[paper] Compact IV Model for DG MoS2 FETs

Ahmed Mounir, Francois Lime, Alexander Kloes, Alexandros Provias, Theresia Knobloch, 

K. P. O’Brien, Tibor Grasser and Benjamin Iniguez

Compact I–V Model for Double-Gated MoS2 FETs Including Short-Channel Effects

IEEE TED, Vol. 72, No. 12, Dec 2025

DOI: 10.1109/TED.2025.3622099

Rovira i Virgili University, Tarragona (SP)
THM University of Applied Sciences, Giessen (D)
Technical University of Vienna (A)
Intel Foundry Technology Research, Hillsboro (US)

Abstract: This article presents a physics-based analytical compact model for double-gated molybdenum disulfide (MoS2) field effect transistors (FETs), incorporating key physical and short-channel effects (SCEs), such as mobility degradation and velocity saturation. The model is developed from a unified charge control model by evaluating the charge density within the 2D MoS2 layer, represented using the Lambert W function, which provides an analytical expression valid and continuous from the subthreshold to the above threshold regime. The drain current is then derived from this unified charge control model, and as a function of closed-form equations for the charge densities at the source and drain ends of the channel. Despite its simplicity, the model shows excellent agreement with experimental data for channel lengths down to 60nm, making it a powerful tool for accurately predicting the performance of downscaled devices. By including SCEs, this work extends previous modeling efforts and provides a more comprehensive framework for the simulation and optimization of 2D material-based FETs in circuit design.

FIG: Cross-sectional view of the double-gated MoS2 FET, showing the top gate oxide stack made of Al2O3 and HfO2, with the local back gate oxide consisting of HfO2. Validation of the compact model against experimental data for double-gate MoS2 FET L = 60nm (bottom line)

Acknowledgements: This work was supported in part by European Union Bayesian inference with flexible electronics for biomedical applications (BAYFLEX) under Contract 101099555 and in part by the Ministry of Science of Spain under Contract PID2021122399OB-I00

[paper] TMD FETs

Ahmed Mounir^a, Benjamin Iñiguez^a, François Lime^a, Alexander Kloes^b

Theresia Knobloch^c, Tibor Grasser^c

Compact I-V model for back-gated and double-gated TMD FETs

Solid-State Electronics (2023): 108702

DOI: 10.1016/j.sse.2023.108702

a Rovira I Virgili University, Tarragona, Spain
b University of Applied Sciences, Giessen, Germany
c TU Wien, Vienna, Austria

Abstract: A physics-based analytical DC compact model for double and single gate TMD FETs is presented. The model is developed by calculating the charge density inside the 2D layer which is expressed in terms of the Lambert W function that recently has become the standard in SPICE simulators. The current is then calculated in terms of the charge densities at the drain and source ends of the channel. We validate our model against measurement data for different device structures. A superlinear current increase above certain gate voltage has been observed in some MoS2 FET devices, where we present a new mobility model to account for the observed phenomena. Despite the simplicity of the model, it shows very good agreement with the experimental data.

Fig : 2D schematic structure for 2D TMD FETs: (a) a double gated monolayer MoS2 FET. 

(b) a double gated monolayer WSe2 FET. (c)  single back-gated multilayer MoS2 FET. 

(d) single back-gated monolayer FET.

[book] Device Circuit Co-Design Issues in FETs

Device Circuit Co-Design Issues in FETs

Editors: Shubham Tayal, Billel Smaani, Shiromani Balmukund Rahi, Samir Labiod, Zeinab Ramezani

ISBN 9781032414256280 Pages 269 B/W Illustrations 

August 22, 2023 by CRC Press

Description

This book provides an overview of emerging semiconductor devices and their applications in electronic circuits, which form the foundation of electronic devices. Device Circuit Co-Design Issues in FETs provides readers with a better understanding of the ever-growing field of low-power electronic devices and their applications in the wireless, biosensing, and circuit domains. The book brings researchers and engineers from various disciplines of the VLSI domain together to tackle the emerging challenges in the field of engineering and applications of advanced low-power devices in an effort to improve the performance of these technologies. The chapters examine the challenges and scope of FinFET device circuits, 3D FETs, and advanced FET for circuit applications. The book also discusses low-power memory design, neuromorphic computing, and issues related to thermal reliability. The authors provide a good understanding of device physics and circuits, and discuss transistors based on the new channel/dielectric materials and device architectures to achieve low-power dissipation and ultra-high switching speeds to fulfill the requirements of the semiconductor industry. This book is intended for students, researchers, and professionals in the field of semiconductor devices and nanodevices, as well as those working on device-circuit co-design issues.

Table of Contents

1. Modeling for CMOS Circuit Design. 

2. Conventional CMOS Circuit Design. 

3. Compact modeling of junctionless Gate-All-Around MOSFET for circuit simulation. 

4. Novel Gate-Overlap Tunnel FETs for Superior Analog, Digital, and Ternary Logic Circuit Applications. 

5. Phase Transition Materials for Low Power Electronics. 

6. Impact of total ionizing dose effect on SOI-FinFET with spacer engineering. 

7. Scope and Challenges with Nanosheet FET based Circuit design. 

8. Scope with TFET based Circuit and System Design. 

9. An overview of FinFET based Capacitorless 1T-DRAM. 

10. Literature Review of the SRAM Circuits Design Challenges. 

11.Challenges and Future Scope of Gate-All-Around (GAA) Transistors: 

Physical Insights of Device-Circuit Interactions.