[mos-ak] //ICMC 2027// Conference committees: Call for Participation

Join the ICMC 2027 Organizing Team! The International Compact Modeling Conference 2026 was a great success. ICMC focuses uniquely on compact device models, their development and broad application in the semiconductor industry. We’re excited to announce that preparations are already underway for the next edition on July 15–16, 2027 in San Jose, California. For ICMC information and Photo Gallery, go to https://si2-icmc.org. We are currently seeking enthusiastic volunteers to join the ICMC 2027 conference committees. If you're interested in helping shape next year’s event, please complete this interest survey: https://survey.zohopublic.com/zs/edC25U Summary of Committee Responsibilities: Organizing Committee: Oversees the overall planning and execution of the yearly edition of the ICMC Conference. Coordinates among sub-committees and maintains regular communication to track progress and confirm major decisions. Technical Program Committee: Defines the major topics and focus areas and develops the technical program for the conference, creates the call for papers, and defines, organizes and oversees the paper review procedures. Publicity Committee: Develops and implements the marketing plan to promote the conference and increase its visibility.

About Si2 The Silicon Integration Initiative Inc. is a global, not-for-profit membership organization with approximately 70 corporate members who collaborate on trusted standards and shared solutions that reduce development costs and increase design productivity for semiconductor foundries, fabless design companies, and EDA software providers. Learn more at https://si2.org/.