Oct 17, 2026
[paper] ACM3 Compact MOSFET Model
Oct 15, 2026
eSim 2.6 Release
Download eSim 2.6: https://esim.fossee.in/downloads
Explore eSim 2.6 Release Notes: https://github.com/FOSSEE/eSim/releases/tag/v2.6
What's New in eSim 2.6?
- Refreshed User Interface
- Enhanced Simulation and Waveform Analysis
- Improved HDL Workflows and Icarus Verilog Support
- Compatibility with Newer KiCad Versions
- IHP OpenPDK Support
- Native Windows Installer
- Reduced Installer Size
- OpenROAD Integration (Work in Progress)
- Wladek Grabinski,
- Steve Hoover,
- Indira Iyer Almeida
- OpenPDK IHP - Leibniz Institute for High-Performance Microelectronics
- The OpenROAD Project
Oct 13, 2026
[paper] Self-Heating Effects in 55-nm SiGe HBTs
1. USTHB, Bab Ezzouar, Algeria
Oct 12, 2026
[paper] BSIM4 CryoModel-4K
APCI Program: SBMicro Projects
| University | #Profs | #PhDs | #MSCs |
|---|---|---|---|
| CEFET-MG - Centro Federal de Educação Tecnológica de Minas Gerais | 8 | 0 | 3 |
| CEFET-RJ - Federal Center for Technological Education Celso Suckow da Fonseca | 2 | 1 | 0 |
| FEI - Centro Universitário da FEI | 2 | 0 | 3 |
| FURG - Universidade Federal do Rio Grande | 3 | 1 | 1 |
| IFSP - Instituto Federal de São Paulo | 5 | 0 | 0 |
| ITA - Instituto Tecnológico de Aeronáutica | 10 | 0 | 5 |
| PUCRS - Pontifícia Universidade Católica do Rio Grande Do Sul | 8 | 15 | 9 |
| UCPEL - Universidade Católica de Pelotas | 3 | 0 | 6 |
| UEA - Universidade do Estado do Amazonas | 1 | 0 | 0 |
| UERGS - State University of Rio Grande do Sul | 5 | 0 | 0 |
| UFABC - Federal University of ABC | 6 | 0 | 2 |
| UFAM - Universidade Federal de Manaus | 4 | 4 | 0 |
| UFBA - Universidade Federal da Bahia | 5 | 13 | 8 |
| UFC - Universidade Federal do Ceará | 3 | 5 | 3 |
| UFERSA - Mossoró | 1 | 0 | 4 |
| UFERSA - Pau dos Ferros | 5 | 1 | 3 |
| UFG - Federal University of Goiás | 8 | 1 | 0 |
| UFMG - Universidade Federal de Minas Gerais | 6 | 3 | 9 |
| UFPB - Universidade Federal da Paraíba | 1 | 1 | 2 |
| UFPEL - Universidade Federal de Pelotas | 13 | 13 | 2 |
| UFPR - Universidade Federal do Paraná | 7 | 2 | 5 |
| UFRGS - Universidade Federal do Rio Grande do Sul | 17 | 32 | 45 |
| UFRJ - Federal University of Rio de Janeiro | 6 | 2 | 4 |
| UFRN - Federal University of Rio Grande do Norte | 4 | 3 | 2 |
| UFS - Universidade Federal do Sergipe | 3 | 0 | 1 |
| UFSC - Universidade Federal de Santa Catarina | 11 | 12 | 11 |
| UFSM - Universidade Federal de Santa Maria | 8 | 0 | 5 |
| UFV - Universidade Federal de Viçosa | 2 | 3 | 3 |
| UNB - Universidade de Brasília | 9 | 3 | 9 |
| UNESP - Universidade Estadual Paulista | 4 | 0 | 1 |
| UNICAMP - Universidade Estadual de Campinas | 8 | 16 | 21 |
| UNIFEI - Universidade Federal de Itajubá | 7 | 2 | 3 |
| UNIFEI - Itabira | 3 | 0 | 3 |
| UNIPAMPA - Universidade Federal do Pampa | 4 | 0 | 2 |
| UNISANTOS - Universidade Católica de Santos | 1 | 0 | 0 |
| UNISINOS - Universidade do Vale do Rio dos Sinos | 3 | 0 | 3 |
| UNIVALI - Universidade do Vale do Itajaí | 3 | 0 | 3 |
| USP - Universidade de São Paulo | 8 | 1 | 12 |
| USP-EESC - Escola de Engenharia de São Carlos | 3 | 1 | 2 |
| UTFPR - Universidade Tecnológica Federal do Paraná | 1 | 0 | 0 |
Oct 11, 2026
[OpenSUSI] First Tyepout
Oct 10, 2026
[OpenPDK] GT2N
Libraries are composed of 3 process corners (under development), 2 nanosheet width (W) flavors, and 5 threshold voltage (VT) flavors. (In the order of decreasing VT, HVT > SVT > LVT > ULVT > ELVT)
The collaterals required for synthesis and PnR are (depending on the process corner and W/VT flavor):
LIB: GT2N/lib/tt/gt2_6t_w31_lvt_tt_0p7v25c.lib
LEF: GT2N/lef/tt/gt2_6t_w31_lvt.lef
Techlef: GT2N/techlib/gt2_tech.lef
ICT: GT2N/qrc/GT2.ict
QRCTech: GT2N/qrc/GT2_qrc.tch
ITF: GT2N/nxtgrd/GT2.itf
NXTGRD: GT2N/nxtgrd/GT2.nxtgrd
The thermal-calibrated GAAFET (3-stack nanosheet) model card is (depending on the process corner and W/VT flavor):
GT2N/device/tt/gt2_w31_lvt_tt.sp
[ref] D. Jang, P. Kumar, M. N. H. Shazon, S. J. Ram, A. Svizhenko, V. Moroz, A. Ceyhan, N. A. Radhakrishn, and A. Naeemi, "GT2N: An Open-Source 2nm Nanosheet PDK Enabling Multi-Width/VT Benchmarking" in IEEE International Symposium on Circuits and Systems (ISCAS) 2026
Oct 9, 2026
[ICTA2026 ] Special OpenPDK Session
ICTA 2026 Special OpenPDK Session Presenters
- SPICE/Verilog-A standard models and OpenPDK practice
Wladek Grabinski, GMC Consulting, Switzerland - Open-Source Ecosystem Updates and Semiconductor Design Development Programs in Japan
Jun-ichi Okamura, AIST Solutions, OpenSUSI, Japan - Open-Source EDA Meets Industrial IC Design
Ehrenfried Seebacher, ams-OSRAM AG, Austria - Building an Open-Source Process Platform, Empowering VLSI Innovation and Development
Da Zhang, Zhejiang University/CTO, Zhejiang Chuangxin Integrated Process Platform, China - From Silicon to Design: Intelligent Measurement and Modeling for DTCO
Yutao Ma, VP of R&D, Primarius Technologies. Ltd. China - Beyond Moore, Application-Driven IC Innovation International Cooperation Opportunities at NICE
Alex Gu, National Innovation Center Par Excellence (NICE), China - 2.5D/3D IC: AI+EDA Reshaping the System-Design-Technology Co0ptimization (STCO) Paradigm for Advanced Packaging
Alex Zhao, Founder/CEO Zhuhai SiChip Technology Co., Ltd., China - Modelling of semiconductor devices: the heart of innovation bridging academia and industrial applications
Fujiang Lin, University of Science and Technology of China (USTC), China
How to have a close loop for PDK, EDA, PDA and ICS simulation?
[conference] ELECTRONICS 2026 at KTU Kaunas
Partners:
TUD IAFT (Dresden University of Technology, Institute of Electronic Packaging Technology)
IHP (IHP GmbH, Leibniz Institute for High Performance Microelectronics)
Industry Partners: FINETECH, TELTONIKA, etc.
Prof., Dr. Mindaugas ŽILYS, KTU Kaunas
Dr. Agata ROMANOVA, KTU Kaunas
Prof., Dr. Algimantas VALINEVIČIUS, KTU KaunasProf., Dr. Darius ANDRIUKAITIS, KTU KaunasProf., Dr. Dangirutis NAVIKAS, KTU Kaunas
Oct 8, 2026
Schematic to Silicon with Mini MOSbius
https://www.zerotoasiccourse.com/
https://store.tinytapeout.com/products/TTSKY25b-Development-Kit-p849160072
https://github.com/mattvenn/mini-mosbius-configurator
- [OK] TTSKY25a - delivered July 2026 - available in the store
- [OK] TTSKY25b - delivered August 2026 - available in the store
- TTSKY26b - tapeout May 2026
- TTSKY26c - tapeout September 2026
- GF180 - will be taped out December 2026
[poster] Active Cantilever with Dual Actuator
1. Wrocław University of Science and Technology,
Oct 6, 2026
[paper] Open Source EZ130 8T standard cell library
b.) and c.) Layout of two example standard cells from the EZ130 8T library.
[paper] n-MOS pseudo-resistor nA current reference
Oct 4, 2026
[webinar] Colombia in OpenSilicon Age
IEEE SSCS: Colombia in OpenSilicon Age
- Date: Thursday, October 8, 2026
- Time: 1:00 PM – 2:30 PM (Colombia, GMT-5)
- Platform: Cisco Webex
- Access: Free/Open access
Featured Panelists and Keynote Speakers
- Made in Colombia: Review of Colombian Microelectronics
Javier Ardila, Onsilicon, UIS and President, IEEE SSCS - ColombiaThe Global Map of CI Design: Tools, Foundry and Methodology
Hugo Hernández, Teradar, Boston, MA - OpenSilicon Opportunities
Fernando Guarín IEEE Division 1 - Bill for the promotion of the electronics and semiconductor industry
Lorena García Founder, Colombian Network of Electronics and Semiconductors
Oct 1, 2026
IEEE LA & Caribbean Semi Summit
DAY 1 — Academia and Industry: Building Talent, Research and Innovation
Thursday, October 1st, 2026
Opening | ||
08:30–09:00 | Opening Ceremony Ivan Armuelles, Chair IEEE LACSS 2026 Juan Pimiento, SENACYT, Panama | |
09:00–09:30 | Overview of the Semiconductor Industry Today and Opportunities for Latin America through the IEEE Open Silicon Initiative | |
Building Semiconductor Talent: National Experiences from Latin America Moderator: Fernando Guarín, IEEE | ||
09:30–09:50 | Building Panama's National Semiconductor Talent Pipeline | |
09:50–10:10 | Brazil´s Semiconductor Industry and Design House Ecosystem | |
10:10–10:30 | The Kutsari initiative and strategy for the future (virtual) | |
10:30–11:00 | Networking Coffee Break | |
Electronic Design Automation Moderator: Ricardo Reis, UFRGS, Brazil | ||
11:00–12:30 | Panel: EDA Innovation and Latin America’s Role in the Global Semiconductor Ecosystem Antonio de la Serna, Siemens EDA Victor Grimblatt, Synopsys Marcelo Da Silva, Cadence | |
12:30–14:00 | Lunch | |
Talent Development and Industrial Capabilities Moderator: Carlos Silva, PUCP, Peru | ||
14:00–14:30 | Talent: the keyword for the development of semiconductors Ricardo Reis, Institute of Informatics, Federal University of Rio Grande do Sul (UFRGS), Brazil | |
14:30–15:45 | Panel: Preparing Semiconductor Talent–Industry and University Experiences Rodrigo Jaramillo, Circuify Semiconductors, Mexico Alfredo Arnaud, Universidad Católica del Uruguay, Uruguay Victor Grimblatt, Synopsys, Chile Amílcar Josué Véliz Solares, Universidad Galileo, Guatemala Javier Marte Michelen, Pontificia Universidad Católica Madre y Maestra, Dominican Republic | |
15:45–16:15 | Networking Coffee Break | |
16:15–16:45 | Assembly, Testing and Packaging: Opportunities for Latin America Joel Molina, INAOE, Mexico | |
Day 1 Wrap-up | ||
16:45–17:00 | Day 1 Wrap-Up Ivan Armuelles, Chair IEEE LACSS 2026 | |
18:00–20:00 | Welcome Reception (off-site) La Casa - Ciudad del Saber | |
DAY 2 — Government and Industry: Policy, Investment and Regional Strategy
Friday, October 2nd, 2026
08:30–08:45 | Day 2 Kick-off Start of Day 2: summary of the previous day and agenda of the day | |
Global Policy, Cooperation and Investment Moderator: Erik Heilman, IEEE-USA | ||
08:45–09:30 | Global Policy Perspectives for Semiconductor Development Filipe Silva, Semiconductors Team Lead, OECD (virtual) | |
09:30–10:00 | Pax Silica and the Global Semiconductor Ecosystem: Implications for Latin America and the Caribbean (virtual) Akhil Ramesh, PAC Forum | |
10:00–10:30 | Panama’s Semiconductor Strategy (TBC) Victor Sanchez, C-TASC AIP, Panama | |
10:30–11:00 | Networking Coffee Break | |
The Semiconductor Policy Playbook: Regulation, IP and Regional Development Moderator: TBC | ||
11:00–12:20 | Panel: Policies and Partnerships for Latin American Semiconductor Ecosystems Adão Villaverde, Brazil Mayté Milián, Guatemala Nestor García Romero, Mexico Lorena Garcia, Colombia | |
12:20–12:30 | IEEE Division I–Synopsys MoU Signing Ceremony: Semiconductor Workforce Development Victor Grimblatt, Synopsys | |
12:30–14:00 | Lunch | |
Semiconductor Design, Manufacturing and Entrepreneurship Moderator: Lorena Garcia, Alianza E, Colombia | ||
14:00–15:30 | Panel: Building Semiconductor and Hardware Businesses in Latin America Rodrigo Jaramillo, Circuify Semiconductors, Mexico Israel Mejia, QSM, Mexico (virtual) Gabriel Ortiz, Pixart, Argentina Alfonso Chacon, Rydev, Costa Rica Javier Ardila, OnSilicon, Colombia (virtual) | |
15:30–16:00 | Networking Coffee Break | |
Expanding Access to Semiconductor Design, Prototyping and Manufacturing Moderator: Joel Molina, INAOE, Mexico | ||
16:00–17:00 | Panel: Expanding Access to Semiconductor Design, Prototyping and Manufacturing Pat Deegan, Tiny Tapeout Mitchell Hsing, InchFab Alfonso Torres, INAOE (virtual) | |
FET 100 Moderator: Arokia Nathan, IEEE EDS, USA | ||
17:00–17:45 | FET100 Speakers: Fernando Guarin, Jacobus Swart. | |
17:45–18:00 | Closing - LACSS 2027 announcement Ivan Armuelles Ricardo Reis | |
18:00 | End of LACSS | |
DAY 3 — 2026 IEEE EDS/CASS MQ Semiconductors in Latin America
Saturday, October 3rd, 2026
IEEE EDS/CASS MQ Session: Exploring Innovation, Research, and Opportunities for a Semiconductor Future in the Caribbean |
|
|---|---|
| 8:00–8:15 | Opening Ceremony — Registration and Welcome Remarks |
| 8:15–8:45 | Low Power Design for Sustainable Manufacturing in Agribusiness Victor Grimblatt |
| 8:45–9:15 | Embedded Timing: A New Scaling Layer for Compute at System Scale Rodrigo Calderon |
| 9:15–9:45 | Reliability Topics for Advanced Semiconductors Fernando Guarin |
| 9:45–10:15 | Physical Design Automation: From Past to Future Ricardo Reis |
| 10:15–10:45 | Networking Coffee Break |
| 10:45–11:15 | Brazil’s Semiconductor Industry and Design House Ecosystem Jacobus Swart |
| 11:15–11:45 | Oxide Electronics Arokia Nathan |
| 11:45–12:15 | Dielectrics Materials from Field Effect Transistors to In-Memory Computing Durga Misra |
| 12:15–13:30 | Lunch |










