[paper] IGBT Compact Modeling

Compact Modeling of IGBT Charging/Discharging for Accurate Switching Prediction

Y. Miyaoku¹, A. Tone¹, K. Matsuura¹, M. Miura-Mattausch¹ (Fellow, IEEE),

H. J. Mattausch¹ (Senior Member, IEEE), and D. Ikoma²

IEEE J-EDS, vol. 8, pp. 1373-1380, 2020

doi: 10.1109/JEDS.2020.3008919

1 Graduate School of Advanced Sciences of Matter, Hiroshima University, Higashi-Hiroshima 739-8527, Japan
2 Sensor and Semiconductor Development, Denso Corporation, Aichi 448-8661, Japan

ABSTRACT The trench-type IGBT is one of the major devices developed for very high-voltage applications, and has been widely used for the motor control of EVs as well as for power-supply systems. In the reported investigation, the accurate prediction of the power dissipation of IGBT circuits has been analyzed. The main focus is given on the carrier dynamics within the IGBTs during the switching-off phase. It is demonstrated that discharging and charging at the IGBT’s gate-bottom-overlap region, where electron discharging is followed by hole charging, has an important influence on the switching performance. In particular, the comparison of long-base and short-base IGBTs reveals, that a quicker formation of the neutral region within the resistive base region, as occurring in the long-base IGBT, leads to lower gatebottom-overlap capacitance, thus realizing faster electron discharging and hole charging of this overlap region.

FIG: IGBT structures with nMOSFET + pnp BJT part (a. and b.) and nMOSFET-only structure (c.). The X–Y line is through the middle of the bottom-gate oxide and the A–B line is directly underneath the bottom-gate oxide.

Received 14 May 2020; revised 2 July 2020; accepted 8 July 2020. Date of publication 13 July 2020; date of current version 8 December 2020. The review of this article was arranged by Editor M. Mierzwinski. Digital Object Identifier 10.1109/JEDS.2020.3008919

[paper] Single Gate Extended Source Tunnel FET

Jagritee Talukdar^a, Gopal Rawat^b, Bijit Choudhuri^a, Kunal Singh^c, Kavicharan Mummaneni^a

Device Physics Based Analytical Modeling for Electrical Characteristics of Single Gate Extended Source Tunnel FET (SG-ESTFET)

Superlattices and Microstructures (2020): 106725

DOI: 10.1016/j.spmi.2020.106725

^aDECE, NIT Silchar, Assam, India
^bDECE, NIT Hamirpur, Himachal Pradesh, India
^cDECE, NIT Jamshedpur, Jharkhand, India

Abstract: In this paper, a 2D analytical model for Single Gate Extended Source Tunnel FET has been developed which is based on the solution of Poisson’s equation simplified using parabolic approximation method. Different electrical characteristics of device physics such as surface potential, drain current, lateral, and vertical electric field of SG-ESTFET are studied incorporating various parameters like mole fraction of SiGe layer, gate dielectric constants, etc. Furthermore, in modeling and simulation, the depletion region of the drain side is included considering the effect of the fringing field. The comercial TCAD device simulator has been used to verify the accuracy and validity of the proposed analytical model for various electrical parameters such as gate to source voltage, mole fraction, and gate dielectric constants. The validity of the proposed model is confirmed by observing a decent agreement between modeling and simulation. The proposed compact model delivers quick and accurate values of various performance parameters.

Fig: 2D schematic device structure of SG-ESTFET

[paper] Compact Modeling of IGBT

Y. Miyaoku, A. Tone, K. Matsuura, M. Miura-Mattausch, H. J. Mattausch, and *D. Ikoma

Compact Modeling of IGBT Charging/Discharging

for Accurate Switching Prediction

IEEE J-EDS,  DOI:10.1109/jeds.2020.3008919 

Graduate School of Advanced Sciences of Matter, Hiroshima University, Japan

*Denso Corp., Aichi, Japan

Abstract: The trench-type IGBT is one of the major devices developed for very high-voltage applications, and has been widely used for the motor control of EVs as well as for power-supply systems. In the reported investigation, the accurate prediction of the power dissipation of IGBT circuits has been analyzed. The main focus is given on the carrier dynamics within the IGBTs during the switching-off phase. It is demonstrated that discharging and charging at the IGBT’s gate-bottom-overlap region, where electron discharging is followed by hole charging, has an important influence on the switching performance. In particular, the comparison of long-base and short-base IGBTs reveals, that a quicker formation of the neutral region within the resistive base region, as occurring in the long-base IGBT, leads to lower gatebottom-overlap capacitance, thus realizing faster electron discharging and hole charging of this overlap region.

Fig: Studied IGBT structure with indicated current flows