Armuelles, Chair IEEE LACSS 2026

18:00–20:00

Welcome Reception (off-site)

La Casa - Ciudad del Saber


DAY 2 — Government and Industry: Policy, Investment and Regional Strategy
Friday, October 2nd, 2026

08:30–08:45

Day 2 Kick-off

Start of Day 2: summary of the previous day and agenda of the day

Global Policy, Cooperation and Investment

Moderator: Erik Heilman, IEEE-USA

08:45–09:30

Global Policy Perspectives for Semiconductor Development

Filipe Silva, Semiconductors Team Lead, OECD (virtual)

09:30–10:00

Pax Silica and the Global Semiconductor Ecosystem: Implications for Latin America and the Caribbean (virtual)

Akhil Ramesh, PAC Forum

10:00–10:30

Panama’s Semiconductor Strategy (TBC)

Victor Sanchez, C-TASC AIP, Panama

10:30–11:00

Networking Coffee Break

The Semiconductor Policy Playbook: Regulation, IP and Regional Development

Moderator: TBC

11:00–12:20

Panel: Policies and Partnerships for Latin American Semiconductor Ecosystems

Adão Villaverde, Brazil

Mayté Milián, Guatemala

Nestor García Romero, Mexico

Lorena Garcia, Colombia

12:20–12:30

IEEE Division I–Synopsys MoU Signing Ceremony: Semiconductor Workforce Development
Fernando Guarín, IEEE Division I

Victor Grimblatt, Synopsys

12:30–14:00

Lunch

Semiconductor Design, Manufacturing and Entrepreneurship

Moderator: Lorena Garcia, Alianza E, Colombia

14:00–15:30

Panel: Building Semiconductor and Hardware Businesses in Latin America

Rodrigo Jaramillo, Circuify Semiconductors, Mexico

Israel Mejia, QSM, Mexico (virtual)

Gabriel Ortiz, Pixart, Argentina

Alfonso Chacon, Rydev, Costa Rica

Javier Ardila, OnSilicon, Colombia (virtual)

15:30–16:00

Networking Coffee Break

Expanding Access to Semiconductor Design, Prototyping and Manufacturing

Moderator: Joel Molina, INAOE, Mexico

16:00–17:00

Panel: Expanding Access to Semiconductor Design, Prototyping and Manufacturing

Pat Deegan, Tiny Tapeout

Mitchell Hsing, InchFab

Alfonso Torres, INAOE (virtual)

FET 100

Moderator: Arokia Nathan, IEEE EDS, USA

17:00–17:45

FET100

Speakers: Fernando Guarin, Jacobus Swart.

17:45–18:00

Closing - LACSS 2027 announcement

Ivan Armuelles

Ricardo Reis

18:00

End of LACSS


DAY 3 — 2026 IEEE EDS/CASS MQ Semiconductors in Latin America
Saturday, October 3rd, 2026
Universidad De Panama Auditorio (Piso 3), Facultad De Informática, Electrónica Y Comunicación

IEEE EDS/CASS MQ Session: 
Exploring Innovation, Research, and Opportunities for a Semiconductor Future
in the Caribbean
8:00–8:15 Opening Ceremony — Registration and Welcome Remarks
8:15–8:45 Low Power Design for Sustainable Manufacturing in Agribusiness
Victor Grimblatt
8:45–9:15 Embedded Timing: A New Scaling Layer for Compute at System Scale
Rodrigo Calderon
9:15–9:45 Reliability Topics for Advanced Semiconductors
Fernando Guarin
9:45–10:15 Physical Design Automation: From Past to Future
Ricardo Reis
10:15–10:45 Networking Coffee Break
10:45–11:15 Brazil’s Semiconductor Industry and Design House Ecosystem
Jacobus Swart
11:15–11:45 Oxide Electronics
Arokia Nathan
11:45–12:15  Dielectrics Materials from Field Effect Transistors to In-Memory Computing
Durga Misra
12:15–13:30  Lunch