[PhD Thesis] III-V MOS-HEMTs for 100-340GHz Communications Systems

UNIVERSITY OF CALIFORNIA

Santa Barbara

III-V In_xGa_1-xAs / InP MOS-HEMTs for 100-340GHz Communications Systems

A dissertation for PhD degree in Electrical and Computer Engineering

by Brian David Markman

Abstract: This work summarizes the efforts made to extend the current gain cutoff frequency of InP based FET technologies beyond 1THz. Incorporation of a metal-oxide-semiconductor field effect transistor (MOSFET) at the intrinsic Gate Insulator-Channel interface of a standard high electron mobility transistor (HEMT) has enabled increased g_m,i by increasing the gate insulator capacitance density for a given gate current leakage density. Reduction of RS,TLM from 110 Ω.μm to 75Ω.μm and Ron(0) from 160Ω.μm to 120Ω.μm was achieved by removing/thinning the wide bandgap modulation doped link regions beneath the highly doped contact layers. Process repeatability was improved by developing a gate metal first process and D_it was improved by inclusion of a post-metal H₂ anneal. In_xGa_1-xAs / InAs composite quantum wells clad with both InP and In_xAl_1-xAs were developed for high charge density and low sheet resistance to minimize source resistance. 

Figure a) InP-based HEMT b) III-V DC optimized MOSFET c) proposed InP-based MOS-HEMT

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[Citation] Markman, B. D. (2020). III-V In_xGa_1-xAs / InP MOS-HEMTs for 100-340GHz Communications Systems. UC Santa Barbara. ProQuest ID: Markman_ucsb_0035D_14853. Merritt ID: ark:/13030/m5v4681j. Retrieved from https://escholarship.org/uc/item/6st812pb

[Survey] Power Amplifiers Performance 2000-Present

Fifth web release on 2020/10/15: "PA_Survey_v5". This version-5 dataset includes PAs/transmitters from 500MHz to 1.5 THz in Bulk/SOI CMOS, SiGe, LDMOS, InP, GaN, GaAs technologies. The dataset contains total 3207 data points with over 1200 data points for CMOS, SiGe PAs and over 1500 data points for GaN, GaAs, InP PAs.

We have added sub-THz/THz power/signal generation circuits from 15GHz to 1.5THz, including PAs, fundamenal/harmonic oscillators, and frequency multipliers, to support the emerging research on beyond-5G/6G applications.

The file "PA_Survey_v5" is the version-5 dataset that includes ALL the reported PA/transmitter data since 2000 over frequency and various technologies. It also includes summary plots on CW Psat vs. Carrier Frequency for different technologies, peak PAE vs. CW Psat at different frequencies, and average PAE vs. average Pout for high-order complex modulations.

What is new in version-5 release beyond the version-4 release? 500MHz to 1.5 THz Power Amplifier designs and sub-THz/THz power/signal generation circuits published between 02/2020 and 10/2020.

• Cite this PA survey: Hua Wang, Tzu-Yuan Huang, Naga Sasikanth Mannem, Jeongseok Lee, Edgar Garay, David Munzer, Edward Liu, Yuqi Liu, Bryan Lin, Mohamed Eleraky, Sensen Li, Fei Wang, Amr S. Ahmed, Christopher Snyder, Sanghoon Lee, Huy Thong Nguyen, and Michael Edward Duffy Smith, "Power Amplifiers Performance Survey 2000-Present," [Online]. Available: https://gems.ece.gatech.edu/PA_survey.html
• Acknowledgement: We would like to sincerely thank many of our friends and colleagues for their helpful suggestions and insightful discussions.
• Feedback and Suggestions: We welcome your feedback and suggestions, including the ways to interpret and present the data. In addition, although we try to be as inclusive as possible when collecting these published data, it is certainly possible that we may miss some representative PA designs. Please feel free to send us feedback, suggestions, or missing PA papers.
• Contact: Please contact us through poweramplifiers.survey at gmail dot com. Do not use my gatech email address, since I may very likely miss your email.
• Source for this data collection: We focus on peer-reviewed and publicly accessible publications that are typical forums for PAs, including IEEE ISSCC, JSSC, RFIC, VLSI, CICC, ESSCIRC, IMS, T-MTT, TCAS, BCTM/CSICS (BCICTS in the future), APMC, EuMC, and MWCL. We also focus on public product datasheets on PAs/transmitters.

 

 

[paper] Device Scaling for 3-nm Node and Beyond

Opportunities in Device Scaling for 3-nm Node and Beyond:

FinFET Versus GAA-FET Versus UFET

U. K. Das and T. K. Bhattacharyya

in IEEE TED, vol. 67, no. 6, pp. 2633-2638, June 2020, 

doi: 10.1109/TED.2020.2987139

Abstract: The performances of FinFET, gate-all-around (GAA) nanowire/nanosheet, and U-shaped FETs (UFETs) are studied targeting the 3-nm node (N3) and beyond CMOS dimensions. To accommodate a contacted gate pitch (CGP) of 32 nm and below, the gate length is scaled down to 14 nm and beyond. While going from 5-nm node (N5) to 3-nm node (N3) dimensions, the GAA-lateral nanosheet (LNS) shows 8% reduction in the effective drain current (I_eff) due to an enormous rise in short channel effects, such as subthreshold slope (SS) and drain-induced barrier lowering (DIBL). On the other hand, 5-nm diameter-based lateral nanowire shows an 80% rise in I_eff. Therefore, to enable future devices, we explored electrostatics and I_eff in FinFET, GAA-FET, and UFET architectures at a scaled dimension. The performances of both Si- and SiGe-based transistors are compared using an advanced TCAD device simulator.

Fig: Transistor architectures for future technologies. (a) FinFET device

(in {001} substrate plane, and sidewalls are in {110} planes) with crosssectional

fin channel (5 nm thin). (b) Fin is changed into a four-stacked

GAA-LNWs. (c) GAA- LNS having 20-nm width (W). (d) UFET structure.

Acknowledgment: The authors would like to thank Dr. Bidhan Pramanik, IIT Goa, India, Dr. KB Jinesh, IIST, Trivandrum, India, and Dr. Geert Eneman, IMEC, Leuven, Belgium, for their valuable technical support.

URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9078841&isnumber=9098120