https://ihp-open-adk-docs.readthedocs.io/en/latest/index.html● Quick start ADK commands
https://ihp-open-adk-docs.readthedocs.io/en/latest/quickstart.html
https://ihp-open-adk-docs.readthedocs.io/en/latest/index.html● Quick start ADK commands
https://ihp-open-adk-docs.readthedocs.io/en/latest/quickstart.html
Prof. Dr. K. Ramnarayan, Pro Chancellor, Sikkim Manipal University (SMU)Dr. Gopalakrishna Prabhu, Vice Chancellor, Sikkim Manipal University (SMU)
Prof. Dr. Muralidhar V. Pai, Pro Vice Chancellor, Sikkim Manipal University (SMU)Prof. Dr. Karma Sonam Sherpa, Registrar, Sikkim Manipal University (SMU)Prof. Dr. Savitha G. Kini, Director, Sikkim Manipal Institute of Technology (SMIT)
Dr. Kalpana Sharma, Director, Directorate of Research, SMUDr. Sangeeta Jha, Associate Director (Academics), SMITDr. Chandrashekhar Bhuiyan, Associate Director (Research), SMITDr. Pankaj Chettri, Associate Director (SA), SMIT
Dr. Bikash Sharma, Head of the Department & Associate Professor, Dept. of Electronics & Communication Engg., SMITDr. Arpan Deyasi, Associate Professor Department of ECE RCC Institute of Information Technology KolkataDr. Angsuman Sarkar, Professor & Head, ECE Dept., Kalyani Govt. Engg. College, Kalyani, West BengalDr. Manash Chanda, Principal, Meghnad Saha Inst. of Technology, Kolkata
The upcoming MOS-AK event is organized as the 10th China MOS-AK International Conference on Device Modeling and will be held at SEU (Wuxi), China, on August 27-28, 2026. The meeting continues MOS-AK's long-running mission of enabling R&D exchange in advanced electronic and photonic device modeling. The invited participants will cover two groups. The first follows the traditional MOS-AK focus on serving enterprise manufacturers and upstream/downstream model users by discussing practical model-related problems. The second initiative is to train students and professionals in open‑source (FOSS) CAD/EDA tools for integrated circuit (IC) design support.
With aggressive CMOS scaling and diverse emerging device technologies, accurate analytical and compact models have become essential for RF-THz, power, optical, FDSOI/SiGe HBT, 3D heterogeneous integration including OpenPDKs. This workshop offers a focused forum to present and discuss advances in device characterization, compact modeling, simulation, and validation across Si, GaN, IIIV, power, nanoscale, and emerging devices, reinforcing MOS‑AK’s role as a bridge between process technology manufacturing towards advanced circuit and system level designs.
Companies are welcome to showcase their latest tools, equipment, and modeling-related technologies, supporting practical exchange across the compact-modeling industry supply chain.
Wei HongSoutheast University, China | Yue HaoXidian University, China | Hanming WuZhejiang University, China |
We gratefully acknowledge the following sponsors and supporting organizations:
Registration Fees | WeChat Registration Entry | |
Registration deadline
| Registration QR code: scan with WeChat | Mini Program code: scan with WeChat |
Advisory CommitteeFujiang Lin (USTC) | Technical Program CommitteeYuehang Xu (UESTC) | General ChairsWeifeng Sun (SEU) |
International R&D AdviserMin Zhang (XMOD) | Finance ChairChao Zhu (SEU) | Workshop SecretarySonny Lou (APSTA) |
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