[paper] 12nm FinFETs from 292K to 10mK

D. Lee, J. Lee, L. Jin, R. Rangaraj, L. Shao and J. S. Walling

12nm FinFETs from 292K to 10mK:

Characterization and a Temperature-Continuous Compact Model for Qubit Control

Preprint arXiv:2609.11963 (19 Aug 2026)

1 Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, USA

Abstract: We report cryogenic characterization and compact modeling of GlobalFoundries (GF) 12LP regular-voltagethreshold (RVT) n- and p-FinFETs, measured from 292K to 10mK. Both devices retain sub-Kelvin gate control without carrier freeze-out, with the n-type device exhibiting an intrinsic subthreshold slope (SS) floor of 24.8 mV/dec. To bypass high on-chip series routing resistance that confounds peak-gm extraction, we adopt a fixed-current (3.26 μA/μm) methodology. These low current metrics inform a continuous 1.36K to 292K compact model using dynamic parameter injection, preserving room temperature process development kit (PDK) qualification.

Fig: Measured transfer characteristics at |VDS,ext| = 0.8V, shaded dark to light with increasing temperature. Drain current is normalized to gate width, so the dotted line marks the constant-current threshold criterion at ICC = 1μA/μm.

Acknowledgment: The 12nm finFET IC fabrication was provided by GlobalFoundries as part of their University Partnership Program.

[conf] International Conference on Microelectronics

ICM 2026 International Conference on Microelectronics

<https://www.ieee-icm.org/>

7-10 December 2026

Borneo Cultures Museum, Sarawak, Malaysia

The IEEE International Conference on Microelectronics has already been held numerous times in different countries across the MiddleEast, North Africa, and Asia for the past 37 years.

The 38th edition of the conference will take place in Borneo Cultures Museum Sarawak, Malaysia. IEEE-ICM 2026 will include oral, poster sessions and tutorials given by experts on state-of-the-art topics. The regular technical program will run for three days. In addition, tutorial sessions will be held on the first day of the conference.

The theme of ICM 2026, “Innovations in Circuits and Systems for a Sustainable Future,” has been selected in recognition of the unprecedented global challenges related to climate change, healthcare, and energy. Continued innovation and the development of new technological solutions are considered essential for building a more sustainable future. The conference is intended to provide a unique platform for the exchange of ideas and the exploration of new avenues for research and collaboration that may contribute to this objective.

Sincere appreciation is expressed to the keynote speakers, session chairs, reviewers, and volunteers, whose dedicated efforts have contributed significantly to the organization and success of the conference. Gratitude is also extended to the sponsors and exhibitors for their generous support, which has made the event possible.

It is hoped that the conference will be both informative and enjoyable, offering numerous opportunities for networking, learning, and collaboration. On behalf of the organizing committee, best wishes are conveyed for a productive and rewarding experience at ICM 2026.

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[webinar] SPICE Device Modeling and Circuit Simulation

Mansun Chan

Circuit Simulation and Device Modeling: From SPICE Fundamentals to Industrial BSIM Models

DOI 10.17023/9439-t168

This tutorial introduces the fundamentals of circuit simulation and compact device modelling for integrated circuit design. Starting from SPICE-based circuit simulation #it explains the role of device models #the requirements for DC #transient #and AC analyses #and the trade-offs between physical accuracy and simulation efficiency. The development of industrial compact models is illustrated using BSIM3 as an example #providing insight into how practical device models are constructed and used in modern circuit design [EDS Education Committee]

More EDS Education Resources like this:

SPICE Models: Problems and Opportunities

Compact Modeling of MOSFETs: Overview and Challenges

#simulation #modeling #circuit #SPICE #bsim #mosfet #transistor #compact #tcad #jacobian #conductance #voltage

[webinar] Silicon for AI

Silicon for AI: Breaking Barriers in IC Fabrication through Open Silicon

[IEEE CAS Webinar]

Join us for a CASS-supported webinar exploring Integrated-Circuit Fabrication through the IEEE DI Open Silicon Initiative

Date: 21 September 2026 at 10:00 AM ET | 7:00 AM PT

Don't miss this opportunity to learn more about efforts to break down barriers to silicon access and support innovation in integrated-circuit design and fabrication.

Register online or using the QR code in the graphic!

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[mos-ak] //ICMC 2027// Conference committees: Call for Participation

Join the ICMC 2027 Organizing Team! The International Compact Modeling Conference 2026 was a great success. ICMC focuses uniquely on compact device models, their development and broad application in the semiconductor industry. We’re excited to announce that preparations are already underway for the next edition on July 15–16, 2027 in San Jose, California. For ICMC information and Photo Gallery, go to https://si2-icmc.org. We are currently seeking enthusiastic volunteers to join the ICMC 2027 conference committees. If you're interested in helping shape next year’s event, please complete this interest survey: https://survey.zohopublic.com/zs/edC25U Summary of Committee Responsibilities: Organizing Committee: Oversees the overall planning and execution of the yearly edition of the ICMC Conference. Coordinates among sub-committees and maintains regular communication to track progress and confirm major decisions. Technical Program Committee: Defines the major topics and focus areas and develops the technical program for the conference, creates the call for papers, and defines, organizes and oversees the paper review procedures. Publicity Committee: Develops and implements the marketing plan to promote the conference and increase its visibility.

About Si2 The Silicon Integration Initiative Inc. is a global, not-for-profit membership organization with approximately 70 corporate members who collaborate on trusted standards and shared solutions that reduce development costs and increase design productivity for semiconductor foundries, fabless design companies, and EDA software providers. Learn more at https://si2.org/.